CMP pad dressers with hybridized abrasive surface and related methods

• US 9,067,301 B2
• Filed: 03/11/2013
• Issued: 06/30/2015
• Est. Priority Date: 05/16/2005
• Status: Expired due to Fees

• Current Assignee: Kinik Company
• Original Assignee: Kinik Company
• Inventors: Sung, Chien-Min
• Primary Examiner(s): RACHUBA, MAURINA T
• Application Number:
  US13/794,164
• Publication Number:
  US 20130303056A1
• Time in Patent Office: 841 Days
• Field of Search: 451/41, 451/56, 451/443, 451/444, 512/95, 513/00
• US Class Current: 1/1
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24D 3/007 the constituent being used as bonding agent between different parts of an abrasive tool

Abstract

A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

Claims

1. A CMP pad conditioner, comprising:

a plurality of particle abrasive segments, each particle abrasive segment including;

a particle segment blank; and

an abrasive layer attached to the particle segment blank, the abrasive layer including a plurality of superabrasive particles each having a working end with a tip that aligns along a designated profile and varies from the profile by about 1 micron to about 150 microns; and

a pad conditioner substrate;

each of the particle abrasive segments being permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layers as the pad conditioner and the CMP pad are moved relative to one another.

2. The pad conditioner of claim 1, wherein the tips of the superabrasive particles vary from the profile by about 20 microns to about 100 microns.

3. The pad conditioner of claim 1, wherein the tips of the superabrasive particles vary from the profile by less than about 20 microns.

4. The pad conditioner of claim 1, wherein the tips of the superabrasive particles vary from the profile by less than about 10 microns.

5. The pad conditioner of claim 1, wherein the superabrasive particles of each of the abrasive layers form an abrasive surface or point, and wherein the abrading surfaces or points are leveled relative to one another such that no abrading surface or point protrudes above another abrading surface or point by more than about 5 microns to about 50 microns.

6. The pad conditioner of claim 5, wherein no abrading surface or point protrudes above another abrading surface or point by more than about 30 microns.

7. The pad conditioner of claim 1, wherein the abrasive layers are attached to the particle segment blanks with an organic material layer including a member selected from the group consisting of:

amino resins, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenolic resins, phenolic/latex resins, epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins, perylene resins, polysulfone resins, acrylonitrile-butadiene-styrene resins, acrylic resins, polycarbonate resins, polyimide resins, and combinations thereof.

8. The pad conditioner of claim 1, wherein the abrasive layers are attached to the particle segment blanks with a brazing alloy.

9. The pad conditioner of claim 1, wherein the particle abrasive segments are attached to the conditioner substrate with an organic material layer including a member selected from the group consisting of:

amino resins, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenolic resins, phenolic/latex resins, epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins, perylene resins, polysulfone resins, acrylonitrile-butadiene-styrene resins, acrylic resins, polycarbonate resins, polyimide resins, and combinations thereof.

10. The pad conditioner of claim 1, wherein the particle abrasive segments are attached to the conditioner substrate with a brazing alloy.

11. The pad conditioner of claim 8, wherein the particle segment blanks are attached to the conditioner substrate with an organic material layer.

12. The pad conditioner of claim 11, wherein the organic material layer is a member selected from the group consisting of:

amino resins, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenolic resins, phenolic/latex resins, epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins, perylene resins, polysulfone resins, acrylonitrile-butadiene-styrene resins, acrylic resins, polycarbonate resins, polyimide resins, and combinations thereof.

13. A method of conditioning a CMP pad surface, comprising:

engaging a pad conditioner as recited in claim 1 against a CMP pad surface; and

moving the pad conditioner and the CMP pad surface relative to one another, such that superabrasive particle tips in an abrasive layer of the pad conditioner furrow the CMP pad surface.

14. A method of forming a CMP pad conditioner, comprising:

positioning a plurality of particle abrasive segments as in claim 1 in an arrangement on a face of a pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layers as the pad conditioner and the CMP pad are moved relative to one another; and

permanently affixing the plurality of particle abrasive segments to the pad conditioner substrate.

15. The method of claim 14, wherein the plurality of particle abrasive segments are attached to the conditioner substrate with an organic material layer including a member selected from the group consisting of:

amino resins, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenolic resins, phenolic/latex resins, epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins, perylene resins, polysulfone resins, acrylonitrile-butadiene-styrene resins, acrylic resins, polycarbonate resins, polyimide resins, and combinations thereof.

16. The method of claim 14, wherein the plurality of particle abrasive segments are attached to the conditioner substrate with a brazing alloy.

17. The method of claim 14, wherein the plurality of particle abrasive segments are leveled with respect to one another using a reverse casting technique.

18. The method of claim 17, wherein no abrading surface or point protrudes above another abrading surface or point by more than about 30 microns.