Methods for cutting smooth reflective surfaces

• US 9,061,358 B2
• Filed: 09/11/2012
• Issued: 06/23/2015
• Est. Priority Date: 05/29/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Tan, Napthaneal Y., Browning, Lucy Elizabeth
• Primary Examiner(s): COZART, JERMIE E
• Application Number:
  US13/610,835
• Publication Number:
  US 20130322976A1
• Time in Patent Office: 1,015 Days
• Field of Search: 294/58, 295/57, 29/900.1, 29/905, 29/906, 409/131, 409/132, 409/138, 407/113, 407/114, 407/117
• US Class Current: 1/1
• CPC Class Codes: B23C 2220/04 Milling with the axis of the cutter inclined to the surface being machined
• CPC Class Codes: B23C 2220/16 Chamferring
• CPC Class Codes: B23C 2220/20 Deburring
• CPC Class Codes: B23C 2220/28 Finishing
• CPC Class Codes: B23C 2220/48 Methods of milling not otherwise provided for
• CPC Class Codes: B23C 2226/31 Diamond
• CPC Class Codes: B23C 2226/315 polycrystalline [PCD]
• CPC Class Codes: B23C 5/00 Milling-cutters for cutting gear-teeth B23F21/12
• CPC Class Codes: B23C 5/1081 with permanently fixed cutting inserts B23C5/1018 and B23C5/1063 take precedence
• CPC Class Codes: B23P 11/00 Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for connecting sheet metal or metal tubes, rods or profiles B21D39/00; riveting B21J; soldering, unsoldering, welding B23K; hand tools for connecting wire or strip B25B25/00; connecting metal parts by adhesives F16B11/00
• CPC Class Codes: B23P 17/00 Metal-working operations, not covered by a single other subclass or another group in this subclass
• CPC Class Codes: B23P 17/02 Single metal-working processes; Machines or apparatus therefor
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: C25D 11/022 Anodisation on selected surface areas
• CPC Class Codes: C25D 11/12 Anodising more than once, e.g. in different baths
• CPC Class Codes: C25D 11/246 for sealing layers
• CPC Class Codes: C25D 11/34 of metals or alloys not provided for in groups C25D11/04 - C25D11/32
• CPC Class Codes: G03F 1/38 Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H04M 1/0249 : Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0254 : comprising one or a plurality of mechanically detachable modules
• CPC Class Codes: H04M 1/11 : Supports for sets, e.g. incorporating armrests
• CPC Class Codes: H05K 13/00 : Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 5/02 : Details
• CPC Class Codes: H05K 5/0217 : Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0243 : for decorative purposes
• CPC Class Codes: H05K 5/0247 : Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 5/03 : Covers
• CPC Class Codes: H05K 5/04 : Metal casings
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1064 : Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 29/47 : Burnishing
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 407/1906 : including holder [i.e., head] having seat for inserted tool
• CPC Class Codes: Y10T 409/300896 : with sensing of numerical information and regulation without mechanical connection between sensing means and regulated means [i.e., numerical control]
• CPC Class Codes: Y10T 409/303752 : Process
• CPC Class Codes: Y10T 409/30952 : with cutter holder

Abstract

The embodiments described herein relate to methods, systems, and structures for cutting a part to form a highly reflective and smooth surface thereon. In some embodiments, the part includes substantially horizontal and vertical surfaces with edges and corners. In described embodiments, a diamond cutter is used to cut a surface of the part during a milling operation where the diamond cutter contacts the part a number of times with each rotation of the spindle of a milling machine. The diamond cutter has a cutting edge and a land. The cutting edge cuts the surface of the part and the land burnishes the surface of the part to form a highly reflective and smooth surface. Thus, the diamond cutter cuts and burnishes portions of the part, thereby eliminating a subsequent polishing step.

Claims

1. A method of cutting a part using a diamond cutter, the diamond cutter comprising a cutting edge and a land, the method comprising:

cutting a first surface of the part using the cutting edge to form a second surface comprising a plurality of peaks and troughs, the peaks reducing an overall reflectiveness and smoothness of the second surface; and

burnishing the second surface using the land to remove substantially all the peaks to form a third surface which is highly reflective and smooth,

wherein the cutting and burnishing comprises a milling operation whereby the diamond cutter is coupled to a milling machine wherein the diamond cutter is rotated about a spindle of the milling machine such that the diamond cutter contacts the part with each rotation of the spindle.

