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Thin glass processing using a carrier

  • US 9,063,605 B2
  • Filed: 09/15/2011
  • Issued: 06/23/2015
  • Est. Priority Date: 01/09/2009
  • Status: Active Grant
First Claim
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1. A method of fabricating a display panel from a thin substrate using a carrier substrate comprising:

  • depositing a bonding agent on a first surface of the thin substrate;

    depositing a bonding agent on a second surface of the carrier substrate;

    bonding the thin substrate and the carrier substrate with the bonding agent deposited on the first surface and the second surface;

    performing thin film processing on a third surface of the thin substrate opposite the first surface; and

    separating the processed thin substrate from the carrier substrate, wherein the thin substrate has a thickness less than a required thickness for sustaining thin film processing while a thickness of the bonded thin substrate and the carrier substrates is greater than or equal to the required thickness.

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