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Wireless antenna array system architecture and methods to achieve 3D beam coverage

  • US 9,070,977 B2
  • Filed: 09/23/2010
  • Issued: 06/30/2015
  • Est. Priority Date: 03/11/2008
  • Status: Active Grant
First Claim
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1. A millimeter-wave (mm-wave) communications device, comprising:

  • a first mm-wave antenna on a substrate, wherein the first mm-wave antenna is configured to provide an elevation coverage;

    a second mm-wave antenna on another substrate, wherein the second mm-wave antenna is configured to provide an azimuth coverage;

    an interface structure configured to provide an interconnect routing between the said substrates through a via;

    an integrated circuit that is disposed in the other substrate that includes the second mm-wave antenna, wherein the integrated circuit is connected to the first and second mm-wave antennas through the via and a microfeed line, respectively, wherein the integrated circuit is configured to communicate using mm-wave signals.

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