MEMS microphone and electronic equipment having the MEMS microphone

• US 9,073,747 B2
• Filed: 09/06/2013
• Issued: 07/07/2015
• Est. Priority Date: 05/28/2013
• Status: Active Grant

• Current Assignee: Shangai Sniper Microelectronics Co., Ltd., ZillTek Technology Corp.
• Original Assignee: Shangai Sniper Microelectronics Co., Ltd.
• Inventors: Ye, Jinghua
• Primary Examiner(s): NGUYEN, TUAN DUC
• Application Number:
  US14/019,768
• Publication Number:
  US 20140353779A1
• Time in Patent Office: 669 Days
• Field of Search: 381/345, 381/355, 381/351, 381/361, 381/174, 381/175
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H04R 1/021 incorporating only one transducer
• CPC Class Codes: H04R 2201/003 Mems transducers or their use

Abstract

The present invention provides a MEMS microphone and an electronic equipment having the MEMS microphone. The electronic equipment of the present invention at least comprises: a MEMS microphone and a printed circuit board, wherein, the microphone comprises: a microphone chip containing acoustic and electric sensor, a package shell packaging the microphone chip, wherein, it is provided a sound hole on the package shell, the sound hole is positioned on the side of the microphone chip, it is also provided pins derived from the microphone chip on the side face of the package shell adjacent to the sound hole; the printed circuit board electrically connect with the pins of the MEMS microphone, which is used to output the electric signal generated by the microphone. The present invention avoids the sound air flow directly to the microphone chip, reduces dust interference on acoustic and electric sensor in microphone chip by means of changing the position of the sound hole of the microphone.

Claims

1. A microelectromechanical system (MEMS) microphone, characterized by, at least comprises:

a microphone chip containing an acoustic and electric sensor, converting sound wave into change of plate spacing of capacitance in the acoustic and electric sensor, and output electric signal about the change of voltage according to the change of plate spacing;

a package shell packaging the microphone chip, wherein, it is provided a sound hole on the package shell, the sound hole is positioned on the side face of the microphone chip, it is also provided pins derived from the microphone chip on the side face of the package shell adjacent to the sound hole; and

a dust-proof component attached over the acoustic and electric sensor wherein the dust-proof component is attached on a side of the sound hole and aslant arranged over the acoustic and electric sensor.

2. The MEMS microphone according to claim 1, characterized by, the material of the dust-proof component is siliceous material.

3. An electronic equipment having a microelectromechanical system (MEMS) microphone, characterized by, at least comprises:

the MEMS microphone comprises;

a microphone chip containing an acoustic and electric sensor, converting sound waves into change of plate spacing of capacitance in the acoustic and electric sensor, and output electric signal about the change of voltage according to the change of plate spacing;

a package shell packaging the microphone chip, wherein, it is provided a sound hole on the package shell, the sound hole is positioned on the side face of the microphone chip, it is also provided pins derived from the microphone chip on the side face of the package shell adjacent to the sound hole;

a dust-proof component attached over the acoustic and electric sensor wherein the dust-proof component is attached on a side of the sound hole and aslant arranged over the acoustic and electric sensor; and

a printed circuit board electrically connecting with the pins of the MEMS microphone, to output the electric signal generated by the microphone.

4. The electronic equipment having the MEMS microphone according to claim 3, characterized by, the electronic equipment also comprises:

a washer which is attached to the package shell and at the end face adjacent to the sound hole.

5. The electronic equipment having the MEMS microphone according to claim 3, characterized by, the material of the dust-proof component is siliceous material.

6. The electronic equipment having the MEMS microphone according to claim 3, characterized by, the Printed circuit board has space for containing the MEMS microphone, leaving gap between the sound hole of MEMS microphone and the boundary of the space.