Wireless antenna array system architecture and methods to achieve 3D beam coverage
First Claim
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1. A millimeter-wave (mm-wave) communications device, comprising:
- a first mm-wave antenna on a substrate, wherein the first mm-wave antenna is configured to provide an elevation coverage;
a second mm-wave antenna on another substrate, wherein the second mm-wave antenna is configured to provide an azimuth coverage;
an interface structure configured to provide an interconnect routing between the said substrates through a via;
an integrated circuit that is disposed in the other substrate that includes the second mm-wave antenna, wherein the integrated circuit is connected to the first and second mm-wave antennas through the via and a microfeed line, respectively, wherein the integrated circuit is configured to communicate using mm-wave signals.
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Abstract
Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.
23 Citations
20 Claims
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1. A millimeter-wave (mm-wave) communications device, comprising:
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a first mm-wave antenna on a substrate, wherein the first mm-wave antenna is configured to provide an elevation coverage; a second mm-wave antenna on another substrate, wherein the second mm-wave antenna is configured to provide an azimuth coverage; an interface structure configured to provide an interconnect routing between the said substrates through a via; an integrated circuit that is disposed in the other substrate that includes the second mm-wave antenna, wherein the integrated circuit is connected to the first and second mm-wave antennas through the via and a microfeed line, respectively, wherein the integrated circuit is configured to communicate using mm-wave signals. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An apparatus for 60 GHz band wireless communication, comprising:
a planar antenna on a first substrate and an endfire antenna on a third substrate, wherein the planar antenna is connected to an integrated circuit through an interconnect in a second substrate to carry a millimeter wave (mm-wave) signal from the planar antenna to the integrated circuit. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A multipoint wireless communications device, comprising:
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a plurality of planar antennas configured to operate in a 60 GHz band; a plurality of endfire antennas configured to operate in the 60 GHz band; an integrated circuit connected to the plurality of planar antennas through a number of vias and to the plurality of endfire antenna through a number of microfeed lines, wherein the plurality of planar and endfire antennas provide an omnidirectional antenna array. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A multipoint wireless communications device, comprising:
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a plurality of planar antennas configured to operate in a 60 GHz band; a plurality of endfire antennas configured to operate in the 60 GHz band; an integrated circuit connected to the plurality of planar antennas through a number of vias to provide an omnidirectional antenna array; and
a second integrated circuit.
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20. A multipoint wireless communications device, comprising:
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a plurality of planar antennas configured to operate in a 60 GHz band; a plurality of endfire antennas configured to operate in the 60 GHz band; an integrated circuit connected to the plurality of planar antennas through a number of vias that provide routing using shielded stripline transmission structures.
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Specification