Accommodation of different type of sensors in vibration monitoring system using external input or daughter board with interchangeable operating hardware

• US 9,068,880 B2
• Filed: 01/08/2013
• Issued: 06/30/2015
• Est. Priority Date: 01/08/2013
• Status: Active Grant

• Current Assignee: Baker Hughes Holdings LLC (Baker Hughes Company)
• Original Assignee: General Electric Company
• Inventors: Acharya, Parag Vishwanath, Neje, Shriniwas Ananda, Sajja, Sivanagabhushanam
• Primary Examiner(s): Saint Surin, J M
• Application Number:
  US13/736,185
• Publication Number:
  US 20140190265A1
• Time in Patent Office: 903 Days
• Field of Search: 736/49
• US Class Current: 1/1
• CPC Class Codes: G01H 11/00 Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties

Abstract

An apparatus and method for a monitoring system for operating equipment is provided. The monitoring system includes a first sensor having first operating parameters. A first printed circuit board includes an electrical circuit and signal processing hardware. A first sensor is in electrical communication with a second printed circuit board and the second printed circuit board includes signal processing hardware configured to process the signal. The second printed circuit board is in electrical communication with the first printed circuit board through a connector. The connector is configured to permit insertion and removal of a third printed circuit board to operate a second sensor having second operating parameters that differ from the first operating parameters of the first sensor. In another aspect, the first printed circuit board includes no processing circuit, the first printed circuit board includes an analog-to-digital hardware circuit, processor, controller or microprocessor and an output circuit.

Claims

1. A monitoring system including:

a first sensor having first operating parameters, wherein the first sensor is configured to monitor a condition and create a signal;

a first printed circuit board, wherein the first printed circuit board includes an electrical circuit and signal processing hardware;

a connector in electrical communication with the first printed circuit board; and

a second printed circuit board;

wherein the first sensor is in electrical communication with the second printed circuit board, the second printed circuit board including signal processing hardware configured to process the signal;

the connector is configured to selectively place the second printed circuit board in electrical communication with the first printed circuit board through the connector, wherein the connector is configured to permit removal of the second printed circuit board and insertion of a third printed circuit board to operate a second sensor having second operating parameters that differ from the first operating parameters of the first sensor.

2. The monitoring system according to claim 1, wherein the first sensor is a vibration sensor.

3. The monitoring system according to claim 2, wherein the second sensor is a vibration sensor.

4. The monitoring system according to claim 1, wherein the connector is a jumper on the first printed circuit board.

5. The monitoring system according to claim 1, further including a set of connections on the first printed circuit board configured to provide an intrinsically safe connection between the first printed circuit board and the first sensor.

6. The monitoring system according to claim 1, further including a junction box between the first printed circuit board and the first sensor.

7. A monitoring system including:

a first sensor having first operating parameters, wherein the first sensor is configured to monitor a condition and create a signal;

a first printed circuit board, wherein the first printed circuit board includes no signal processing hardware, including no power conditioner, filter, amplifier/attenuator, or bias, the first printed circuit board includes an analog-to-digital hardware circuit and an output circuit;

a connector in electrical communication with the first printed circuit board; and

a second printed circuit board;

wherein the first sensor is in electrical communication with the second printed circuit board, the second printed circuit board including signal processing hardware configured to process the signal;

the connector is configured to selectively place the second printed circuit board in electrical communication with the first printed circuit board through the connector, wherein the connector is configured to permit insertion and removal of a third printed circuit board to operate a second sensor having second operating parameters that differ from the first operating parameters of the first sensor.

8. The monitoring system according to claim 7, wherein the first sensor is a vibration sensor.

9. The monitoring system according to claim 8, wherein the second sensor is a vibration sensor.

10. The monitoring system according to claim 7, wherein the connector is a jumper on the first printed circuit board.

11. The monitoring system according to claim 7, further including a set of connections on the first printed circuit board configured to provide an intrinsically safe connection between the first printed circuit board and the first sensor.

12. The monitoring system according to claim 7, further including a junction box between the first printed circuit board and the first sensor.

13. A method of monitoring a condition of operating equipment including:

providing at least one piece of operating equipment; and

monitoring a condition of the piece of operating equipment using a monitoring system including a first sensor having first operating parameters, wherein the first sensor is configured to monitor the condition and create a signal,

a first printed circuit board, wherein the first printed circuit board includes an electrical circuit and signal processing hardware,

a connector in electrical communication with the first printed circuit board, a second printed circuit board, wherein the first sensor is in electrical communication with the second printed circuit board, the second printed circuit board including signal processing hardware configured to process the signal,

the connector is configured to selectively place the second printed circuit board in electrical communication with the first printed circuit board through the connector, wherein the connector is configured to permit insertion and removal of a third printed circuit board to operate a second sensor having second operating parameters that differ from the first operating parameters of the first sensor.

14. The monitoring system according to claim 13, wherein the first sensor is a vibration sensor.

15. The monitoring system according to claim 14, wherein the second sensor is a vibration sensor.

16. The monitoring system according to claim 13, wherein the connector is a jumper on the first printed circuit board.

17. The monitoring system according to claim 13, further including a set of connections on the first printed circuit board configured to provide an intrinsically safe connection between the first printed circuit board and the first sensor.

18. The monitoring system according to claim 13, further including a junction box between the first printed circuit board and the first sensor.