Integrated circuit with efficient MEMS architecture

• US 9,061,884 B1
• Filed: 04/24/2012
• Issued: 06/23/2015
• Est. Priority Date: 04/24/2012
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Miller, August Joseph Jr., Quan, Johnnie
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): FOX, BRANDON C
• Application Number:
  US13/454,881
• Time in Patent Office: 1,155 Days
• Field of Search: 257/416, 381/174
• US Class Current: 1/1
• CPC Class Codes: B81B 7/00 Microstructural systems; Auxiliary parts of microstructural devices or systems
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Abstract

An electrical circuit having a spatially-efficient MEMS architecture, substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.

Claims

1. An electrical circuit comprising:

a substrate comprising an opening that extends through the substrate;

a MEMS device, wherein;

the MEMS device comprises a first side at which the MEMS device is attached to the substrate, the first side comprising a cavity that is positioned over the opening in the substrate;

the MEMS device comprises a second side opposite the first side, the second side being generally planar;

the MEMS device comprises a conductive via extending through the MEMS device between the first side and the second side; and

a first end of the conductive via at the first side of the MEMS device is attached to the substrate; and

passive components positioned at the second side of the MEMS device;

an integrated circuit chip positioned at the second side of the MEMS device and attached to a second end of the conductive via at the second side of the MEMS device.

2. The electrical circuit of claim 1, wherein the integrated circuit chip is attached to the MEMS device over a diaphragm of the MEMS device utilizing flip chip technology, and further comprises underfill between the integrated circuit chip and the MEMS device.

3. The electrical circuit of claim 2, comprising at least one airflow channel through the underfill between the integrated circuit chip and the MEMS device.

4. The electrical circuit of claim 1, wherein the MEMS device comprises a second conductive via extending through the MEMS device between the first side and the second side, wherein the second conductive via provides a signal path between the integrated circuit chip and the substrate and between the integrated circuit chip and an electrical component of the MEMS device.

5. The electrical circuit of claim 1, wherein the MEMS device is a microphone device.

6. The electrical circuit of claim 5, wherein the MEMS device comprises a diaphragm at the second side, and wherein the integrated circuit chip is attached to the MEMS device at the second side utilizing flip chip technology where all points of attachment between the integrated circuit chip and the MEMS device are outside a perimeter of the diaphragm.

7. The electrical circuit of claim 1, wherein the integrated circuit chip is attached to the MEMS device utilizing flip chip technology and comprises a redistribution layer that positions contact pads of the integrated circuit to respective locations that will not interfere with operation of the MEMS device when the contact pads are attached to the MEMS device.

8. The electrical circuit of claim 1, comprising an air flow channel in the MEMS device that enhances air flow between the integrated circuit chip and the MEMS device.

9. The electrical circuit of claim 7, comprising an air flow channel in the redistribution layer that enhances air flow between the integrated circuit chip and the MEMS device.

10. The electrical circuit of claim 1, further comprising a cover positioned over at least the integrated circuit chip on a side of the integrated circuit chip opposite the MEMS device, and wherein the space between the integrated circuit chip and the cover comprises thermal interface material.

11. An electrical circuit comprising:

a substrate;

a MEMS device, wherein;

the MEMS device comprises a first side at which the MEMS device is attached to the substrate and a second side opposite the first side;

the MEMS device comprises a conductive via extending through the MEMS device between the first side and the second side; and

a first end of the conductive via at the first side of the MEMS device is attached to the substrate;

an integrated circuit chip positioned at the second side of the MEMS device and attached to a second end of the conductive via at the second side of the MEMS device, wherein the integrated circuit chip comprises a redistribution layer that positions contact pads of the integrated circuit chip to respective locations that will not interfere with operation of the MEMS device when the contact pads are attached to the MEMS device; and

a passive component positioned at the second side of the MEMS device.

12. The electrical circuit of claim 11, comprising an air flow channel that enhances air flow between the integrated circuit chip and the MEMS device.

13. The electrical circuit of claim 12, wherein the MEMS device comprises a second conductive via extending through the MEMS device between the first side and the second side, wherein the second conductive via provides a signal path between the integrated circuit chip and the substrate and between the integrated circuit chip and an electrical component of the MEMS device.

14. The electrical circuit of claim 11, further comprising a cover positioned over at least the integrated circuit chip on a side of the integrated circuit chip opposite the MEMS device, and wherein the space between the integrated circuit chip and the cover comprises thermal interface material.

15. The electrical circuit of claim 11, wherein the integrated circuit chip is attached to the MEMS device over a diaphragm of the MEMS device utilizing flip chip technology, and further comprising underfill between the integrated circuit chip and the MEMS device.

16. An electrical circuit comprising:

a substrate;

a MEMS device, wherein;

the MEMS device comprises a first side at which the MEMS device is attached to the substrate and a second side opposite the first side;

the MEMS device comprises a conductive via extending through the MEMS device between the first side and the second side; and

a first end of the conductive via at the first side of the MEMS device is attached to the substrate;

an integrated circuit chip attached to the substrate and communicatively coupled to the MEMS device;

a passive component positioned at the second side of the MEMS device; and

a cover positioned over at least the second side of the MEMS device, wherein the space between the second side of the MEMS device and the cover is free of wire bonds.

17. The electrical circuit of claim 16, further comprising thermal interface material between the integrated circuit chip and the cover.

18. The electrical circuit of claim 16, wherein the MEMS device is a microphone device.

19. The electrical circuit of claim 16, wherein:

the first side of the MEMS device is the passive side;

the second side of the MEMS device is the active side; and

the substrate comprises a port over which the first side of the MEMS device is positioned.

20. An electrical circuit comprising:

a substrate comprising an opening that extends through the substrate;

a MEMS device, wherein;

the MEMS device comprises a first side at which the MEMS device is attached to the substrate, the first side comprising a cavity that is positioned over the opening in the substrate;

the MEMS device comprises a second side opposite the first side, the second side being generally planar;

the MEMS device comprises a conductive via extending through the MEMS device between the first side and the second side;

the MEMS device comprises an air flow channel in the redistribution layer that enhances air flow between the integrated circuit chip and the MEMS device; and

a first end of the conductive via at the first side of the MEMS device is attached to the substrate; and

an integrated circuit chip positioned at the second side of the MEMS device and attached to a second end of the conductive via at the second side of the MEMS device, wherein the integrated circuit chip is attached to the MEMS device utilizing flip chip technology and comprises a redistribution layer that positions contact pads of the integrated circuit to respective locations that will not interfere with operation of the MEMS device when the contact pads are attached to the MEMS device.