Power electronic system and method of assembly

• US 9,066,453 B2
• Filed: 03/06/2013
• Issued: 06/23/2015
• Est. Priority Date: 03/06/2012
• Status: Expired due to Fees

• Current Assignee: Mission Motor Company (Vayon Holdings Ltd.)
• Original Assignee: Mission Motor Company (Vayon Holdings Ltd.)
• Inventors: Wagner, Jon, Nichols, Geoff
• Primary Examiner(s): Datskovskiy, Michail V
• Application Number:
  US13/787,581
• Publication Number:
  US 20130235527A1
• Time in Patent Office: 839 Days
• Field of Search: 361/679.46, 361/679.53, 361/679.54, 361/688, 361/689, 361/698, 361/699, 361700-712, 361/715, 361/719, 361760-768, 165/80.2, 165/80.3, 165/80.4, 165/80.5, 165/104.19, 165/104.33, 165/104.34, 165/185, 622/592, 257706-727, 174/15.1, 174/16.3, 174/252, 174/520, 363/64, 363/65, 363/56.02, 363141-147, 363/137, 307/11, 307/38, 307/9.1, 307/10.1, 307/43, 307/82, 307/115
• US Class Current: 1/1
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A power electronic system including a casing encapsulating a circuit board and multiple power electronic components mounted to a first broad face of the circuit board. The casing includes a case body, a first lid, and a second lid. The case body includes a cooling channel region including a cooling plate having a first and second broad face, cooling features extending from the cooling plate first broad face, and a cooling block extending from the cooling plate second broad face. The case body further includes a first access gap defined through the case body. The circuit board is mounted to the casing with the first broad face proximal the cooling plate second broad face. The power electronic system additionally includes a connector that extends from the case exterior to connect to the circuit board first broad face, wherein connector connection is facilitated by the first access gap.

Claims

1. A power electronic system, comprising:

a casing comprising;

a case body comprising;

a cooling channel region partially defining a cooling channel, the cooling channel region comprising;

a cooling plate having a first and a second opposing broad face, the first broad face adjacent the cooling channel, cooling features extending from the first broad face of the cooling plate, and a cooling block extending from the second broad face of the cooling plate, the case body further comprising a first access gap defined through the case body;

a first lid that mounts to the case body proximal the first broad face of the cooling plate and cooperatively defines the cooling channel with the case body;

a second lid that mounts to the case body proximal the second broad face of the cooling plate;

a coolant inlet and a coolant outlet fluidly connected to the cooling channel;

a circuit board having a first and a second broad face, wherein the first broad face of the circuit board is mounted to the case body proximal the second broad face of the cooling plate between the case body and the second lid;

a primary electronic component mounted to the first broad face of the circuit board;

a cooling receptacle cooperatively enclosing the passive electronic component with the first broad face of the circuit board, the cooling receptacle thermally connected to the second broad face of the cooling plate;

a secondary electronic component mounted to the first broad face of the circuit board, the secondary electric component thermally connected to the cooling block along a first broad face of the secondary electronic component; and

a retention mechanism extending through a circuit board thickness from the second broad face of the circuit board to bias the secondary electronic component against the cooling block.

2. The system of claim 1, wherein the case body further comprises a second access gap defined through the case body.

3. The system of claim 2, wherein the cooling channel region is located between the first and second access gaps in the case body, wherein the cooling channel region, first access gap, and second access gap comprise a first, second, and third longitudinal axis, respectively, wherein the cooling channel region, first access gap, and second access gap are aligned with the first, second, and third longitudinal axis parallel to a longitudinal axis of the case body.

4. The system of claim 2, further comprising a second primary component mounted to the first broad face of the circuit board, wherein the second primary component extends through the second access gap and thermally connects to the first lid.

5. The system of claim 1, wherein the circuit board comprises a connector pin mounted to the first face of the circuit board, wherein the connector pin is aligned with the first access gap.

6. The system of claim 5, wherein the system further comprises a connector that extends from a casing exterior through the first access gap to connect to the connector pin.

7. The system of claim 6, wherein the connector extends from a casing wall of the case body that defines the first access gap and the coolant inlet and the coolant outlet extend from the case body adjacent the connector.

8. The system of claim 1, further comprising a thermally conductive potting compound surrounding the primary electronic component within the cooling receptacle.

9. The system of claim 1, wherein the cooling features comprise a plurality of fins extending longitudinally along the cooling channel.

10. The system of claim 1, wherein the first broad face of the secondary electronic component comprises a thermal interface thermally connecting the secondary electronic component to the cooling block.

11. The system of claim 1, wherein the cooling receptacle comprises a thermal interface thermally connecting the cooling receptacle to the second broad face of the cooling plate.

12. The system of claim 1, wherein the retention mechanism comprises a clip comprising two tines connected by an intermediary section, wherein the two tines extend through a first and second hole in the circuit board and the intermediary section is braced against the second broad face of the circuit board.

13. The system of claim 12, further comprising a clip insulator between the intermediary section and the second broad face of the circuit board.

