Method and structure of an integrated MEMS inertial sensor device using electrostatic quadrature-cancellation
First Claim
Patent Images
1. An integrated MEMS inertial sensor device, the device comprising:
- a CMOS substrate having a surface region, the CMOS substrate having at least one CMOS IC device;
a MEMS inertial sensor overlying the surface region, the MEMS inertial sensor comprising;
a drive frame coupled to the surface region via at least one drive spring,a sense mass coupled to the drive frame via at least a sense spring, anda sense electrode disposed underlying the sense mass; and
at least one pair of quadrature cancellation electrodes disposed within a vicinity of the sense electrode, wherein each pair includes an N-electrode and a P-electrode.
4 Assignments
0 Petitions
Accused Products
Abstract
An integrated MEMS inertial sensor device. The device includes a MEMS inertial sensor overlying a CMOS substrate. The MEMS inertial sensor includes a drive frame coupled to the surface region via at least one drive spring, a sense mass coupled to the drive frame via at least a sense spring, and a sense electrode disposed underlying the sense mass. The device also includes at least one pair of quadrature cancellation electrodes disposed within a vicinity of the sense electrode, wherein each pair includes an N-electrode and a P-electrode.
-
Citations
20 Claims
-
1. An integrated MEMS inertial sensor device, the device comprising:
-
a CMOS substrate having a surface region, the CMOS substrate having at least one CMOS IC device; a MEMS inertial sensor overlying the surface region, the MEMS inertial sensor comprising; a drive frame coupled to the surface region via at least one drive spring, a sense mass coupled to the drive frame via at least a sense spring, and a sense electrode disposed underlying the sense mass; and at least one pair of quadrature cancellation electrodes disposed within a vicinity of the sense electrode, wherein each pair includes an N-electrode and a P-electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. An integrated MEMS inertial sensor device, the device comprising:
-
a substrate member having a surface region; a CMOS IC layer overlying the surface region, the CMOS IC layer having a CMOS surface region and at least one CMOS IC device; a MEMS inertial sensor overlying the CMOS surface region, the MEMS inertial sensor comprising; a drive frame coupled to the CMOS surface region via at least one drive spring, a sense mass coupled to the drive frame via at least one sense spring, and a sense electrode disposed underlying the sense mass; and at least one pair of quadrature cancellation electrodes disposed underlying the sense mass, the at least pair of quadrature cancellation electrodes having at least one quadrature cancellation N-electrode and at least one quadrature cancellation P-electrode. - View Dependent Claims (9, 10, 11, 12, 13, 14)
-
-
15. An integrated MEMS inertial sensor device, the device comprising:
-
a substrate member having a surface region; a CMOS IC layer overlying the surface region, the CMOS IC layer having a CMOS surface region and at least one CMOS IC device; a MEMS inertial sensor overlying the CMOS surface region, the MEMS inertial sensor comprising; a drive frame coupled to the CMOS surface region via four drive springs, a pair of peripheral sense masses, each coupled to the drive frame via a pair of peripheral springs; a central sense mass coupled to the pair of peripheral sense masses, each of the peripheral sense masses coupled to the central sense mass by a pair of central springs; a sense electrode disposed underlying the sense mass; and at least one pair of quadrature cancellation electrodes disposed underlying each of the peripheral sense masses, each pair of quadrature cancellation electrodes having at least one quadrature cancellation N-electrode and at least one quadrature cancellation P-electrode. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification