Sensor element and carrier element for manufacturing a sensor
First Claim
1. A sensor comprisinga circuit lead frame,at least one probe element connected to only one surface of the circuit lead frame,magnet disposed on the circuit lead frame, anda first housing comprising first and second opposing protrusions formed on the first housing,wherein the first housing directly contacts at least five surfaces of the probe element and the first housing encapsulates the probe element and the magnet, and the circuit lead frame directly contacts at least one surface of the probe element, andwherein a material comprising the first housing and in contact with the probe element comprises the protrusions.
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Accused Products
Abstract
A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.
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Citations
17 Claims
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1. A sensor comprising
a circuit lead frame, at least one probe element connected to only one surface of the circuit lead frame, magnet disposed on the circuit lead frame, and a first housing comprising first and second opposing protrusions formed on the first housing, wherein the first housing directly contacts at least five surfaces of the probe element and the first housing encapsulates the probe element and the magnet, and the circuit lead frame directly contacts at least one surface of the probe element, and wherein a material comprising the first housing and in contact with the probe element comprises the protrusions.
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15. A motor vehicle comprising a sensor, the sensor comprising:
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a lead frame, at least one probe element connected to only one surface of the lead frame, a magnetic field emitting element connected to the lead frame, and a first housing comprising first and second opposing protrusions integrally connected with the first housing, wherein the first housing directly contacts at least five surfaces of the probe element and the lead frame directly contacts at least one surface of the probe element and the first housing encapsulates the probe element and the magnetic field emitting element, and wherein a material comprising the first housing and in contact with the probe element comprises the protrusions.
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16. A sensor comprising
a circuit lead frame, at least one probe element, that is defined before connection, connected to the circuit lead frame, a magnetic field emitting element connected to the circuit lead frame, and a first housing comprising first and second opposing protrusions formed on the first housing, wherein the first housing directly contacts at least five surfaces of the probe element and the first housing encapsulates the probe element and the magnetic field emitting element, and the circuit lead frame directly contacts at least one surface of the probe element, and wherein a material comprising the first housing and in contact with the probe element comprises the protrusions.
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17. A motor vehicle comprising a sensor, the sensor comprising:
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a lead frame, at least one probe element, that is defined before connection, connected to the lead frame, a magnetic field emitting element connected to the lead frame, and a first housing comprising first and second opposing protrusions integrally connected with the first housing, wherein the first housing directly contacts at least five surfaces of the probe element and the lead frame directly contacts at least one surface of the probe element and the first housing encapsulates the probe element and the magnetic field emitting element, and wherein a material comprising the first housing and in contact with the probe element further comprises the protrusions.
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Specification