Heat dissipation for a chip protected by an anti-tamper background
First Claim
Patent Images
1. An electronic device comprising:
- a circuit board having one or more electronics mounted thereon;
a housing surrounding the circuit board, the housing comprising at least a first part attached to a second part, wherein the circuit board is mounted to the second part;
a security shield integrated into the first part of the housing and covering the one or more electronics on the circuit board, wherein the one or more electronics are coupled to the security shield, wherein the one or more electronics sense tampering by detecting a change in the security shield, wherein the one or more electronics zeroize data stored in a memory device covered by the security shield in response to such tampering, wherein the one or more electronics include a chip, and the security shield defines an aperture; and
a heat sink extending through the aperture and thermally conductively coupling with the chip, the heat sink extending outside of the security shield.
1 Assignment
0 Petitions
Accused Products
Abstract
Systems and apparatus disclosed herein provide for heat dissipation from a chip protected by an anti-tamper material. An example electronic device includes a circuit board having electronics mounted thereon, and a security shield covering one or more electronics on the circuit board and configured to sense tampering, the one or more electronics including a chip, the security shield defining an aperture. The device also includes a heat sink extending through the aperture and thermally coupling with the chip, the heat sink extending outside of the security shield.
-
Citations
20 Claims
-
1. An electronic device comprising:
-
a circuit board having one or more electronics mounted thereon; a housing surrounding the circuit board, the housing comprising at least a first part attached to a second part, wherein the circuit board is mounted to the second part; a security shield integrated into the first part of the housing and covering the one or more electronics on the circuit board, wherein the one or more electronics are coupled to the security shield, wherein the one or more electronics sense tampering by detecting a change in the security shield, wherein the one or more electronics zeroize data stored in a memory device covered by the security shield in response to such tampering, wherein the one or more electronics include a chip, and the security shield defines an aperture; and a heat sink extending through the aperture and thermally conductively coupling with the chip, the heat sink extending outside of the security shield. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method of manufacturing an electronic device, the method comprising:
-
forming a first and second part of a housing; forming a heat sink including a projection; attaching an anti-tamper material to the heat sink such that the anti-tamper material surrounds the projection and the projection extends through the anti-tamper material, wherein the anti-tamper material senses tampering; attaching the heat sink and the anti-tamper material to the first part of the housing; attaching a circuit board to the second part of the housing;
thermally conductively coupling the projection of the heat sink to a chip on the circuit board, wherein data on the circuit board is zeroized in response to tampering; and
connecting the first and second part of the housing to cover the circuit board. - View Dependent Claims (10, 11, 12)
-
-
13. An electronic device comprising:
-
a circuit board having a chip and other electronics mounted thereon; a housing surrounding the circuit board, the housing comprising at least a first part attached to a second part, wherein the circuit board is mounted to the second part; a heat sink integrated into the first part of the housing and thermally coupled to the chip, the heat sink have an inner surface opposite the chip; and an anti-tamper material attached to the inner surface of the heat sink, the anti-tamper material disposed to provide tamper protection for the chip, wherein the anti-tamper material senses tampering, wherein data on the circuit board is zeroized in response to tampering, wherein the heat sink extends through the anti-tamper material to thermally couple with the chip. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
-
Specification