Passive probing of various locations in a wireless enabled integrated circuit (IC)
First Claim
1. A wireless integrated circuit testing environment, comprising:
- a coupling element configured to proximity couple to a second coupling element within an integrated circuit to passively observe a signal passing through the second coupling element, the integrated circuit being located within a semiconductor wafer; and
wireless automatic test equipment configured to determine a signal metric of the signal as observed by the coupling element and to compare the signal metric with a plurality of predetermined signal metrics to determine a location of the integrated circuit within the semiconductor wafer.
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Accused Products
Abstract
Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
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Citations
18 Claims
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1. A wireless integrated circuit testing environment, comprising:
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a coupling element configured to proximity couple to a second coupling element within an integrated circuit to passively observe a signal passing through the second coupling element, the integrated circuit being located within a semiconductor wafer; and wireless automatic test equipment configured to determine a signal metric of the signal as observed by the coupling element and to compare the signal metric with a plurality of predetermined signal metrics to determine a location of the integrated circuit within the semiconductor wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A wireless integrated circuit testing environment, comprising:
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a coupling element configured to couple to a second coupling element within an integrated circuit to observe a signal passing through the second coupling element, the integrated circuit being located within a semiconductor wafer; and wireless automatic test equipment configured to determine a signal metric of the observed signal and to compare the signal metric with a plurality of predetermined signal metrics to determine a location of the integrated circuit within a semiconductor wafer, wherein the integrated circuit is from among a plurality of integrated circuits formed on the semiconductor wafer, each of the plurality of integrated circuits having a corresponding unique identification number from among a plurality of unique identification numbers, wherein the wireless automatic test equipment is further configured to store a map of each predetermined signal metric from among the plurality of predetermined signal metrics to a corresponding location of a corresponding unique identification number from among the plurality of unique identification numbers, and wherein the wireless automatic test equipment is further configured compare the signal metric with one or more predetermined signal metrics from among the plurality of predetermined signal metrics to determine the corresponding unique identification number for the integrated circuit and to determine the location of the integrated circuit based upon the corresponding unique identification number for the integrated circuit.
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18. A wireless integrated circuit testing environment, comprising:
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a coupling element configured to couple to a second coupling element within an integrated circuit to observe a signal passing through the second coupling element, the integrated circuit being located within a semiconductor wafer; and wireless automatic test equipment configured to determine a signal metric of the observed signal and to compare the signal metric with a plurality of predetermined signal metrics to determine a location of the integrated circuit within the semiconductor wafer, wherein the integrated circuit is from among a plurality of integrated circuits formed on a semiconductor wafer, each of the plurality of integrated circuits having a corresponding predetermined signal metric, wherein the wireless automatic test equipment is further configured to store a map of each corresponding predetermined signal metric from among the plurality of predetermined signal metrics to a corresponding location of a corresponding integrated circuit from among the plurality of integrated circuits, and wherein the wireless automatic test equipment is further configured to compare the signal metric with one or more predetermined signal metrics from among the plurality of predetermined signal metrics to determine the location of the integrated circuit.
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Specification