OLED package and packaging method thereof

• US 9,070,895 B2
• Filed: 02/19/2013
• Issued: 06/30/2015
• Est. Priority Date: 03/19/2012
• Status: Active Grant

• Current Assignee: HannStar Display Corporation
• Original Assignee: HannStar Display Corporation
• Inventors: Lin, Chih-Pin
• Primary Examiner(s): TOBERGTE, NICHOLAS J
• Application Number:
  US13/770,140
• Publication Number:
  US 20130240848A1
• Time in Patent Office: 861 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H10K 50/80 Constructional details
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

There is provided an OLED package including a substrate, a lighting component, a compound barrier layer, a moisture absorption zone and an inorganic barrier layer. The lighting component is formed on the substrate. The compound barrier layer completely seals the lighting component configured to block moisture and oxygen. The moisture absorption zone is formed on the substrate surrounding the compound barrier layer and is not formed upon the lighting component. The inorganic barrier layer completely seals the compound barrier layer and the moisture absorption zone configured to block moisture and oxygen.

Claims

1. An OLED package, comprising:

a substrate;

a lighting component formed on the substrate;

a compound barrier layer completely sealing the lighting component to block moisture and oxygen;

a moisture absorption zone formed on the substrate and surrounding the compound barrier layer but not formed upon the lighting component;

an inorganic barrier layer completely sealing the compound barrier layer and the moisture absorption zone; and

an organic buffer layer between the lighting component and the compound barrier layer.

2. The OLED package as claimed in claim 1, wherein the compound barrier layer comprises at least one inorganic film layer and at least one organic film layer.

3. The OLED package as claimed in claim 1, wherein a plastic frame is further formed on the substrate surrounding the moisture absorption zone.

4. The OLED package as claimed in claim 3, wherein the plastic frame is at least one of a thermal-curing adhesive and a UV-curing adhesive.

5. The OLED package as claimed in claim 1, wherein the moisture absorption zone is selected from at least one of calcium chloride, silicone, bamboo carbon, activated carbon, a polymer moisture absorbent selected from the group consisting of SiO₂, starch series, fiber strand, synthetic polymer, polyacrylate series, polyvinyl alcohol series and polyacrylamide series and a moisture absorbent selected from the group consisting of SiO, BaO, CaO and Al₂O₃.

6. A packaging method of an OLED package, comprising:

providing a substrate;

forming a lighting component on the substrate;

forming an organic buffer layer on an upper surface of the lighting component;

completely sealing the lighting component with a compound barrier layer to block moisture and oxygen, wherein the organic buffer layer is between the lighting component and the compound barrier layer;

forming a moisture absorption zone on the substrate and surrounding the compound barrier layer, wherein the moisture absorption zone is not formed upon the lighting component; and

completely sealing the compound barrier layer and the moisture absorption zone with an inorganic barrier layer.

7. The packaging method as claimed in claim 6, wherein the operation of forming a moisture absorption zone includes:

disposing a solid film surrounding the compound barrier layer;

heating the solid film to a semi-solid state; and

cold curing to form the moisture absorption zone.

8. The packaging method as claimed in claim 6, wherein the moisture absorption zone is formed by electron beam vapor deposition, chemical vapor deposition, thermal evaporation, sputtering deposition, coating or plasma deposition.

9. The packaging method as claimed in claim 6, wherein, in the operation of sealing the lighting component with a compound barrier layer, at least one inorganic film layer and at least one organic film layer are alternatively formed on the lighting component by thermal evaporation, sputtering deposition, or coating.

10. A packaging method of an OLED package, comprising:

providing a substrate;

forming a lighting component on the substrate;

forming an organic buffer layer on an upper surface of the lighting component;

completely sealing the lighting component with a compound barrier layer to block moisture and oxygen, wherein the organic buffer layer is between the lighting component and the compound barrier layer;

forming a plastic frame on the substrate surrounding the compound barrier layer;

forming a moisture absorption zone on the substrate surrounding the compound barrier layer and between the compound barrier layer and the plastic frame using a liquid drop method, wherein the moisture absorption zone is not formed upon the lighting component; and

completely sealing the compound barrier layer, the moisture absorption zone, and the plastic frame with an inorganic barrier layer.

11. The packaging method as claimed in claim 10, wherein, in the operation of sealing the lighting component with a compound barrier layer, at least one inorganic film layer and at least one organic film layer are alternatively formed on the lighting component by thermal evaporation, sputtering deposition, or coating.