Optoelectronic apparatuses with post-molded reflector cups

• US 9,065,025 B2
• Filed: 06/10/2014
• Issued: 06/23/2015
• Est. Priority Date: 02/24/2012
• Status: Active Grant

• Current Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Original Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Inventors: Ankireddi, Seshasayee S., Wiese, Lynn K.
• Primary Examiner(s): CHAUDHARI, CHANDRA P
• Application Number:
  US14/300,980
• Publication Number:
  US 20140312377A1
• Time in Patent Office: 378 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An optoelectronic apparatus includes one or more packaged optoelectronic semiconductor devices (POSDs), each including one or more optoelectronic elements encapsulated by a light transmissive molding compound. Each POSD includes a top surface formed by a top surface of the light transmissive molding compound that encapsulates the one or more optoelectronic elements of the POSD. Each POSD also includes a bottom surface including electrical contacts for the one or more optoelectronic elements of the POSD. A peripheral surface extends between the top and bottom surfaces. A light reflective molding compound surrounds the peripheral surface of each POSD and forms a reflector cup for each POSD. The electrical contacts on the bottom surface of each POSD are exposed, and thus, are accessible for electrical connections to other circuitry. Where the optoelectronic apparatus includes a plurality of POSDs, the light reflective molding compound also connects neighboring POSDs to one another.

Claims

1. An optoelectronic apparatus, comprising:

one or more packaged optoelectronic semiconductor devices (POSDs) each including one or more optoelectronic elements encapsulated by a light transmissive molding compound;

a top surface formed by a top surface of the light transmissive molding compound that encapsulates the one or more optoelectronic elements of the POSD;

a bottom surface including electrical contacts for the one or more optoelectronic elements of the POSD; and

a peripheral surface extending between the top and bottom surfaces; and

a light reflective molding compound that surrounds the peripheral surface of each POSD and forms a reflector cup for each POSD;

wherein the electrical contacts on the bottom surface of each POSD are exposed, and thus, are accessible for electrical connections to other circuitry.

2. The optoelectronic apparatus of claim 1, wherein the one or more POSDs comprises one POSD.

3. The optoelectronic apparatus of claim 2, wherein a peripheral surface of the reflector cup, formed from the light reflective molding compound, is surrounded by a light barrier formed from an opaque molding compound.

4. The optoelectronic apparatus of claim 1, wherein the one or more POSDs comprises a plurality of POSDs.

5. The optoelectronic apparatus of claim 4, wherein the light reflective molding compound also connects each of the POSDs to its one or more neighboring POSDs.

6. The optoelectronic apparatus of claim 4, wherein a peripheral surface of the reflector cup of each of the plurality of POSDs is surrounded by an opaque molding compound the forms a light barrier between neighboring POSDs.

7. The optoelectronic apparatus of claim 4, wherein the electrical contacts on the bottom surface of each POSD are selected from the group consisting of:

electrically conductive lands;

electrically conductive pads;

electrically conductive balls;

electrically conductive pins; and

electrically conductive wires.

8. The optoelectronic apparatus of claim 4, wherein each POSD comprises a flat no-leads package.

9. The optoelectronic apparatus of claim 1, wherein each of the one or more packaged optoelectronic semiconductor devices (POSDs) comprises a packaged light source semiconductor device (PLSSD), and each of the one or more optoelectronic elements included in each said POSD comprises a light emitting element.

10. The optoelectronic apparatus of claim 1, wherein at least one of the one or more packaged optoelectronic semiconductor devices (POSDs) comprises a packaged light detection semiconductor device (PLDSD).

11. A system, comprising:

an optoelectronic apparatus including

one or more packaged optoelectronic semiconductor devices (POSDs) each including

one or more optoelectronic elements encapsulated by a light transmissive molding compound;

a top surface formed by a top surface of the light transmissive molding compound that encapsulates the one or more optoelectronic elements of the POSD;

a bottom surface including electrical contacts for the one or more optoelectronic elements of the POSD; and

a peripheral surface extending between the top and bottom surfaces; and

a light reflective molding compound that surrounds the peripheral surface of each POSD and forms a reflector cup for each POSD;

wherein the electrical contacts on the bottom surface of each POSD are exposed, and thus, are accessible for electrical connections to other circuitry; and

a driver to selectively drive the one or more optoelectronic elements of the one or more POSDs;

a processor and/or circuitry to detect ambient light and/or proximity of an object based on signals received from the one or more POSDs; and

a subsystem that is responsive to ambient light and/or proximity of an object relative to the optoelectronic apparatus, as detected by the processor and/or circuitry.

12. The system of claim 11, wherein the one or more POSDs comprises one POSD.

13. The system of claim 12, wherein a peripheral surface of the reflector cup, formed from the light reflective molding compound, is surrounded by a light barrier formed from an opaque molding compound.

14. The system of claim 11, wherein the one or more POSDs comprises a plurality of POSDs.

15. The system of claim 14, wherein the light reflective molding compound also connects each of the POSDs to its one or more neighboring POSDs.

16. The system of claim 14, wherein a peripheral surface of the reflector cup of each of the plurality of POSDs is surrounded by an opaque molding compound the forms a light barrier between neighboring POSDs.

17. A system, comprising:

an optoelectronic apparatus including

a plurality of packaged light source semiconductor devices (PLSSDs) each including

one or more light emitting elements encapsulated by a light transmissive molding compound;

a top surface formed by a top surface of the light transmissive molding compound that encapsulates the one or more light emitting elements of the PLSSD;

a bottom surface including electrical contacts for the one or more light emitting elements of the PLSSD; and

a peripheral surface extending between the top and bottom surfaces; and

a light reflective molding compound that surrounds the peripheral surface of each PLSSD and forms a reflector cup for each PLSSD;

wherein the light reflective molding compound also connects the PLSSDs to one another;

wherein the electrical contacts on the bottom surface of each PLSSD are exposed, and thus, are accessible for electrical connections to other circuitry;

electronic driving circuitry that drives the light emitting elements of the PLSSDs by providing electrical signals to the contacts of the PLSSDs; and

an electrical connector that connects the electronic driving circuitry to an external power source.

18. The system of claim 17, wherein each of the light emitting elements comprises one of a light emitting diode (LED), an organic LED (OLED), a bulk-emitting LED, a surface-emitting LED, a vertical-cavity surface-emitting laser (VCSEL), a superluminescent light emitting diode (SLED), a laser diode, or a pixel diode.

19. The system of claim 17, further comprising a heat sink to dissipate heat generated by the light emitting elements of the plurality of PLSSDs.

20. The system of claim 17, further comprising an opaque molding compound that surrounds a periphery of the optoelectronic apparatus.