MEMS device, electronic module, electronic apparatus, and mobile unit

• US 9,067,777 B2
• Filed: 07/15/2013
• Issued: 06/30/2015
• Est. Priority Date: 07/23/2012
• Status: Expired due to Fees

• Current Assignee: Columbia Peak Ventures, LLC (Dominion Harbor Enterprises, LLC)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Furuhata, Makoto, Tanaka, Satoru
• Primary Examiner(s): Nguyen, Cuong Q
• Assistant Examiner(s): Yasmeen, Nishath
• Application Number:
  US13/941,892
• Publication Number:
  US 20140021562A1
• Time in Patent Office: 715 Days
• Field of Search: 257414-417
• US Class Current: 1/1
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 3/0018 Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
• CPC Class Codes: B81B 3/0086 Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
• CPC Class Codes: B81B 7/0006 Interconnects

Abstract

A MEMS device includes: a base substrate; a first wiring disposed on the base substrate using a first structure; a second wiring disposed on the base substrate using the first structure and a second structure connected to the first structure; and a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other, and at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other.

Claims

1. A MEMS device comprising:

a base substrate;

a first wiring disposed on the base substrate using a first structure, wherein a groove portion is disposed on the base substrate, and the first structure is disposed in the groove portion;

a second wiring disposed on the base substrate using the first structure and a second structure connected to the first structure; and

a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein

the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other,

at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other, and

the groove portion at the crossing portion is deeper than the groove portion at the other portions.

2. The MEMS device according to claim 1, wherein

the width of the second structure at the crossing portion is narrower than that of the second structure at the other portions.

3. The MEMS device according to claim 1, wherein

the first structure includes metal, and

the second structure includes silicon.

4. An electronic module comprising the MEMS device according to claim 1 mounted thereon.

5. An electronic apparatus comprising the MEMS device according to claim 1 mounted thereon.

6. A mobile unit comprising the MEMS device according to claim 1 mounted thereon.

7. A MEMS device comprising:

a base substrate;

a first wiring disposed on the base substrate using a first structure, wherein a groove portion is disposed on the base substrate, and the first structure is disposed in the groove portion;

a second wiring disposed on the base substrate using the first structure and a second structure connected to the first structure; and

a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein

the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other,

at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other, and

the second structure is not disposed in the groove portion at the crossing portion.

8. A MEMS device comprising;

a base substrate;

a first wiring disposed on the base substrate using a first structure;

a second wiring disposed on the base substrate using a second structure; and

a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein

the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other, and

at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other, wherein

a groove portion is disposed on the base substrate, and the first structure is disposed in the groove portion and the second structure is not disposed in the groove portion at least at the crossing portion.

9. The MEMS device according to claim 8, wherein

the groove portion at the crossing portion is deeper than the groove portion at the other portions.

10. The MEMS device according to claim 8, wherein

the width of the second structure at the crossing portion is narrower than that of the second structure at the other portions.

11. The MEMS device according to claim 8, wherein

the first structure includes metal, and

the second structure includes silicon.

12. An electronic module comprising the MEMS device according to claim 8 mounted thereon.

13. An electronic apparatus comprising the MEMS device according to claim 8 mounted thereon.

14. A mobile unit comprising the MEMS device according to claim 8 mounted thereon.