Semiconductor device
First Claim
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1. A semiconductor device, comprising:
- a semiconductor element;
a base plate having an upper surface on which said semiconductor element is mounted;
a cooling fin disposed on a lower surface of said base plate;
a jacket disposed in a sealing manner on the lower surface of said base plate, said jacket surrounding said cooling fin; and
a header partition wall formed separately from said jacket and fixed to said jacket on the lower side of said cooling fin in said jacket, said header partition wall forming a header and a flow path for causing a refrigerant flow to said cooling fin and exchangeable relative to the jacket that surrounds the cooling fin.
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Abstract
A semiconductor device includes a semiconductor element, a base plate having an upper surface on which the semiconductor element is mounted, a cooling fin disposed on a lower surface of the base plate, a jacket disposed in a sealing manner on the lower surface of the base plate, the jacket surrounding the cooling fin, and a header partition wall formed separately from the jacket and fixed to the jacket on the lower side of the cooling fin in the jacket, the header partition wall forming a header and a flow path for causing a refrigerant flow to the cooling fin.
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Citations
8 Claims
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1. A semiconductor device, comprising:
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a semiconductor element; a base plate having an upper surface on which said semiconductor element is mounted; a cooling fin disposed on a lower surface of said base plate; a jacket disposed in a sealing manner on the lower surface of said base plate, said jacket surrounding said cooling fin; and a header partition wall formed separately from said jacket and fixed to said jacket on the lower side of said cooling fin in said jacket, said header partition wall forming a header and a flow path for causing a refrigerant flow to said cooling fin and exchangeable relative to the jacket that surrounds the cooling fin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification