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Passive probing of various locations in a wireless enabled integrated circuit (IC)

  • US 9,075,105 B2
  • Filed: 09/29/2011
  • Issued: 07/07/2015
  • Est. Priority Date: 09/29/2011
  • Status: Expired due to Fees
First Claim
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1. A wireless integrated circuit testing environment, comprising:

  • a coupling element configured to proximity couple to a second coupling element within an integrated circuit to passively observe a signal passing through the second coupling element, the integrated circuit being located within a semiconductor wafer; and

    wireless automatic test equipment configured to determine a signal metric of the signal as observed by the coupling element and to compare the signal metric with a plurality of predetermined signal metrics to determine a location of the integrated circuit within the semiconductor wafer.

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