Light emitting diode package and method for fabricating same
DCFirst Claim
1. An LED package, comprising:
- a submount comprising a top surface and a bottom surface;
a plurality of top electrically and thermally conductive elements on said top surface of said submount;
an LED on one of said top electrically and thermally conductive elements, an electrical signal applied to said top electrically and thermally conductive elements causing said LED to emit light, said top electrically and thermally conductive elements spreading heat from said LED across the majority of said submount top surface;
a bottom thermally conductive element on said bottom surface not in electrical contact with said top electrically and thermally conductive elements and conducting heat from said submount;
a lens over said LED; and
a protective layer in direct contact with and extending from a bottom of said lens;
wherein at least a portion of said lens is above a top surface of said protective layer.
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Abstract
An LED package includes a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages includes providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.
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Citations
34 Claims
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1. An LED package, comprising:
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a submount comprising a top surface and a bottom surface; a plurality of top electrically and thermally conductive elements on said top surface of said submount; an LED on one of said top electrically and thermally conductive elements, an electrical signal applied to said top electrically and thermally conductive elements causing said LED to emit light, said top electrically and thermally conductive elements spreading heat from said LED across the majority of said submount top surface; a bottom thermally conductive element on said bottom surface not in electrical contact with said top electrically and thermally conductive elements and conducting heat from said submount; a lens over said LED; and a protective layer in direct contact with and extending from a bottom of said lens; wherein at least a portion of said lens is above a top surface of said protective layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. An LED package, comprising:
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a submount comprising a top surface and a bottom surface; an attach pad on said top surface; a first contact pad on said top surface and integral to said attach pad; a second contact pad on said top surface; an LED on said attach pad, an electrical signal applied to said first and second contact pads causing said LED to emit light, wherein said attach pad, said first contact pad and said second contact pad comprise thermally conductive materials, wherein said attach pad and said first contact pad cover at least 75% of said top surface to spread heat from said LED to the majority of said top surface; a protective layer extending to the edges of said top surface of said submount; and a hemispheric optical element over said LED and with said LED approximately at the center of the base of said hemispheric optical element, wherein said protective layer is in direct contact with a portion of said hemispheric optical element. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26)
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27. An LED package, comprising:
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a submount comprising a top surface and a bottom surface; an LED on said top surface; a hemispheric lens directly on said LED and a portion of said top surface; a protective layer extending to the edges of said top surface of said submount; a top heat spreading element on said top surface to spread heat from said LED across the majority of said top surface, said top spreading element extending radially on said top surface from said LED toward the edges of said submount; and a bottom heat conducting element on said bottom surface to conduct heat from said submount, wherein said bottom heat conducting element is not in electrical contact with said top heat spreading element. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34)
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Specification