Light emitting device package and manufacturing method thereof
First Claim
1. A method for manufacturing a light emitting device (LED) package, comprising steps of:
- preparing a first substrate that comprises a sapphire substrate, an LED on the sapphire substrate formed with a first electrode pad and a second electrode pad disposed on one surface of the LED, and a bonding insulating pattern layer exposing the first electrode pad and the second electrode pad;
preparing a second substrate that comprises a plurality of via holes bored from a first surface to a second surface, and a wiring metal layer formed on inner surfaces of the plurality of via holes, extending to a part of the second surface;
forming a bonding metal pattern layer to be bonded to the wiring metal layer exposed through the plurality of via holes at the first surface of the second substrate;
mounting the first substrate to the second substrate such that the first electrode pad and the second electrode pad face the bonding metal pattern layer;
bonding the first substrate and the second substrate by melting the bonding insulating pattern layer at a predetermined temperature and pressing the first substrate from an upper part;
forming an uneven surface pattern on the first substrate by removing the sapphire substrate and etching an exposed surface of the first substrate;
forming an insulating layer and a phosphor resin layer sequentially on the uneven surface pattern of the first substrate; and
manufacturing the LED package separated into unit chips by processing the first substrate and the second substrate, so that a size of the bonding insulating pattern layer is substantially the same as a size of the second substrate,wherein the step of preparing the first substrate comprises;
forming a light emission structure comprising a first nitride-based semiconductor layer, an active layer, and a second nitride-based semiconductor layer, on the sapphire substrate;
etching the active layer and the second nitride-based semiconductor layer so that a part of the first nitride-based semiconductor layer is exposed;
forming the first electrode pad on the first nitride-based semiconductor layer and forming the second electrode pad on the second nitride-based semiconductor layer;
after processing by oxygen plasma one surface of the light emission structure where the first electrode pad and the second electrode pad are formed, coating a bonding insulating material to cover the first electrode pad and the second electrode pad on one surface where the first electrode pad and the second electrode pad are formed; and
forming the bonding insulating pattern layer by patterning the bonding insulating material so that the first electrode pad and the second electrode pad are exposed.
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Abstract
A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a second electrode pad disposed on one surface thereof; a bonding insulating pattern layer configured to expose the first electrode pad and the second electrode pad; a substrate including a via hole bored from a first surface to a second surface and a wiring metal layer formed on an inner surface of the via hole to extend to a part of the second surface; and a bonding metal pattern layer bonded to the wiring metal layer exposed through the via hole at the first surface of the substrate and also bonded to the first electrode pad and the second electrode pad.
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Citations
6 Claims
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1. A method for manufacturing a light emitting device (LED) package, comprising steps of:
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preparing a first substrate that comprises a sapphire substrate, an LED on the sapphire substrate formed with a first electrode pad and a second electrode pad disposed on one surface of the LED, and a bonding insulating pattern layer exposing the first electrode pad and the second electrode pad; preparing a second substrate that comprises a plurality of via holes bored from a first surface to a second surface, and a wiring metal layer formed on inner surfaces of the plurality of via holes, extending to a part of the second surface; forming a bonding metal pattern layer to be bonded to the wiring metal layer exposed through the plurality of via holes at the first surface of the second substrate; mounting the first substrate to the second substrate such that the first electrode pad and the second electrode pad face the bonding metal pattern layer; bonding the first substrate and the second substrate by melting the bonding insulating pattern layer at a predetermined temperature and pressing the first substrate from an upper part; forming an uneven surface pattern on the first substrate by removing the sapphire substrate and etching an exposed surface of the first substrate; forming an insulating layer and a phosphor resin layer sequentially on the uneven surface pattern of the first substrate; and manufacturing the LED package separated into unit chips by processing the first substrate and the second substrate, so that a size of the bonding insulating pattern layer is substantially the same as a size of the second substrate, wherein the step of preparing the first substrate comprises; forming a light emission structure comprising a first nitride-based semiconductor layer, an active layer, and a second nitride-based semiconductor layer, on the sapphire substrate; etching the active layer and the second nitride-based semiconductor layer so that a part of the first nitride-based semiconductor layer is exposed; forming the first electrode pad on the first nitride-based semiconductor layer and forming the second electrode pad on the second nitride-based semiconductor layer; after processing by oxygen plasma one surface of the light emission structure where the first electrode pad and the second electrode pad are formed, coating a bonding insulating material to cover the first electrode pad and the second electrode pad on one surface where the first electrode pad and the second electrode pad are formed; and forming the bonding insulating pattern layer by patterning the bonding insulating material so that the first electrode pad and the second electrode pad are exposed. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification