Bulk finFET with controlled fin height and high-k liner
First Claim
1. A semiconductor device comprising:
- a semiconductor substrate of a first semiconductor material;
a plurality of punch through doped semiconductor structures in contact with the semiconductor substrate, in which adjacent punch through doped semiconductor structures are separated from one another by a dielectric isolation material, wherein the dielectric isolation material comprises a high-k dielectric layer having an upper surface that is substantially coplanar with an upper surface of the plurality of the punch through doped semiconductor structures;
a plurality of fin structures of a second semiconductor material, wherein each fin structure of the plurality of fin structures is present on a punch through doped semiconductor structure of the plurality of punch through doped semiconductor structures, wherein said each fin structure of the plurality of fin structures has a substantially same height as measured from the surface of the semiconductor substrate; and
a gate structure present on a channel portion of said each fin structure of the plurality of fin structures.
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Abstract
A method of forming a semiconductor device that includes forming a material stack on a semiconductor substrate, the material stack including a first dielectric layer on the substrate, a second dielectric layer on the first dielectric layer, and a third dielectric layer on the second dielectric layer, wherein the second dielectric layer is a high-k dielectric. Openings are formed through the material stack to expose a surface of the semiconductor substrate. A semiconductor material is formed in the openings through the material stack. The first dielectric layer is removed selectively to the second dielectric layer and the semiconductor material. A gate structure is formed on a channel portion of the semiconductor material. In some embodiments, the method may provide a plurality of finFET or trigate semiconductor device in which the fin structures of those devices have substantially the same height.
27 Citations
14 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate of a first semiconductor material; a plurality of punch through doped semiconductor structures in contact with the semiconductor substrate, in which adjacent punch through doped semiconductor structures are separated from one another by a dielectric isolation material, wherein the dielectric isolation material comprises a high-k dielectric layer having an upper surface that is substantially coplanar with an upper surface of the plurality of the punch through doped semiconductor structures; a plurality of fin structures of a second semiconductor material, wherein each fin structure of the plurality of fin structures is present on a punch through doped semiconductor structure of the plurality of punch through doped semiconductor structures, wherein said each fin structure of the plurality of fin structures has a substantially same height as measured from the surface of the semiconductor substrate; and a gate structure present on a channel portion of said each fin structure of the plurality of fin structures. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A semiconductor device comprising:
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a semiconductor substrate of a first semiconductor material; a plurality of punch through doped semiconductor structures in contact with the semiconductor substrate, in which adjacent punch through doped semiconductor structures are separated from one another by a dielectric isolation material, wherein the dielectric isolation material comprises a layered structure of an oxide layer that is in contact with the semiconductor substrate and a high-k dielectric layer that is present on the oxide layer; a plurality of fin structures of a second semiconductor material, wherein each fin structure of the plurality of fin structures is present on a punch through doped semiconductor structure of the plurality of punch through doped semiconductor structures, wherein said each fin structure of the plurality of fin structures has a substantially same height as measured from the surface of the semiconductor substrate; and a gate structure present on a channel portion of said each fin structure of the plurality of fin structures.
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14. A semiconductor device comprising:
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a semiconductor substrate of a first semiconductor material; a plurality of punch through doped semiconductor structures in contact with the semiconductor substrate, in which adjacent punch through doped semiconductor structures are separated from one another by a dielectric isolation material; a plurality of fin structures of a second semiconductor material, wherein each fin structure of the plurality of fin structures is present on a punch through doped semiconductor structure of the plurality of punch through doped semiconductor structures, wherein said each fin structure of the plurality of fin structures has a substantially same height as measured from the surface of the semiconductor substrate, and wherein each of the punch through doped semiconductor structure of the plurality of punch through doped semiconductor structures is doped with carbon or is doped to have an opposite conductivity type than source and drain regions that are present on opposing sides of the channel portion for each fin structure of the plurality of fin structures; and a gate structure present on a channel portion of said each fin structure of the plurality of fin structures.
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Specification