Methods of manufacture of top port multi-part surface mount silicon condenser microphones

• US 9,061,893 B1
• Filed: 12/30/2013
• Issued: 06/23/2015
• Est. Priority Date: 11/28/2000
• Status: Expired due to Fees

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Minervini, Anthony D.
• Primary Examiner(s): Chambliss, Alonzo
• Application Number:
  US14/144,089
• Time in Patent Office: 540 Days
• Field of Search: 438/125, 438/599, 295/94, 296/091, 257/704, 257/710, 257/786, 361/360, 381/361
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 1/00309 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: B81C 3/002 Aligning microparts
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/016 for microphones
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2225/49 Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid
• CPC Class Codes: H04R 3/00 : Circuits for transducers , loudspeakers or microphones
• CPC Class Codes: Y10T 29/49005 : Acoustic transducer
• CPC Class Codes: Y10T 29/4908 : Acoustic transducer

Abstract

The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components that simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the MEMS microphone die is mechanically attached, providing an interior surface for making electrical connections between the MEMS microphone die and the package, and providing an exterior surface for surface mounting the microphone package to a device'"'"'s printed circuit board and for making electrical connections between the microphone package and the device'"'"'s circuit board. The manufacturing process uses an unsingulated panel of individual substrates, each substrate having metal pads on its top and bottom surfaces, an unsingulated panel of individual sidewall spacers, and an unsingulated panel of individual lids. A MEMS microphone die is mounted on each substrate in the unsingulated panel of substrates, and the substrate panel, the sidewall panel, and the lid panel are joined together into a single panel, which is then singulated into individual MEMS microphones.

Claims

1. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising:

providing an unsingulated panel comprised of a plurality of individual lids, wherein each lid has top and bottom surfaces and comprises at least one conductive layer, at least one non-conductive layer, and an acoustic port, wherein the at least one conductive layer comprises the bottom surface of the lid, and wherein the bottom surface has an attachment region and an interior region, the attachment region positioned between the interior region and the edges of the lid, and completely bounding the interior region;

providing an unsingulated panel comprised of a plurality of individual sidewall spacers, wherein each sidewall spacer has top and bottom surfaces and comprises at least two conductive layers with a center layer of non-conductive material having a predefined thickness disposed between the two conductive layers, wherein one conductive layer comprises the top surface of the sidewall spacer and the other conductive layer comprises the bottom surface of the sidewall spacer, and wherein the sidewall spacer further comprises an opening having walls covered with conductive material, and the opening walls extend through the center layer to the top surface and the bottom surface;

providing an unsingulated panel comprised of a plurality of individual substrates, wherein each substrate comprises;

a base layer comprising of at least one layer of non-conductive material, wherein the base layer has a planar top surface and a planar bottom surface, the top surface having an interior region and an attachment region, the attachment region disposed between the interior region and the edges of the base layer, and completely bounding the interior region;

a first plurality of metal pads disposed on the top surface of the base layer, wherein at least one pad of the first plurality of metal pads is located in the attachment region of the top surface of the base layer;

a second plurality of metal pads disposed on the bottom surface of the base layer, the second plurality of metal pads arranged to be within the edges the base layer; and

one or more electrical pathways disposed completely within the base layer, wherein the pathways electrically couple one or more of the first plurality of metal pads on the top surface of the base layer to one or more of the second plurality of metal pads on the bottom surface of the base layer, and wherein the at least one metal pad located in the attachment region of the top surface of the base layer is electrically coupled to one or more of the second plurality of metal pads;

mounting a MEMS microphone die on the top surface of the base layer of each individual substrate in the unsingulated panel of individual substrates, and electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the top surface of the base layer of its respective substrate in the unsingulated panel of substrates;

attaching the unsingulated panel of substrates, the unsingulated panel of sidewall spacers and the unsingulated panel of lids to each other in a predetermined order;

wherein the bottom surface of each sidewall spacer is coupled to the attachment region of the top surface of its respective substrate such that the opening of each sidewall spacer and the interior region of the top surface of each substrate are respectively aligned, and the conductive material on the opening walls of each sidewall spacer is electrically coupled to its respective at least one metal pad located in the attachment region of each substrate;

wherein the top surface of each sidewall spacer is coupled to the attachment region of the bottom surface of its respective lid such that the opening of each sidewall spacer and the interior region of the bottom surface of each lid are respectively aligned, and the conductive layer of each lid is electrically coupled to the conductive material on the opening walls of its respective sidewall spacer; and

wherein the interior region of the top surface of each substrate, the opening walls of its respective sidewall spacer, and the interior region of the bottom surface of its respective lid, when the panels are attached, define the acoustic chamber for each of their respective MEMS microphone die; and

singulating the attached panels into a plurality of individual MEMS microphones, wherein each substrate, and its respective sidewall spacer and lid cooperatively form a housing that has surfaces substantially perpendicular to the bottom surface of the substrate.

2. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the method further comprises electrically coupling at least one passive electrical element between one of the first plurality of metal pads and one of the second plurality of metal pads.

3. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 2, wherein the method further comprises forming the at least one passive electrical element within the base layer of the substrate.

4. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 2, wherein the method further comprises providing the at least one passive electrical element within the base layer of each substrate in the unsingulated panel of substrates, and the at least one passive electrical element comprises a dielectric or resistive material that is different from the non-conductive material used in the base layer of each respective substrate.

5. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 2, wherein, for each MEMS microphone, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power.

6. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the method further comprises attaching the unsingulated panel of lids to the unsingulated panel of sidewall spacers with a first conductive material, and attaching the unsingulated panel of substrates to the unsingulated panel of sidewall spacers with a second conductive material.

7. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the housing protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage.

8. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the method further comprises providing each lid in the unsingulated panel of lids a material layer that that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port.

9. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the acoustic port in each lid in the unsingulated panel of lids is disposed in a position offset from the centerpoint of its respective lid.

10. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the base layer of the each sidewall spacer in the unsingulated panel of sidewall spacers comprises multiple layers of conductive and non-conductive material, and the conductive material on the opening walls of each sidewall spacer electrically couples the conductive layers to each other.

11. A surface mount MEMS microphone according to claim 1, wherein the method further comprises plating the first and second pluralities of metal pads on the base layer of each substrate with a metal that is different from the metal used for the first and second pluralities of metal pads of each substrate in the panel of unsingulated substrates.

12. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the base layer of each substrate in the panel of unsingulated substrates further comprises at least one additional non-conductive layer and at least one additional conductive layer.

13. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the base layer of each substrate in the panel of unsingulated substrates further comprises a recess disposed therein, and its respective MEMS microphone die is positioned over the recess.

14. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the base layer of each substrate in the panel of unsingulated substrates further comprises an internal cavity with an aperture in the top surface of the base layer, and its respective MEMS microphone die is positioned over the aperture in the top surface of the base layer.

15. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the acoustic port in each lid in the unsingulated panel of lids is a first acoustic port, and base layer of each substrate in the panel of unsingulated substrates further comprises a second acoustic port, and wherein its respective MEMS microphone die is positioned over the acoustic port in the base layer.

16. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 15, wherein the base layer of each substrate in the unsingulated panel of substrates further comprises a material layer that that substantially blocks environmental contaminants from reaching its respective MEMS microphone die through the second acoustic port in the base layer.

17. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein, for each MEMS microphone, electrical continuity is present between the conductive layer in its lid, the conductive material on the opening walls of its sidewall spacer, and at least one of its second plurality of metal pads.

18. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 1, wherein the at least one non-conductive layer of the lid, the center layer of non-conductive material of the sidewall spacer, and the non-conductive material of the base layer of each MEMS microphone each have a substantially similar predetermined coefficient of thermal expansion.

19. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising:

providing an unsingulated panel comprised of a plurality of individual top portions, wherein each top portion has upper and lower surfaces and comprises at least one metal layer, at least one printed circuit board material layer, and an acoustic port, wherein the at least one metal layer comprises the lower surface of the top portion, and wherein the lower surface has a coupling area and an inner area, the coupling area being arranged between the inner area and the edges of the top portion, and completely surrounding the inner area;

providing an unsingulated panel comprised of a plurality of individual spacer portions, wherein each spacer portion has upper and lower surfaces and comprises at least two metal layers with at least one printed circuit board material layer of predefined thickness disposed between the two metal layers, wherein one metal layer comprises the upper surface of the spacer portion and the other metal layer comprises the lower surface of the spacer portion, and wherein the spacer portion further comprises a window having walls covered with a metal layer, and the window walls extend through the printed circuit board material layer to the upper surface and the lower surface;

providing an unsingulated panel comprised of a plurality of individual bottom portions, wherein each bottom portion comprises;

a base layer that comprises at least one layer of printed circuit board material, wherein the base layer has a substantially flat upper surface and a substantially flat lower surface, the upper surface having an inner area and a coupling area, the coupling area located between the inner area and the edges of the base layer, and completely surrounding the inner area;

a plurality of metal pads located on the upper surface of the base layer, wherein at least one pad of the plurality of metal pads is positioned in the coupling area of the upper surface of the base layer;

