Three-dimensional antenna structure

• US 9,065,177 B2
• Filed: 01/05/2011
• Issued: 06/23/2015
• Est. Priority Date: 01/15/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Alexopoulos, Nicolaos G., Liu, Yunhong
• Primary Examiner(s): Purvis, Sue A
• Assistant Examiner(s): KIM, JAE K
• Application Number:
  US12/985,300
• Publication Number:
  US 20110095948A1
• Time in Patent Office: 1,630 Days
• Field of Search: 343/700.MS, 343/727, 343/893, 343/859, 343/793
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 5/00 Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements combinations of separate active antenna units operating in different wavebands and connected to a common feeder system H01Q21/30
• CPC Class Codes: H01Q 9/04 Resonant antennas
• CPC Class Codes: H01Q 9/065 Microstrip dipole antennas patch antenna H01Q9/0407
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407

Abstract

A three-dimensional antenna structure includes first and second antenna components and a via. The first antenna component is on a first layer of a substrate and the second antenna component is on a second layer of a substrate. The via couples the first antenna component to the second antenna component, wherein the first antenna overlaps, from a radial perspective, the second antenna component by an angle of overlap.

Claims

1. A three-dimensional antenna structure comprises:

a first antenna component with a first modified Polya curve pattern on a first layer of a substrate;

a second antenna component with a second modified Polya curve pattern on a second layer of a substrate, wherein at least one of the first and second modified Polya curve patterns comprises a modified Polya curve with constant width and shaping factor, but varying order; and

a via coupling the first antenna component to the second antenna component, wherein the first antenna component overlaps, from a radial perspective, the second antenna component by an angle of overlap.

2. The three-dimensional antenna structure of claim 1 further comprises:

the first antenna component having a first pattern in a first geometric shape; and

the second antenna component has a second pattern in a second geometric shape.

3. The three-dimensional antenna structure of claim 1 further comprises:

a modification of the angle of overlap to modify operating characteristics of the antenna structure based on physical characteristics of the first and second antenna components and on the angle of overlap.

4. The three-dimensional antenna structure of claim 1 comprises a monopole antenna.

5. The three-dimensional antenna structure of claim 1 comprises a dipole antenna.

6. The three-dimensional antenna structure of claim 1, wherein the substrate comprises at least one of:

an integrated circuit (IC) die;

an IC package substrate;

or

a printed circuit board.

7. The three-dimensional antenna structure of claim 1 further comprises:

a plurality of vias to couple the first antenna component to the second antenna component, wherein the plurality of vias includes the via.

8. The three-dimensional antenna structure of claim 1 further comprises:

the first antenna component including a plurality of the modified Polya curve patterned antenna elements; and

the second antenna component including one or more antenna elements.

9. The three-dimensional antenna structure of claim 1 further comprises:

a third antenna component on a third layer of the substrate; and

a second via to couple the third antenna component to the first or the second antenna component.

17. The three-dimensional antenna structure of claim 2, wherein at least one of the first and second geometric shapes comprises an orthogonal triangle.

18. The three-dimensional antenna structure of claim 2, wherein at least one of the first and second geometric shapes comprises a triangle with a length-to-area ratio in the range of 4-to-1 to 7-to-1.

10. A method of producing a three-dimensional antenna structure comprises:

forming a first antenna component with a first modified Polya curve pattern on a first layer of a substrate;

forming a second antenna component with a second modified Polya curve pattern on a second layer of a substrate, wherein at least one of the first and second modified Polya curve patterns comprises a modified Polya curve with constant width and shaping factor, but varying order; and

coupling the first antenna component to the second antenna component with at least one via, wherein the first antenna component overlaps, from a radial perspective, the second antenna component by an angle of overlap.

11. The method of claim 10 further comprises:

forming the first antenna component having a first pattern in a first geometric shape; and

forming the second antenna component has a second pattern in a second geometric shape.

12. The method of claim 10 further comprises:

modifying the angle of overlap to modify operating characteristics of the antenna structure based on physical characteristics of the first and second antenna components and on the angle of overlap.

13. The method of claim 10, wherein the substrate comprises at least one of:

an integrated circuit (IC) die;

an IC package substrate;

or

a printed circuit board.

14. The method of claim 10 further comprises:

coupling the first antenna component to the second antenna component with a plurality of vias, wherein the plurality of vias includes the via.

15. The method of claim 10 further comprises:

the first antenna component including a plurality of the modified Polya curve patterned antenna elements; and

the second antenna component including one or more antenna elements.

16. The method of claim 11, wherein at least one of the first and second geometric shapes comprises an orthogonal triangle.