Hot light emitting diode (LED) lighting systems

• US 9,074,737 B2
• Filed: 06/08/2012
• Issued: 07/07/2015
• Est. Priority Date: 06/11/2009
• Status: Active Grant

• Current Assignee: IDEAL Industries Lighting, LLC (Ideal Industries Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: van de Ven, Antony P., Negley, Gerald H.
• Primary Examiner(s): Hollweg, Thomas A
• Application Number:
  US13/492,041
• Publication Number:
  US 20120243222A1
• Time in Patent Office: 1,124 Days
• Field of Search: 313484-487, 313/489, 313/498, 313501-503, 313/512, 257/98, 257/99, 257/100, 257/79, 257/80
• US Class Current: 1/1
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 3/12 the coatings comprising photoluminescent substances
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

LED lighting systems operate their LED above a junction temperature of 85° C. and space apart from the LED, components of the LED lighting system that reduce an expected lifetime of the LED lighting system to less than 25,000 hours as a result of operating the LED above the junction temperature of 85° C. Accordingly, the LED itself may be driven hotter than is conventionally the case, without impacting its lifetime. By allowing the LED to operate hotter, reduced heat sinking may be needed for the LED itself, which can decrease the cost, size and/or complexity of the thermal management system for the LED lighting system and/or can allow a thermal budget for the LED lighting system to be used elsewhere. Related structures are also described.

Claims

1. A Light Emitting Diode (LED) lighting system comprising:

an unpackaged LED die that is devoid of encapsulant directly thereon;

a power supply that is electrically connected to the unpackaged LED die and that is configured to bias the unpackaged LED die so as to allow a junction temperature of the unpackaged LED die above 125°

C.; and

a wavelength conversion material that is spaced apart from the unpackaged LED die and that is configured to downconvert at least some of the light that is emitted by the unpackaged LED die.

2. An LED lighting system according to claim 1 wherein the power supply is spaced apart from the unpackaged LED die.

3. An LED lighting system according to claim 2 further comprising a transparent bulb and a screw-type base at the base of the bulb, wherein the unpackaged LED die is located within the bulb, the power supply is located within the base and the wavelength conversion material is on the transparent bulb.

4. An LED lighting system according to claim 3 wherein the bulb includes a heat sink thermally coupled to the power supply.

5. An LED lighting system according to claim 1 wherein the junction temperature that is above 125°

C. is between 160°

C. and 200°

C.

6. An LED lighting system according to claim 1 wherein the unpackaged LED die includes an outer layer comprising silicon nitride and/or aluminum oxide through which at least some of the light that is emitted by the unpackaged LED die passes.

7. An LED lighting system according to claim 1 wherein the unpackaged LED die is devoid of silicone-based and epoxy-based encapsulant thereon.

8. An LED lighting system according to claim 1 wherein the unpackaged LED die is devoid of an encapsulant thereon having carbon-carbon double bonds.

9. An LED lighting system according to claim 1 wherein the unpackaged LED die comprises a blue unpackaged LED die and the LED lighting system further comprises a red LED, wherein the LED lighting system comprises a thermal management structure that provides greater thermal dissipation for the red LED than for the blue unpackaged LED die.

10. An LED lighting system according to claim 9 wherein the thermal management structure comprises a heat sink that is thermally coupled to the red LED and wherein the blue unpackaged LED die is devoid of a heat sink thermally coupled thereto.

11. A Light Emitting Diode (LED) lighting system comprising:

an unpackaged LED die that is devoid of encapsulant directly thereon and devoid of a heat sink thermally coupled thereto;

a power supply that is electrically connected to the unpackaged LED die and that is configured to bias the unpackaged LED die so as to allow a junction temperature of the unpackaged LED die above 85°

C.; and

a wavelength conversion material that is spaced apart from the unpackaged LED die and that is configured to downconvert at least some of the light that is emitted by the unpackaged LED die.

12. An LED lighting system according to claim 11 wherein the power supply includes a heat sink thermally coupled thereto.

13. An LED lighting system according to claim 12 wherein the heat sink comprises fins.

14. A Light Emitting Diode (LED) lighting system comprising:

an unpackaged LED die that is devoid of encapsulant directly thereon and devoid of a heat sink thermally coupled thereto;

a power supply that is electrically connected to the unpackaged LED die and that is configured to bias the unpackaged LED die; and

a wavelength conversion material that is spaced apart from the unpackaged LED die and that is configured to downconvert at least some of the light that is emitted by the unpackaged LED die.

15. An LED lighting system according to claim 14 wherein the power supply is spaced apart from the unpackaged LED die.

16. An LED lighting system according to claim 15 further comprising a transparent bulb and a screw-type base at the base of the bulb, wherein the unpackaged LED die is located within the bulb, the power supply is located within the base and the wavelength conversion material is on the transparent bulb.

17. An LED lighting system according to claim 14 wherein the unpackaged LED die is devoid of silicone-based and epoxy-based encapsulant thereon.

18. An LED lighting system according to claim 14 wherein the unpackaged LED die is devoid of an encapsulant thereon having carbon-carbon double bonds.