a plurality of solder pads located on the lower surface of the base layer, the plurality of solder pads arranged to be within the edges of the base layer;

one or more electrical connections passing through the base layer, wherein the connections electrically couple one or more of the plurality of metal pads on the upper surface of the base layer to one or more of the plurality of solder pads on the lower surface of the base layer, and wherein the at least one metal pad positioned in the coupling area of the upper surface of the base layer is electrically coupled to one or more of the plurality of solder pads; and

at least one passive electrical element electrically coupled between one of the plurality of metal pads and one of the plurality of solder pads;

physically coupling a MEMS microphone die on the top surface of the base layer of each individual bottom portion in the unsingulated panel of individual bottom portions, and electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the top surface of the base layer of its respective bottom portion in the unsingulated panel of bottom portions;

physically coupling the unsingulated panel of top portions, the unsingulated panel of spacer portions, and the unsingulated panel of bottom portions to each other in a predetermined order;

wherein a conductive material physically couples the lower surface of each spacer portion to the coupling area of the upper surface of its respective bottom portion such that the window of each spacer portion and the inner area of the upper surface of each bottom portion are respectively aligned, and the metal layer on the window walls of each spacer portion is electrically coupled to the at least one metal pad positioned in the coupling area of its respective bottom portion;

wherein a conductive material physically couples the upper surface of the spacer portion to the coupling area of the lower surface of its respective top portion such that the window of the spacer portion and the inner area of the lower surface of its respective top portion are aligned, and the metal layer of the top portion is electrically coupled to the metal layer on the window walls of its respective spacer portion;

wherein electrical continuity is present between the metal layer in each top portion, its respective metal layer on the window walls of its respective spacer portion, and its respective at least one of the plurality of solder pads; and

wherein the inner area of the upper surface of each bottom portion, the window walls of its respective spacer portion, and the inner area of the lower surface of its respective top portion, when the panels are coupled, define the internal acoustic chamber for each of their respective MEMS microphone die that provides acoustic coupling to its respective acoustic port;

singulating the coupled panels into a plurality of individual MEMS microphones, wherein each bottom portion, and its respective spacer portion and top portion cooperatively form a housing that has surfaces substantially perpendicular to the lower surface of the bottom portion and that protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage.

20. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each MEMS microphone, the housing further comprises a material layer that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port.

21. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein the acoustic port in each top portion in the unsingulated panel of top portions is disposed in a position offset from the centerpoint of its respective top portion.

22. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein the base layer of each bottom portion in the panel of unsingulated bottom portion further comprises an internal cavity with an aperture in the upper surface of the base layer, and its respective MEMS microphone die is positioned over the aperture in the upper surface of the base layer.

23. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein the base layer of each bottom portion in the panel of unsingulated bottom portions further comprises an acoustic port, and wherein its respective MEMS microphone die is positioned over the acoustic port in the base layer.

24. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein, for each MEMS microphone, the at least one passive electrical element is disposed within the base layer of the bottom portion and comprises a dielectric or resistive material that is different from the printed circuit board material of the base layer.

25. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 24, wherein, for each MEMS microphone, the at least one passive electrical element is configured to filter one or more of an input signal, an output signal, or input power.

26. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein the printed circuit board layer of each spacer portion of the unsingulated panel of spacer portions further comprises additional layers of printed circuit board material alternating with additional metal layers, and the conductive material on the window walls electrically couples the additional metal layers to each other.

27. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein the base layer of each bottom portion in the unsingulated panel of base portions further comprises at least one additional non-conductive layer and at least one additional conductive layer.

28. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 19, wherein each first enclosure element of the unsingulated panel of first enclosure elements further comprises additional metal layers alternating with the FR-4 printed circuit board material layers, and the metal layer of the interior open volume walls electrically couples the additional metal layers to each other.

29. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising:

providing an unsingulated panel comprised of a plurality of individual base substrates, wherein each base substrate comprises;

a core layer comprised of at least one layer of FR-4 printed circuit board material, wherein the core layer has a substantially flat top surface and a substantially flat bottom surface, the top surface having a die mount region and an attachment region, the attachment region positioned between the die mount region and the edges of the core layer, and completely surrounding the die mount region;

a plurality of metal pads located on the top surface of the core layer, wherein at least one pad of the plurality of metal pads is located in the attachment region of the top surface of the core layer;

a plurality of solder pads located on the bottom surface of the core layer, the plurality of solder pads arranged to be within the edges of the core layer;

