Partitioned hybrid substrate for radio frequency applications
First Claim
1. A package for compact radio frequency signal system, comprising:
- a hybrid substrate with a sandwiched structure, and the hybrid substrate comprising a first dielectric layer and a second dielectric layer being separated by an interposer;
wherein the first dielectric layer, located on one side of the interposer, with a first value of loss tangent carries one or more first components operable for transmitting radio frequency signal of at least one active component to at least one antenna arranged on top of the first dielectric layer;
wherein the second dielectric layer, located on another side of the interposer, with a second value of loss tangent carries one or more second components operable for transmitting low frequency signal of at least one active component to at least one outside circuit;
wherein the at least one active component is embedded in the hybrid substrate; and
wherein the first value of loss tangent is lower than the second value of loss tangent;
wherein at least one opening is formed through the interposer, and the active component is configured in the opening between the first and second dielectric layers, wherein at least one metal layer is formed on sidewalls of the opening to surround the active component, such that the metal sidewalls connecting with at least one first ground plate in the first dielectric layer and at least one second ground plate in the second dielectric layer constitute a self-shielding enclosure inside the package to protect the active component.
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Accused Products
Abstract
The presently claimed invention is to provide a package for compact RF signal system, and a method to form the package thereof in order to miniaturize the size of package, improve signal integrity, and reduce manufacturing cost. The package comprises a hybrid substrate with a sandwiched structure, in which the hybrid substrate comprises an upper layer and a lower layer with different dielectric properties being separated by an interposer for improving electrical isolation and mechanical stiffness. Metal layers are formed on the sidewalls of the opening to surround an active component, such that the metal sidewalls together with two ground plates in the upper and lower layers constitute a self-shielding enclosure inside the package to protect the active component.
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Citations
13 Claims
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1. A package for compact radio frequency signal system, comprising:
- a hybrid substrate with a sandwiched structure, and the hybrid substrate comprising a first dielectric layer and a second dielectric layer being separated by an interposer;
wherein the first dielectric layer, located on one side of the interposer, with a first value of loss tangent carries one or more first components operable for transmitting radio frequency signal of at least one active component to at least one antenna arranged on top of the first dielectric layer;
wherein the second dielectric layer, located on another side of the interposer, with a second value of loss tangent carries one or more second components operable for transmitting low frequency signal of at least one active component to at least one outside circuit;
wherein the at least one active component is embedded in the hybrid substrate; and
wherein the first value of loss tangent is lower than the second value of loss tangent;
wherein at least one opening is formed through the interposer, and the active component is configured in the opening between the first and second dielectric layers, wherein at least one metal layer is formed on sidewalls of the opening to surround the active component, such that the metal sidewalls connecting with at least one first ground plate in the first dielectric layer and at least one second ground plate in the second dielectric layer constitute a self-shielding enclosure inside the package to protect the active component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
- a hybrid substrate with a sandwiched structure, and the hybrid substrate comprising a first dielectric layer and a second dielectric layer being separated by an interposer;
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13. A package for compact radio frequency signal system, comprising:
- a first dielectric layer having a first value of loss tangent;
a second dielectric layer having a second value of loss tangent located on one side of the first dielectric layer; and
at least one active component positioned inside the second dielectric layer;
wherein the first dielectric layer carries one or more first components operable for transmitting radio frequency signal of the active component to at least one antenna arranged on top of the first dielectric layer;
wherein the second dielectric layer carries one or more second components operable for transmitting low frequency signal of the active component to at least one outside circuit; and
wherein the first value of loss tangent is lower than the second value of loss tangent, wherein at least one metal layer is formed on sidewalls of the opening to surround the active component, such that the metal sidewalls connecting with at least one first ground plate in the first dielectric layer and at least one second ground plate in the second dielectric layer constitute a self-shielding enclosure inside the package to protect the active component.
- a first dielectric layer having a first value of loss tangent;
Specification