Solid state lighting component
First Claim
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1. A monolithic emitter package comprising:
- a plurality of emitters in an array;
a substantially flat optical element directly on said emitters;
a shaped optical element directly on said flat optical element and over said array, said shaped optical element comprising a plurality of optical features for beam shaping.
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Abstract
An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
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Citations
24 Claims
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1. A monolithic emitter package comprising:
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a plurality of emitters in an array; a substantially flat optical element directly on said emitters; a shaped optical element directly on said flat optical element and over said array, said shaped optical element comprising a plurality of optical features for beam shaping. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A light emitting diode (LED package comprising:
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an LED chip array; and an aggregate overmolded lens comprising two or more portions over said LED chip array; wherein a first of said portions comprises a plurality of optical features for beam shaping; and wherein a second of said portions is substantially flat and is directly on said LED chip array; wherein said first of said portions is directly on said second of said portions. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification