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Primer composition and optical semiconductor apparatus using same

  • US 9,070,846 B2
  • Filed: 01/14/2014
  • Issued: 06/30/2015
  • Est. Priority Date: 01/25/2013
  • Status: Active Grant
First Claim
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1. A primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device, comprising:

  • (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH═

    CH2 groups in the molecule,(B) a solvent, anda metal corrosion inhibitor.

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