Light emitting device package

• US 9,065,033 B2
• Filed: 02/04/2014
• Issued: 06/23/2015
• Est. Priority Date: 02/22/2013
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Sang-hyun, Hong, Jin-gi, Hwang, Seong-deok, Kam, Dong-hyuck, Yong, Gam-han
• Primary Examiner(s): Smith, Zandra
• Assistant Examiner(s): TYNES JR., LAWRENCE C
• Application Number:
  US14/172,408
• Publication Number:
  US 20140239328A1
• Time in Patent Office: 504 Days
• Field of Search: 257/98
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The present application relates to a light emitting device package. The light emitting device package includes a package substrate in which a via hole is formed. An electrode layer extends to both surfaces of the package substrate after passing through the via hole. A light emitting device is arranged on the package substrate and is connected to the electrode layer. A fluorescence film includes a first part that fills at least a part of an internal space of the via hole and a second part that covers at least a part of the light emitting device.

Claims

1. A light emitting device package comprising:

a package substrate in which a via hole is formed;

an electrode layer extending through the via hole and along both surfaces of the package substrate;

a light emitting device arranged on the package substrate and connected to the electrode layer; and

a fluorescence film including;

a first part that fills at least a part of an internal space of the via hole, and

a second part that covers at least a part of the light emitting device.

2. The light emitting device package of claim 1, wherein the fluorescence film is integrally connected from the first part to the second part.

3. The light emitting device package of claim 1, wherein the first part of the fluorescence film is positioned in a location that blocks an entrance of the via hole at an inside of the via hole.

4. The light emitting device package of claim 1, further comprising:

a lens unit covering the light emitting device and the via hole,

wherein the lens unit includes a local protrusion unit that is protruded to an inside of the via hole and covers the first part of the fluorescence film.

5. The light emitting device package of claim 1, wherein the fluorescence film includes:

a phosphor of a first volume %,

a polymer resin of a second volume % that is greater than the first volume %, and

filler particles of a third volume % that is smaller than the first volume %.

6. The light emitting device package of claim 5, wherein the filler particles are formed of at least one of TiO₂, SiO₂, Al₂O₃ and AlN.

7. The light emitting device package of claim 1, wherein the package substrate has a mounting surface where the light emitting device is arranged, and a back surface opposite to the mounting surface, and

wherein an entrance of the via hole located at the mounting surface is smaller than an entrance of the via hole located at the back surface.

8. The light emitting device package of claim 1, wherein the package substrate includes a sloped sidewall that limits the via hole.

9. The light emitting device package of claim 8, wherein the sloped sidewall converges toward the back surface from the mounting surface.

10. The light emitting device package of claim 1, wherein the light emitting device is arranged at a location that does not overlap with the via hole.

11. The light emitting device package of claim 1, further comprising:

a reflective film that covers a sidewall of the light emitting device in a space between the light emitting device and the fluorescence film.

12. A light emitting device package comprising:

a package substrate including a mounting surface, a back surface opposite to the mounting surface, and a first via hole and a second via hole that are respectively defined by a sloped sidewall extended to the back surface from the mounting surface;

a first electrode layer extending through the first via hole and along the mounting surface and the back surface;

a second electrode layer extending through the second via hole and along the mounting surface and the back surface;

a light emitting device arranged on at least one of the first electrode layer and the second electrode layer on the mounting surface of the package substrate; and

a fluorescence film including;

a first part that fills at least a part of an internal space of the first via hole,

a second part that fills at least a part of an internal space of the second via hole, and

a third part that covers at least a part of the light emitting device.

13. The light emitting device package of claim 12, wherein the light emitting device is arranged at a location that is spaced apart from the first via hole and the second via hole on the mounting surface.

14. The light emitting device package of claim 12, further comprising:

a first conductive junction layer that is formed between the light emitting device and the first electrode layer; and

a second conductive junction layer that is formed between the light emitting device and the second electrode layer.

15. The light emitting device package of claim 12, further comprising:

a conductive wire that is connected between at least one of the first electrode layer and the second electrode layer, and the light emitting device,

wherein the fluorescence film further includes a fourth part that covers at least a part of the conductive wire.

16. A light dimming system comprising:

a light emitting module;

a power supply for receiving power and supplying the power to the light emitting module; and

one or more light emitting device packages, each package including;

a package substrate in which a via hole is formed;

an electrode layer extending through the via hole and along both surfaces of the package substrate;

a light emitting device arranged on the package substrate and connected to the electrode layer; and

a fluorescence film including;

a first part that fills at least a part of an internal space of the via hole, and

a second part that covers at least a part of the light emitting device.

17. The system of claim 16, wherein the fluorescence film is integrally connected from the first part to the second part.

18. The system of claim 16, wherein the first part of the fluorescence film is positioned in a location that blocks an entrance of the via hole at an inside of the via hole.

19. The system of claim 16, further comprising:

a lens unit covering the light emitting device and the via hole,

wherein the lens unit includes a local protrusion unit that is protruded to an inside of the via hole and covers the first part of the fluorescence film.

20. The system of claim 16, wherein the fluorescence film includes:

a phosphor of a first volume %,

a polymer resin of a second volume % that is greater than the first volume %, and

filler particles of a third volume % that is smaller than the first volume %.