14. The system of claim 12, wherein the system further comprises a second secondary electronic component, wherein the first tine biases the first secondary electronic component against a first broad face of the cooling block and the second tine biases the second secondary electronic component against a second broad face of the cooling block, the first broad face of the cooling block opposing the second broad face of the cooling block.

15. The system of claim 1, wherein the cooling block has substantially constant thickness in a dimension parallel to the cooling plate.

16. The system of claim 15, wherein the cooling block comprises a first and a second broad face, the first broad face of the cooling block opposing the second broad face of the cooling block, and a first and a second convex face connecting the first and second broad faces of the cooling block.

17. The system of claim 1, wherein the system further comprises a second secondary electronic component opposing the first secondary electronic component across the cooling block, wherein a first and second lateral axis of the first and second secondary electronic components, respectively, are aligned substantially equidistant and parallel to a longitudinal axis of the primary component, wherein the longitudinal axis of the primary component is substantially parallel to a longitudinal axis of the cooling channel.

18. The system of claim 1, wherein the secondary electronic component comprises an active electronic component, and the primary electronic component comprises a passive electronic component.

19. A power electronic system, comprising:

a casing comprising;

a case body defining;

a cooling channel encapsulating a plurality of cooling features extending from a first broad face of a cooling plate and a cooling block extending from a second broad face of the cooling plate, the second broad face opposing the first broad face, a first access gap, defined through a case body thickness, having a first and second opening, and a second access gap, defined through the case body thickness, having a first and second opening;

a first lid that mounts to the case body and seals the second openings of the first and second access gaps, the first lid thermally connected to the cooling channel;

a second lid that mounts to the case body proximal the first openings of the first and second access gaps;

a circuit board having a first and a second broad face, the circuit board mounted between the case body and the second lid with the first broad face of the circuit board mounted to the case body, the circuit board extending over the cooling channel, first access gap, and second access gap, the circuit board comprising;

a connector pin mounted to the first broad face of the circuit board, the connector pin aligned with the first access gap;

an active electronic component mounted to the first broad face of the circuit board, the active electronic component thermally connected to the cooling block;

a passive electronic component mounted to the first broad face of the circuit board, the passive electronic component aligned with the second access gap; and

a connector that extends from an exterior of a case body wall defining the first access gap through the first access gap and connects to the connector pin.

20. The system of claim 19, wherein the cooling channel is cooperatively defined between the case body and the first lid.

21. The system of claim 19, wherein the passive electronic component extends through the second access gap and thermally couples to the first lid.

22. The system of claim 19, further comprising a clip extending through the circuit board from the second broad face that retains a broad face of the active electronic component against a broad face of the cooling block.

23. The system of claim 19, further comprising a cooling receptacle encapsulating a second passive electronic component, wherein the cooling receptacle is mounted to the first broad face of the circuit board and thermally connects to the second broad face of the cooling plate.

24. The system of claim 23, further comprising a second cooling receptacle encapsulating a third passive electronic component mounted to the first broad face of the circuit board;

a second, third, and fourth active electronic component mounted to the first broad face of the circuit board; and

a second cooling block extending from the second broad face of the cooling plate;

wherein the first active electronic component opposes the second active electronic component across the first cooling block and the third active electronic component opposes the fourth active electronic component across the second cooling block, wherein a lateral axis of the first active electronic component is aligned with a lateral axis of the third active electronic component and a lateral axis of the second active electronic component is aligned with a lateral axis of the fourth active electronic component, wherein the lateral axes of the first, second, third, and fourth active electronic components are substantially parallel and equidistant to a centerline extending along longitudinal axes of the first and third passive electronic components.

25. The system of claim 24, wherein the second and third passive electronic components comprise magnetic devices and the first passive electronic component comprises an electrical charge storage device.

27. The method of claim 25, further comprising fluidly connecting the cooling channel to a coolant source.

26. A method of assembling a power electronic system, comprising:

assembling a cooling receptacle encapsulating a primary element encased within a potting compound to a first broad face of a circuit board;

assembling a secondary electronic component to the first broad face of the circuit board at an angle to a normal vector to the first broad face of the circuit board;

mounting the first broad face of the circuit board to a first side of a case body, the case body comprising;

a cooling channel comprising a plurality of cooling features, the cooling channel defined on a second side of the case body opposing the first side, a cooling block extending from the first side of from the first side to the second side of the case body, the first access gap adjacent the cooling channel along a case body width, and a second access gap extending from the first side to the second side of the case body, the second access gap opposing the first access gap across the cooling channel;

inserting a retention mechanism from a second face of the circuit board, through the circuit board, to the first face of the circuit board to bias and thermally connect the secondary electronic component against the cooling block;

mounting a second lid to the first side of the case body and encapsulating the circuit board between the second lid and the case body;

connecting a connector from an exterior of the case body to the circuit board through the second access gap; and

mounting a first lid to the second side of the case body to seal an end of the first and second access gaps.