a plurality of electrical connections passing through the core layer that electrically couple one or more of the plurality of metal pads on the top surface of the core layer to one or more of the plurality of solder pads on the bottom surface of the core layer, and wherein the at least one metal pad located in the attachment region of the top surface of the core layer is electrically coupled to one or more of the plurality of solder pads; and

a pressure-equalizing MEMS microphone die having an internal acoustic channel mounted in the die mount region of the core layer, and electrically coupled to one or more of the metal pads on the top surface of the core layer;

providing a plurality of enclosure elements, the plurality comprising;

an unsingulated panel comprised of a plurality of individual first enclosure elements, wherein each first enclosure element has having substantially flat top and bottom surfaces and comprises at least two metal layers with multiple FR-4 printed circuit board material layers of predefined thickness disposed between the two metal layers, wherein one metal layer comprises the top surface of the first enclosure element and the other metal layer comprises the bottom surface of the first enclosure element;

an unsingulated panel comprised of a plurality of individual second enclosure elements, wherein each second enclosure element has substantially flat top and bottom surfaces and comprises at least one metal layer, a FR-4 printed circuit board material layer, and an acoustic port that is disposed in an offset position from the centerpoint of the second enclosure element, wherein the metal layer comprises the bottom surface of the second enclosure element, and wherein the bottom surface has an attachment region and an inner region, the attachment region being arranged between the attachment region and the edges of the second enclosure element, and completely surrounding the attachment region;

physically coupling the unsingulated panel of first enclosure elements and the unsingulated panel of second enclosure elements to each other to form an unsingulated panel of enclosures,

wherein the top surface of each first enclosure element is physically coupled to the attachment region of the bottom surface of its respective second enclosure element with a conductive material;

wherein each first enclosure element further comprises an interior open volume with walls, thereby exposing the inner region of the bottom surface of its respective second enclosure element; and

wherein the interior open volume walls of each first enclosure element have a metal layer that is electrically connected to the bottom surface metal layer of its respective second enclosure element;

joining the unsingulated panel of base substrates and the unsingulated panel of enclosures to form a housing that has an internal acoustic chamber for the MEMS microphone die, and that protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage, wherein the bottom surface metal layer of each first enclosure element is physically joined to the attachment region of its respective base substrate with a conductive material, and wherein the interior open volume of each first enclosure element is aligned with the die mount region of its respective base substrate, and the metal pad positioned in each attachment region is electrically coupled to the metal layer of the interior open volume walls in its respective first enclosure element;

wherein the interior region of the bottom surface of each second enclosure element, the interior open volume walls of its respective first enclosure element, and the die mount region of its respective base substrate define the internal acoustic chamber that is a front volume for its respective MEMS microphone die, and acoustically couples the respective acoustic port to the MEMS microphone die;

wherein electrical continuity exists between the metal layer of each second enclosure element, the metal-covered interior open volume walls of its respective enclosure element, and one or more of the plurality of solder pads on its respective base substrate; and

singulating the coupled panels into a plurality of individual MEMS microphones, wherein, for each MEMS microphone, the length of the base substrate and the length of the enclosure are substantially equal, and the width of the base substrate and the width of the enclosure are substantially equal.

30. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, the method further comprising providing at least one passive electrical element within the core layer of each base substrate in the unsingulated panel of base substrates, and electrically coupling the at least one passive electrical element between one of the plurality of metal pads and one of the plurality of solder pads.

31. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 30, wherein the core layer of each base substrate in the panel of unsingulated base substrates further comprises at least one passive electrical element is disposed within the core layer of each base substrate and comprises a dielectric or resistive material that is different from the FR-4 printed circuit board material of the core layer.

32. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 31, wherein the at least one passive electrical element, of each MEMS microphone, filters one or more of an input signal, an output signal, or input power.

33. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein, for each MEMS microphone, the housing further comprises a material layer that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port of the MEMS microphone.

34. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 29, wherein the core layer of each base substrate in the unsingulated panel of base substrates further comprises an internal cavity with an aperture in the top surface of the core layer, and the internal acoustic channel of its respective MEMS microphone die is positioned over and acoustically coupled to the aperture in the top surface of the core layer.

