Primer composition and optical semiconductor apparatus using same

• US 9,070,846 B2
• Filed: 01/14/2014
• Issued: 06/30/2015
• Est. Priority Date: 01/25/2013
• Status: Active Grant

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: Ozai, Toshiyuki, Ikeno, Masayuki, Moteki, Masanari
• Primary Examiner(s): ZIMMER, MARC S
• Application Number:
  US14/154,675
• Publication Number:
  US 20140209968A1
• Time in Patent Office: 532 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: C08L 2312/08 by silane
• CPC Class Codes: C09J 143/04 Homopolymers or copolymers of monomers containing silicon
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device includes (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH═CH₂ groups in the molecule, and (B) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode formed on the substrate can be prevented, and the heat resistance of a primer itself can be improved.

Claims

1. A primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device, comprising:

(A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH═

CH₂ groups in the molecule,

(B) a solvent, and

a metal corrosion inhibitor.

2. The primer composition according to claim 1, wherein an amount of the component (B) to be added is 90% by weight or more relative to the whole component.

3. The primer composition according to claim 1, further comprising (C) a silane coupling agent.

4. The primer composition according to claim 2, further comprising (C) a silane coupling agent.

5. An optical semiconductor apparatus, wherein a substrate mounting an optical semiconductor device is adhered to a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device by the primer composition according to claim 1.

6. An optical semiconductor apparatus, wherein a substrate mounting an optical semiconductor device is adhered to a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device by the primer composition according to claim 2.

7. An optical semiconductor apparatus, wherein a substrate mounting an optical semiconductor device is adhered to a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device by the primer composition according to claim 3.

8. An optical semiconductor apparatus, wherein a substrate mounting an optical semiconductor device is adhered to a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device by the primer composition according to claim 4.

9. The optical semiconductor apparatus according to claim 5, wherein the optical semiconductor device is a light-emitting diode.

10. The optical semiconductor apparatus according to claim 6, wherein the optical semiconductor device is a light-emitting diode.

11. The optical semiconductor apparatus according to claim 7, wherein the optical semiconductor device is a light-emitting diode.

12. The optical semiconductor apparatus according to claim 8, wherein the optical semiconductor device is a light-emitting diode.

13. The optical semiconductor apparatus according to claim 5, wherein a material constituting the substrate is any one of a polyphthalamide resin, fiber-reinforced plastics, and ceramic.

14. The optical semiconductor apparatus according to claim 6, wherein a material constituting the substrate is any one of a polyphthalamide resin, fiber-reinforced plastics, and ceramic.

15. The optical semiconductor apparatus according to claim 7, wherein a material constituting the substrate is any one of a polyphthalamide resin, fiber-reinforced plastics, and ceramic.

16. The optical semiconductor apparatus according to claim 8, wherein a material constituting the substrate is any one of a polyphthalamide resin, fiber-reinforced plastics, and ceramic.

17. The optical semiconductor apparatus according to claim 5, wherein the cured material of the addition reaction curing silicone composition is in a rubber state.

18. The optical semiconductor apparatus according to claim 6, wherein the cured material of the addition reaction curing silicone composition is in a rubber state.

19. The optical semiconductor apparatus according to claim 7, wherein the cured material of the addition reaction curing silicone composition is in a rubber state.

20. The optical semiconductor apparatus according to claim 8, wherein the cured material of the addition reaction curing silicone composition is in a rubber state.

21. The optical semiconductor apparatus according to claim 5, wherein the cured material of the addition reaction curing silicone composition is a transparent cured material.

22. The optical semiconductor apparatus according to claim 6, wherein the cured material of the addition reaction curing silicone composition is a transparent cured material.

23. The optical semiconductor apparatus according to claim 7, wherein the cured material of the addition reaction curing silicone composition is a transparent cured material.

24. The optical semiconductor apparatus according to claim 8, wherein the cured material of the addition reaction curing silicone composition is a transparent cured material.