Partitioned hybrid substrate for radio frequency applications

• US 9,066,424 B2
• Filed: 07/15/2013
• Issued: 06/23/2015
• Est. Priority Date: 07/15/2013
• Status: Expired due to Fees

• Current Assignee: Hong Kong Applied Science And Technology Research Institute Co., Ltd.
• Original Assignee: Hong Kong Applied Science And Technology Research Institute Co., Ltd.
• Inventors: Yang, Dan, He, Song, Ren, Yuxing, Shi, Xunqing
• Primary Examiner(s): Aychillhum, Andargie M
• Application Number:
  US13/941,554
• Publication Number:
  US 20150016078A1
• Time in Patent Office: 708 Days
• Field of Search: 361/761, 361/748, 205/125
• US Class Current: 1/1
• CPC Class Codes: C23C 28/40 Coatings including alternating layers following a pattern, a periodic or defined repetition
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/0723 provided by an inner layer of PCB
• CPC Class Codes: H05K 2201/09136 Means for correcting warpage
• CPC Class Codes: H05K 2201/09536 Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• CPC Class Codes: H05K 2201/09981 Metallised walls
• CPC Class Codes: H05K 2201/10015 : Non-printed capacitor
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor
• CPC Class Codes: H05K 2201/1006 : Non-printed filter
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 3/0058 : Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/007 : Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/0097 : Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/429 : Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4688 : Composite multilayer circuits, i.e. comprising insulating layers having different properties having a special base or central core H05K3/4602
• CPC Class Codes: Y10T 156/1057 : Subsequent to assembly of laminae

Abstract

The presently claimed invention is to provide a package for compact RF signal system, and a method to form the package thereof in order to miniaturize the size of package, improve signal integrity, and reduce manufacturing cost. The package comprises a hybrid substrate with a sandwiched structure, in which the hybrid substrate comprises an upper layer and a lower layer with different dielectric properties being separated by an interposer for improving electrical isolation and mechanical stiffness. Metal layers are formed on the sidewalls of the opening to surround an active component, such that the metal sidewalls together with two ground plates in the upper and lower layers constitute a self-shielding enclosure inside the package to protect the active component.

Claims

1. A package for compact radio frequency signal system, comprising:

a hybrid substrate with a sandwiched structure, and the hybrid substrate comprising a first dielectric layer and a second dielectric layer being separated by an interposer;

wherein the first dielectric layer, located on one side of the interposer, with a first value of loss tangent carries one or more first components operable for transmitting radio frequency signal of at least one active component to at least one antenna arranged on top of the first dielectric layer;

wherein the second dielectric layer, located on another side of the interposer, with a second value of loss tangent carries one or more second components operable for transmitting low frequency signal of at least one active component to at least one outside circuit;

wherein the at least one active component is embedded in the hybrid substrate; and

wherein the first value of loss tangent is lower than the second value of loss tangent;

wherein at least one opening is formed through the interposer, and the active component is configured in the opening between the first and second dielectric layers, wherein at least one metal layer is formed on sidewalls of the opening to surround the active component, such that the metal sidewalls connecting with at least one first ground plate in the first dielectric layer and at least one second ground plate in the second dielectric layer constitute a self-shielding enclosure inside the package to protect the active component.

2. The package of claim 1, wherein the active component includes a radio frequency integrated circuit chip, power management chip or digital signal chip.

3. The package of claim 1, wherein the first value of loss tangent is lower than 0.01, and the second value of loss tangent is in between 0.01 and 1.

4. The package of claim 1, wherein a first value of relative permittivity of the first dielectric layer is higher than a second value of relative permittivity of the second dielectric layer.

5. The package of claim 1, wherein inputs/outputs of the active component are fan-out through bumpless interconnects.

6. The package of claim 1, wherein the first components operable for transmitting radio frequency signal comprise at least one balun or coupler or filter.

7. The package of claim 1, wherein the second components operable for transmitting low frequency signals are further used for transmitting power and digital signals.

8. The package of claim 1, wherein the second components for transmitting low frequency signal comprise at least one capacitor or inductor.

9. The package of claim 1, wherein the first dielectric layer is made from ceramic-polytetrafluoroethylene composite, the interposer is made from epoxy with fiberglass, and the second dielectric layer is made from polyimide.

10. The package of claim 1, wherein the first dielectric layer further comprises a region with a dielectric material being different from that of the first dielectric layer, where at least one decoupling capacitor is embedded, which is located close to inputs/outputs of the active component.

11. The package of claim 1, wherein the at least one active component is configured in the first dielectric layer.

12. The package of claim 1, wherein the at least one active component is configured in the second dielectric layer.

13. A package for compact radio frequency signal system, comprising:

a first dielectric layer having a first value of loss tangent;

a second dielectric layer having a second value of loss tangent located on one side of the first dielectric layer; and

at least one active component positioned inside the second dielectric layer;

wherein the first dielectric layer carries one or more first components operable for transmitting radio frequency signal of the active component to at least one antenna arranged on top of the first dielectric layer;

wherein the second dielectric layer carries one or more second components operable for transmitting low frequency signal of the active component to at least one outside circuit; and

wherein the first value of loss tangent is lower than the second value of loss tangent, wherein at least one metal layer is formed on sidewalls of the opening to surround the active component, such that the metal sidewalls connecting with at least one first ground plate in the first dielectric layer and at least one second ground plate in the second dielectric layer constitute a self-shielding enclosure inside the package to protect the active component.