35. A method for manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphones, the method comprising:

providing a plurality of pressure-equalizing MEMS microphone die, each MEMS microphone die having an internal acoustic channel;

providing an unsingulated panel comprised of a plurality of individual first housing elements, wherein each first housing element has substantially flat top and bottom surfaces and comprises at least one metal layer, a printed circuit board material layer, and an acoustic port, wherein the at least one metal layer comprises the bottom surface of the first housing element, wherein the bottom surface has an attachment region and an interior region, the attachment region located between the interior region and the edges of the first housing element and completely surrounding the interior region, and wherein the acoustic port is disposed in a position offset from the centerpoint of the first housing element;

providing an unsingulated panel comprised of a plurality of individual second housing elements, wherein each second housing element has substantially flat top and bottom surfaces and comprises at least first and second metal layers with multiple printed circuit board material layers of predefined thickness disposed between the first and second metal layers, wherein the first metal layer comprises the top surface of the second housing element and the second metal layer comprises the bottom surface of the second housing element, wherein the second housing element further comprises an aperture having metal-covered walls, and the aperture walls extend through the printed circuit board material layer to the top and bottom surfaces of the second housing element;

providing an unsingulated panel comprised of a plurality of individual third housing elements, wherein each third housing element comprises;

a core layer comprised of at least one layer of printed circuit board material, wherein the core layer has a substantially flat top surface and a substantially flat bottom surface, wherein the top surface has an interior region and an attachment region, the attachment region being arranged between the interior region and the edges of the core layer, and the attachment region completely surrounds the interior region;

a plurality of metal pads disposed on the top surface of the core layer, wherein at least one pad of the plurality of metal pads is positioned in the attachment region of the top surface of the core layer;

a plurality of solder pads disposed on the bottom surface of the core layer, the plurality of solder pads arranged to be within the edges of the core layer; and

one or more electrical vias located inside the core layer, wherein the vias electrically couple one or more of the plurality of metal pads on the top surface of the core layer to one or more of the plurality of solder pads on the bottom surface of the core layer, and wherein a via electrically couples the at least one metal pad positioned in the attachment region of the top surface of the core layer to one or more of the plurality of solder pads;

mounting one of the plurality of MEMS microphone die to the top surface of the core layer of each third housing element in the panel of unsingulated third housing elements, and electrically coupling the mounted MEMS microphone to the plurality of metal pads on the top surface of the core layer of its respective third housing element;

attaching the unsingulated panel of first housing elements, the unsingulated panel of second housing elements, and the unsingulated panel of third housing elements to each other in a predetermined order;

wherein a conductive material physically couples the attachment region of the bottom surface of each first housing element to the top surface of its respective second housing element to such that the interior region of the bottom surface of each first housing element and the aperture of its respective second housing element are aligned, and the metal layer of each first housing element is electrically coupled to the metal-covered aperture walls of its respective second housing element;

wherein a conductive material physically couples the bottom surface of each second housing element to the attachment region of the top surface of its respective third housing element such that the aperture of each second housing element and the interior region of the top surface of its respective third housing element are aligned, and the metal-covered aperture walls of each second housing element are electrically coupled to the at least one metal pad positioned in the attachment region of the its respective housing element;

wherein the interior region of the bottom surface of each first housing element, the aperture walls of its respective second housing element, and the interior region of the top surface of its respective third housing element, when the panels are attached, define the internal acoustic chamber that is a front volume for its respective MEMS microphone die, and acoustically couples its respective acoustic port to the MEMS microphone die; and

wherein electrical continuity exists between the metal layer of each first housing element, the metal-covered aperture walls of its respective second housing element, and one or more of the plurality of solder pads on its respective third housing element; and

singulating the coupled panels into a plurality of individual MEMS microphones, wherein the first housing element, and it respective second, and third housing elements cooperatively form a housing that has surfaces substantially perpendicular to the bottom surface of the third housing element, that has an internal acoustic chamber for the MEMS microphone die, and that protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage.

36. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 35, wherein the method further comprises electrically coupling at least one passive electrical element between one of the plurality of metal pads and one of the plurality of solder pads.

37. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein each core layer of the third housing element further comprises at least one passive electrical element is disposed within the core layer of the third housing element and comprises a dielectric or resistive material that is different from the printed circuit board material of the core layer.

38. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 37, wherein the at least one passive electrical element, of each MEMS microphone, is configured to filter one or more of an input signal, an output signal, or input power.

39. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 36, wherein each second housing element of the unsingulated panel of second housing elements further comprises additional metal layers interposed between the multiple layers of printed circuit board material, and the metal-covered walls of the aperture electrically couples the additional metal layers to each other.

40. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 35, wherein, for each MEMS microphone, the housing further comprises a material layer that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port.

41. A method for manufacturing a plurality of surface mount MEMS microphones according to claim 35, wherein each third housing element in the unsingulated panel of third housing elements further comprises a cavity with an opening in the top surface of the core layer of the third housing element, and each MEMS microphone die is positioned over the opening in the top surface of its respective core layer such that the internal acoustic channel of each MEMS microphone die is acoustically coupled to its respective cavity.