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Methods and systems for high bandwidth chip-to-chip communications interface

  • US 9,071,476 B2
  • Filed: 03/06/2014
  • Issued: 06/30/2015
  • Est. Priority Date: 05/20/2010
  • Status: Active Grant
First Claim
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1. A transceiver comprising:

  • an interconnection between at least a first and a second integrated circuit device, the interconnection comprising at least one interconnection wire group, wherein each interconnection wire group is a wire group for communicating signals representing a code word of a vector signaling code;

    an encoder that converts a received transmit data word to a transmit code word of a vector signaling code;

    a transmit driver that emits physical signals on wires of the interconnection wire group that correspond to elements of the transmit code word;

    a receiver circuit that detects physical signals on the interconnection wires as elements of a received code word of a vector signaling code comprising a plurality of signal summers each configured to sum physical signals on two selected wires and a plurality of comparators to compare outputs of the signal summers and to generate a decoded output representing a receive data word.

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