Method and apparatus for cutting a substrate
First Claim
Patent Images
1. A substrate cutting apparatus for cutting a large size substrate into smaller unit substrates, the apparatus comprising:
- a rotating table on which the large size substrate having formed thereon a plurality of cutting lines is mountable, the cutting lines being spaced apart from each other by a predetermined distance, the rotating table including a plurality of spaced apart rotating shafts at locations aligned with the cutting lines, the rotating shafts being spaced from each other a distance corresponding to the predetermined distance that the cutting lines are spaced from each other; and
a number of push plates, each of the push plates to apply a pressure to the large size substrate on the rotating table, wherein the number of push plates is less than the plurality of cutting lines and wherein;
a first cutting line is on a first surface of the large size substrate, and second and third cutting lines are on a second surface of the large size substrate,the first cutting line is between adjacent push plates,the adjacent push plates are between the second and third cutting lines, andthe rotating table rotates in a first direction at a first location to separate the large size substrate along the first cutting line, and rotates in a second direction opposite to the first direction at second and third locations to respectively separate the large size substrate along the second and third cutting lines.
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Abstract
A substrate cutting apparatus for cutting a large size substrate into smaller unit substrates includes a rotating table and a push plate. The rotating table, on which the large size substrate having formed thereon a plurality of cutting lines is mountable, includes rotating shafts at locations corresponding to the cutting lines. The push plate fixes a position of the large size substrate on the rotating table.
10 Citations
16 Claims
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1. A substrate cutting apparatus for cutting a large size substrate into smaller unit substrates, the apparatus comprising:
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a rotating table on which the large size substrate having formed thereon a plurality of cutting lines is mountable, the cutting lines being spaced apart from each other by a predetermined distance, the rotating table including a plurality of spaced apart rotating shafts at locations aligned with the cutting lines, the rotating shafts being spaced from each other a distance corresponding to the predetermined distance that the cutting lines are spaced from each other; and a number of push plates, each of the push plates to apply a pressure to the large size substrate on the rotating table, wherein the number of push plates is less than the plurality of cutting lines and wherein; a first cutting line is on a first surface of the large size substrate, and second and third cutting lines are on a second surface of the large size substrate, the first cutting line is between adjacent push plates, the adjacent push plates are between the second and third cutting lines, and the rotating table rotates in a first direction at a first location to separate the large size substrate along the first cutting line, and rotates in a second direction opposite to the first direction at second and third locations to respectively separate the large size substrate along the second and third cutting lines. - View Dependent Claims (2, 3, 4, 15, 16)
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5. A method of cutting a substrate, the method comprising:
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performing a scribing operation to form a plurality of cutting lines on a large size substrate according to a size of a plurality of smaller unit substrates to be formed; performing a fixing operation using a number of push plates for fixing the large size substrate, on which the cutting lines are formed, to a rotating table, the rotating table having a plurality of rotating shafts corresponding to the cutting lines; and performing a cutting operation for cutting the plurality of smaller unit substrates from the large size substrate along the cutting lines by rotating the rotating table around the plurality of rotating shafts, wherein the number of push plates is less than the plurality of cutting lines and wherein; a first cutting line is on a first surface of the large size substrate, and second and third cutting lines are on a second surface of the large size substrate, the first cutting line is between adjacent push plates, the adjacent push plates are between the second and third cutting lines, and the rotating table rotates in a first direction about a first shaft to separate the large size substrate along the first cutting line, and rotates in a second direction opposite to the first direction about second shafts to separate the large size substrate along the second and third cutting lines. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification