Semiconductor device and method for forming the same
First Claim
1. A semiconductor device comprising:
- a substrate;
a semiconductor layer disposed on the substrate;
a barrier layer disposed on the semiconductor layer; and
an insulating layer disposed on the barrier layer,wherein the semiconductor layer includes an oxide semiconductor including at least one of indium, tin, and zinc,wherein the barrier layer includes a first oxide including at least one of indium, tin and zinc and a second oxide including another material including at least one of a lower standard electrode potential than a semiconductor material of the oxide semiconductor, a lower electron affinity than the semiconductor material of the oxide semiconductor, or a larger band gap than the semiconductor material of the oxide semiconductor,wherein the insulating layer includes at least one of a silicon-based oxide or a silicon-based nitride,wherein the insulating layer includes a portion which contacts with an upper surface of the barrier layer,wherein the barrier layer is formed of one layer with the second oxide added in the first oxide,wherein the barrier layer contacts the semiconductor layer,wherein the second oxide of the barrier layer includes at least one selected from a group including, gallium, yttrium, niobium, magnesium, hafnium, titanium, lanthanum, lithium, scandium, barium, strontium, or zirconium, andwherein the second oxide has a higher combination force with oxygen than the oxide semiconductor of the semiconductor layer.
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Accused Products
Abstract
A semiconductor device includes: a substrate, a semiconductor layer including an oxide semiconductor disposed on the substrate, a barrier layer disposed on the semiconductor layer and an insulating layer disposed on the barrier layer. The semiconductor layer includes an oxide semiconductor, and the barrier layer includes a material having a lower standard electrode potential than a semiconductor material of the oxide semiconductor, a lower electron affinity than the semiconductor material of the oxide semiconductor, or a larger band gap than the semiconductor material of the oxide semiconductor. The insulating layer includes at least one of a silicon-based oxide or a silicon-based nitride, and the insulating layer includes a portion which contacts with an upper surface of the barrier layer.
19 Citations
18 Claims
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1. A semiconductor device comprising:
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a substrate; a semiconductor layer disposed on the substrate; a barrier layer disposed on the semiconductor layer; and an insulating layer disposed on the barrier layer, wherein the semiconductor layer includes an oxide semiconductor including at least one of indium, tin, and zinc, wherein the barrier layer includes a first oxide including at least one of indium, tin and zinc and a second oxide including another material including at least one of a lower standard electrode potential than a semiconductor material of the oxide semiconductor, a lower electron affinity than the semiconductor material of the oxide semiconductor, or a larger band gap than the semiconductor material of the oxide semiconductor, wherein the insulating layer includes at least one of a silicon-based oxide or a silicon-based nitride, wherein the insulating layer includes a portion which contacts with an upper surface of the barrier layer, wherein the barrier layer is formed of one layer with the second oxide added in the first oxide, wherein the barrier layer contacts the semiconductor layer, wherein the second oxide of the barrier layer includes at least one selected from a group including, gallium, yttrium, niobium, magnesium, hafnium, titanium, lanthanum, lithium, scandium, barium, strontium, or zirconium, and wherein the second oxide has a higher combination force with oxygen than the oxide semiconductor of the semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming a semiconductor device, comprising:
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forming a semiconductor layer on a substrate; forming a barrier layer on the semiconductor layer; and forming an insulating layer on the barrier layer by using a deposition method using plasma, wherein the semiconductor layer includes an oxide semiconductor including at least one of indium, tin, and zinc, wherein the barrier layer includes a first oxide including at least one of indium, tin and zinc and a second oxide including another material including at least one of a lower standard electrode potential than a semiconductor material of the oxide semiconductor, a lower electron affinity than the semiconductor material of the oxide semiconductor, or a larger band gap than the semiconductor material of the oxide semiconductor, wherein the insulating layer includes at least one of a silicon-based oxide or a silicon-based nitride, wherein the insulating layer includes a portion which contacts with an upper surface of the barrier layer, wherein the barrier layer is formed of one layer with the second oxide added in the first oxide, wherein the barrier layer contacts the semiconductor layer, wherein the second oxide of the barrier layer includes at least one selected from a group including, gallium, yttrium, niobium, magnesium, hafnium, titanium, lanthanum, lithium, scandium, barium, strontium, or zirconium, and wherein the second oxide has a higher combination force with oxygen than the oxide semiconductor of the semiconductor layer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of forming a semiconductor device, comprising:
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forming a gate electrode on a substrate; forming a gate insulating layer on the gate electrode; forming a semiconductor layer on the gate insulating layer, wherein the semiconductor layer includes an oxide semiconductor; forming a barrier layer on the semiconductor layer, wherein the barrier layer includes a material including at least one of a lower standard electrode potential than a semiconductor material of the oxide semiconductor, a lower electron affinity than the semiconductor material of the oxide semiconductor, or a larger band gap than the semiconductor material of the oxide semiconductor; forming an insulating layer on the barrier layer by using a deposition method using plasma, wherein the insulating layer includes at least one of a silicon-based oxide or a silicon-based nitride; forming an etch stopper on the barrier layer; forming a source electrode and a drain electrode spaced apart from the source electrode on the barrier layer; and forming a passivation layer on the source electrode and the drain electrode and wherein the passivation layer contacts with the etch stopper in a space between the source electrode and the drain electrode. - View Dependent Claims (16, 17, 18)
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Specification