Microelectromechanical accelerometer with wireless transmission capabilities

• US 9,075,078 B2
• Filed: 09/23/2011
• Issued: 07/07/2015
• Est. Priority Date: 09/28/2010
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Theuss, Horst
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US13/241,665
• Publication Number:
  US 20120073371A1
• Time in Patent Office: 1,383 Days
• Field of Search: 734/93, 735/143.1, 735/143.2, 735/143.3, 735/143.4, 734/31
• US Class Current: 1/1
• CPC Class Codes: G01P 15/11 by inductive pick-up
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/082 for two degrees of freedom of movement of a single mass
• CPC Class Codes: G01P 2015/0865 using integrated signal processing circuitry
• CPC Class Codes: G01P 2015/0882 for providing damping of vibrations
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48092 Helix
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

In various embodiments, a microelectromechanical system may include a mass element; a substrate; a signal generator; and a fixing structure configured to fix the mass element to the substrate; wherein the mass element is fixed in such a way that, upon an acceleration of the microelectromechanical system, the mass element can be moved relative to the substrate in at least two spatial directions, and wherein a signal is generated by the movement of the mass element by means of the signal generator.

Claims

1. A microelectromechanical system, comprising:

a mass element;

a substrate;

a signal generator; and

a fixing structure configured to fix the mass element to the substrate;

wherein the mass element comprises a chip with a signal detector and an evaluator;

wherein the mass element is fixed in such a way that, upon an acceleration of the microelectromechanical system, the mass element can be moved relative to the substrate in at least two spatial directions, and

wherein a signal is generated by the movement of the mass element by means of the signal generator.

2. The microelectromechanical system as claimed in claim 1, wherein the substrate forms a hollow body, and

wherein the mass element is fixed within the hollow body.

3. The microelectromechanical system as claimed in claim 1, wherein the signal generator comprises coils for generating magnetic effects.

4. The microelectromechanical system as claimed in claim 1, wherein the signal generator has electrodes for generating capacitive effects.

5. The microelectromechanical system as claimed in claim 1, wherein the signal generator comprises flexible connecting elements for generating piezoresistive signals.

6. The microelectromechanical system as claimed in claim 1, wherein the fixing structure configured to fix the mass element comprise elastic connecting elements.

7. The microelectromechanical system as claimed in claim 6, wherein the fixing structure configured to fix the mass element comprises at least one helical spring.

8. The microelectromechanical system as claimed in claim 6, wherein the fixing structure configured to fix the mass element comprises at least one bent leadframe lamina.

9. The microelectromechanical system as claimed in claim 1, wherein the fixing structure configured to fix the mass element comprises an elastic adhesive.

10. The microelectromechanical system as claimed in claim 9, wherein the elastic adhesive at least partly fills the hollow body.

11. The microelectromechanical system as claimed in claim 9, wherein the mass element is at least partly embedded in the elastic adhesive.

12. The electromechanical system of claim 1, wherein the chip has a transponder.