Hybrid metamaterial antenna structures

• US 9,070,965 B2
• Filed: 03/04/2011
• Issued: 06/30/2015
• Est. Priority Date: 03/04/2010
• Status: Active Grant

• Current Assignee: Tyco Electronics Services GmbH (TE Connectivity Ltd. (United Kingdom))
• Original Assignee: Tyco Electronics Services GmbH (TE Connectivity Ltd. (United Kingdom))
• Inventors: Achour, Maha, Gummalla, Ajay, Pathak, Vaneet
• Primary Examiner(s): Karacsony, Robert
• Assistant Examiner(s): HOLECEK, PATRICK R
• Application Number:
  US13/040,496
• Publication Number:
  US 20110273353A1
• Time in Patent Office: 1,579 Days
• Field of Search: 343/700.MS, 343/702, 343/725, 343/893
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 5/30 Arrangements for providing operation on different wavebands
• CPC Class Codes: H01Q 9/0428 radiating a circular polarised wave
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

A wireless device having a CRLH antenna structure incorporates a meander line at the feed and adds a three dimensional conductive structure to shift a meander mode resonance frequency.

Claims

1. A wireless device having a Composite Right and Left Handed (CRLH) antenna structure, comprising:

a substrate including at least planar metallization layer comprising;

a cell patch;

a feed line capacitively coupled to the cell patch;

a meander line coupled to the feed line; and

a conductive line coupling the cell patch to a reference voltage; and

a conductive structure coupled to the feed line, configured to extend in three dimensions including outside a plane of the metallization layer, the conductive structure configured to bridge a first location to a second location on the meander line and configured to increase an effective length of the meander line,

wherein the meander line and the conductive structure are configured to provide a first right-handed (RH) mode resonance established by the effective length of the meander line; and

wherein the cell patch and the conductive line are configured provide a left-handed (LH) mode resonance.

2. The wireless device as in claim 1, wherein the feed line is position proximate the cell patch with a coupling gap therebetween providing a capacitance.

3. The wireless device as in claim 2, wherein the conductive line provides an inductance and wherein the capacitance and the inductance provide the LH mode resonance.

4. The wireless device as in claim 1, wherein the first RH mode resonance comprises meander mode resonance frequency, and wherein the conductive structure is configured to shift the meander mode resonance frequency to a lower frequency.

5. The wireless device as in claim 4, wherein the conductive structure is configured to increase an effective volume of the meander line.

6. The wireless device as in claim 4 wherein the antenna structure supports a second RH mode resonance having a frequency higher than a frequency of the meander mode resonance.

7. The wireless device as in claim 1, wherein the substrate and the at least one metallization layer are included as a portion of a Printed Circuit Board.

8. The wireless device as in claim 1, further comprising a second cell patch capacitively coupled to the feed structure.

15. The wireless device as in claim 1, wherein the cell patch is located on a first metallization layer, and

wherein the conductive line is configured to couple the cell patch to a ground electrode located on a second metallization layer.

16. The wireless device as in claim 15, wherein the ground electrode is located outside a footprint of the cell patch projected from the first metallization layer to the second metallization layer.

9. A method for forming a Composite Right and Left Handed (CRLH) antenna structure, comprising:

forming a first planar metallization layer on a substrate, the first metallization layer comprising;

a cell patch;

a feed line capacitively coupled to the cell patch; and

a meander line coupled to the feed line;

forming a conductive structure coupled to the feed line, configured to extend in three dimensions including outside respective planes of the metallization layers, and configured to increase an effective length of the meander line; and

forming a second planar metallization layer on the substrate, the second metallization layer comprising a conductive line adapted to couple the cell patch to a reference voltage,

wherein the meander line and the conductive structure are configured to provide a first right-handed (RH) mode resonance established by the effective length of the meander line;

wherein the cell patch and the conductive line are configured provide a left-handed (LH) mode resonance; and

wherein the conductive structure is a bridge structure coupling one part of the meander line to another part of the meander line.

10. The method as in claim 9, further comprising:

forming at least one via through the substrate having a conductive material filling the at least one via, wherein the at least one via couples the cell patch to the conductive line.

11. The method as in claim 9, wherein the conductive structure is coupled to the first metallization layer, but extends out of the first metallization layer.

12. The method as in claim 11, wherein forming the first metallization layer comprises forming a second cell patch in the first metallization layer, wherein the feed structure is capacitively coupled to the second cell patch.

13. The method as in claim 9, wherein the first and second metallization layers are formed on a dielectric substrate.

14. The method as in claim 13, wherein forming the second metallization layer comprises forming a ground electrode on the substrate.

17. The method as in claim 14, wherein the ground electrode is located outside a footprint of the cell patch projected from the first metallization layer to the second metallization layer.