Composite sensor for detecting angular velocity and acceleration

• US 9,069,000 B2
• Filed: 10/02/2008
• Issued: 06/30/2015
• Est. Priority Date: 10/10/2007
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: Ohkoshi, Hideo
• Primary Examiner(s): Lim, Steven
• Assistant Examiner(s): Yacob, Sisay
• Application Number:
  US12/679,412
• Publication Number:
  US 20100194577A1
• Time in Patent Office: 2,462 Days
• Field of Search: 340/669, 340/500, 340/540, 340/670, 340/671, 734/88, 734/93, 200/52.R, 200 6145 R- 6147, 429/436, 429/463, 257/414, 257/415, 257/723, 257/724, 257/734, 257/777, 257/778, 257/787, 257/790, 257/E27.122
• US Class Current: 1/1
• CPC Class Codes: G01C 19/5607 using vibrating tuning forks double-ended tuning forks using planar vibrating masses suspended at opposite ends G01C19/5719
• CPC Class Codes: G01C 21/10 by using measurements of speed or acceleration G01C21/24, G01C21/26 take precedence
• CPC Class Codes: G01P 1/02 Housings
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/00 Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 3/00 Measuring linear or angular speed; Measuring differences of linear or angular speeds G01P5/00 - G01P11/00 take precedence; direction and speed indication G01P13/045; counting mechanisms G06M
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A composite sensor for detecting angular velocity and acceleration includes an angular velocity detecting element, an acceleration detecting element, an angular velocity signal processing IC, an acceleration signal processing IC, and a housing. The housing is formed of a multilayered circuit board and accommodates the angular velocity detecting element, the acceleration detecting element, the angular velocity signal processing IC, and the acceleration signal processing IC. The housing connects the angular velocity detecting element electrically to the angular velocity signal processing IC, and also connects the acceleration detecting element electrically to the acceleration signal processing IC.

Claims

1. A composite sensor comprising:

a first sensing element;

a second sensing element;

a first IC configured to process an output signal supplied from the first sensing element;

a second IC configured to process an output signal supplied from the second sensing element, and placed over the first IC; and

a package having a first electrode, a second electrode, and an inner bottom face, the package accommodating the first sensing element, the second sensing element, the first IC, and the second IC,

wherein the first electrode is directly connected to the first IC via a first conductor and the second electrode is directly connected to the second IC via a second conductor,

wherein the first electrode and the second electrode are disposed on the package,

wherein the second conductor is a metal wire which is separate from the package, and

wherein when viewed in a direction parallel to the inner bottom face of the package, a length of an upper side of a sectional shape of the second IC is shorter than a length of an upper side of a sectional shape of the first IC.

2. The composite sensor according to claim 1, wherein

when viewed in a direction parallel to the inner bottom face of the package, each of the second IC and the first IC is without a hollow region.

3. The composite sensor according to claim 1, wherein

a thickness of the second IC is smaller than a thickness of the first IC.

4. The composite sensor according to claim 1, wherein

the second electrode has gold.

5. The composite sensor according to claim 1, wherein

the first electrode has gold, and

the second electrode has gold.

6. The composite sensor according to claim 1, wherein

the first sensing element is an angular velocity detecting element capable of detecting angular velocity, and

the second sensing element is an acceleration detecting element capable of detecting acceleration.

7. The composite sensor according to claim 1, wherein

the first conductor is an electrode bump.

8. The composite sensor according to claim 1, wherein

the first IC has an upper surface and a bottom surface,

the second IC has an upper surface and a bottom surface,

the bottom surface of the first IC has an electrode directly connected to the first electrode of the package via the first conductor,

the upper surface of the second IC has an electrode directly connected to the second electrode of the package via the second conductor.

9. The composite sensor according to claim 1, further comprising an adhesive positioned between the first IC and the second IC.

10. The composite sensor according to claim 1, wherein

the second electrode is positioned higher than the first electrode.

11. The composite sensor according to claim 1, wherein

the second sensing element is located away from the first IC and the second IC.

12. The composite sensor according to claim 1, wherein

the package has a substrate,

the substrate has a base on the substrate,

the substrate has the first electrode,

the base has the second electrode, and

the second electrode is positioned higher than the first electrode.

13. The composite sensor according to claim 1, wherein

the package has a substrate,

the second sensing element is located on the substrate and positioned away from the first IC and the second IC.

14. The composite sensor according to claim 12, wherein

the second electrode is positioned as high as the second IC.

15. The composite sensor according to claim 1, wherein

the package has:

a first face accommodating the first sensing element, the second sensing element, the first IC, and the second IC,

a second face opposite to the first face, and

a power-supply electrode, a GND electrode, a first output electrode, and a second output electrode on the second face,

the power-supply electrode is connected to the first sensing element via the first IC, and connected to the second sensing element,

the GND electrode and the first output electrode are connected to the first sensing element, and

the second output electrode is connected to the second sensing element.

16. The composite sensor according to claim 1, wherein

the package has layers of ceramic and the wiring conductor.

17. The composite sensor according to claim 1, further comprising:

an underfill material provided on a surface of the first IC.

18. The composite sensor according to claim 1, wherein

the package has a substrate,

the substrate, the first IC, and the second IC is stacked in this order, and

the second electrode is positioned higher than the first electrode.

19. The composite sensor according to claim 18, comprising an adhesive positioned between the first IC and the second IC.

20. The composite sensor according to claim 18, wherein

the package accommodating a housing and an electrical component.