2. The method as recited in claim 1, wherein the cutting and burnishing occur with each contact of the diamond cutter with the part and wherein diamond cutter contacts the part a plurality of times.

3. The method as recited in claim 1, further comprising removing the peaks using a heel of the diamond cutter.

4. The method as recited in claim 1, wherein the milling operation is performed using a CNC milling machine.

5. The method as recited in claim 1, wherein the diamond cutter comprises a PCD (poly crystalline diamond).

6. The method as recited in claim 1, wherein the diamond cutter comprises an MCD (mono crystalline diamond).

7. The method as recited in claim 1, wherein the first surface has a substantially horizontal portion and a substantially vertical portion and the cutting and burnishing involves cutting a chamfer along an edge of the part.

8. The method as recited in claim 7, wherein the substantially horizontal portion and the substantially vertical portion are curved.

9. The method as recited in claim 7, wherein a chamfer is cut at 45 degree relative to the substantially horizontal portion and the substantially vertical portion.

10. The method as recited in claim 1, wherein the part is comprised of metal.

11. The method as recited in claim 10, wherein the metal comprises aluminum.

12. The method as recited in claim 1, further comprising forming an anodization layer over at least a portion of the third surface.

13. The method as recited in claim 1, further comprising forming an anodization layer over at least a portion of the first surface.

14. The method as recited in claim 1, wherein subsequent to the cutting and burnishing, the third surface is not polished.

15. A method of forming a highly reflective and smooth metal surface on a part using a diamond cutter, the diamond cutter comprising a cutting edge and a land, the method comprising:

forming a first anodization layer on a first metal surface of the part, the part comprising a first surface having a substantially vertical portion and a substantially horizontal portion, wherein the first anodization layer is formed on a least portions of the substantially vertical and substantially horizontal portions;

cutting a section of the first anodization layer and a section of metal underlying the first anodization layer using the cutting edge of the diamond cutter to form a second surface comprising a plurality of peaks and troughs, the peaks reducing an overall reflectiveness and smoothness of the second surface;

burnishing the second surface using the land of the diamond cutter to remove substantially all the peaks to form a third surface which is highly reflective and smooth, wherein the cutting and burnishing comprises a milling operation whereby the diamond cutter is coupled to a milling machine and the diamond cutter is rotated about a spindle of the milling machine such that the diamond cutter contacts the part with each rotation of the spindle; and

forming a second anodization layer on at least the third highly reflective and smooth surface.

16. The method as recited in claim 15, wherein the diamond cutter further comprises a heel to further remove a scalloped portion of the second surface.

17. The method as recited in claim 15, wherein the cutting comprises using a CNC (computerized numerical control) milling machine.

18. The method as recited in claim 15, wherein the diamond cutter comprises a PCD (poly crystalline diamond).

19. The method as recited in claim 15, wherein the diamond cutter comprises an MCD (mono crystalline diamond).

20. The method as recited in claim 15, wherein subsequent to forming the highly reflective third surface, the highly reflective third surface is not polished.

21. A method of forming a reflective and smooth surface on a part using a diamond cutter, the diamond cutter comprising a cutting edge and a land, the method comprising:

forming a first anodization layer on a first surface of the part;

cutting a section of the first anodization layer and a section of metal underlying the first anodization layer using the cutting edge to form a second surface comprising a plurality of peaks and troughs, the peaks reducing an overall reflectiveness and smoothness of the second surface; and

burnishing the second surface using the land to remove substantially all the peaks to form a third surface which is highly reflective and smooth, wherein the cutting and burnishing comprises a milling operation whereby the diamond cutter is coupled to a milling machine wherein the diamond cutter is rotated about a spindle of the milling machine such that the diamond cutter contacts the part with each rotation of the spindle; and

forming a second anodization layer on at least the third highly reflective and smooth surface.

burnishing the second surface using the land of the diamond cutter to remove substantially all the peaks to form a third surface which is highly reflective and smooth, wherein the cutting and burnishing comprises a milling operation whereby the diamond cutter is coupled to a milling machine and the diamond cutter is rotated about a spindle of the milling machine such that the diamond cutter contacts the part with each rotation of the spindle; and

forming a second anodization layer on at least the third highly reflective and smooth surface.