Thin glass processing using a carrier
First Claim
1. A method of fabricating a display panel from a thin substrate using a carrier substrate comprising:
- depositing a bonding agent on a first surface of the thin substrate;
depositing a bonding agent on a second surface of the carrier substrate;
bonding the thin substrate and the carrier substrate with the bonding agent deposited on the first surface and the second surface;
performing thin film processing on a third surface of the thin substrate opposite the first surface; and
separating the processed thin substrate from the carrier substrate, wherein the thin substrate has a thickness less than a required thickness for sustaining thin film processing while a thickness of the bonded thin substrate and the carrier substrates is greater than or equal to the required thickness.
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Accused Products
Abstract
A method of fabricating a display panel from a thin substrate using a carrier substrate is disclosed. The method includes depositing a bonding agent on a first surface of the thin substrate; depositing a bonding agent on a second surface of the carrier substrate; bonding the thin substrate and the carrier substrate with the bonding agent deposited on the first surface and the second surface; performing thin film processing on a third surface of the thin substrate opposite the first surface; and separating the processed thin substrate from the carrier substrate. The thin substrate has a thickness less than a required thickness for sustaining thin film processing while a thickness of the bonded thin substrate and the carrier substrates is greater than or equal to that the required thickness.
36 Citations
21 Claims
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1. A method of fabricating a display panel from a thin substrate using a carrier substrate comprising:
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depositing a bonding agent on a first surface of the thin substrate; depositing a bonding agent on a second surface of the carrier substrate; bonding the thin substrate and the carrier substrate with the bonding agent deposited on the first surface and the second surface; performing thin film processing on a third surface of the thin substrate opposite the first surface; and separating the processed thin substrate from the carrier substrate, wherein the thin substrate has a thickness less than a required thickness for sustaining thin film processing while a thickness of the bonded thin substrate and the carrier substrates is greater than or equal to the required thickness. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification