Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby

• US 9,076,951 B2
• Filed: 03/13/2013
• Issued: 07/07/2015
• Est. Priority Date: 08/26/2008
• Status: Active Grant

• Current Assignee: Current Lighting Solutions, LLC (f/k/a GE Lighting Solutions, LLC) (American Industrial Partners)
• Original Assignee: Albeo Technologies (Savant Systems, LLC)
• Inventors: Kong, Ming, Powell, John, Bisberg, Jeffrey
• Primary Examiner(s): Pham, Hoai V
• Application Number:
  US13/802,444
• Publication Number:
  US 20130193463A1
• Time in Patent Office: 846 Days
• Field of Search: 257/79, 257/98, 257/668, 257/675, 257/706, 257/E31.127, 257/E33.001
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.

Claims

1. A light emitting diode (LED)-based lighting assembly, comprising:

a heat sink configured with an extruded ridge that extends vertically from a planar surface of the heat sink;

a printed circuit board (PCB) that includes electrical conductors on an upper surface thereof, the PCB being attached to the planar surface; and

one or more LED chips, each of the LED chips being (a) attached directly to the ridge and (b) electrically connected to the conductors;

wherein a combined thickness of the extruded ridge and the one or more LED chips substantially matches a thickness of the PCB.

2. The lighting assembly of claim 1, wherein each of the LED chips is electrically connected to the conductors utilizing bond wires.

3. The lighting assembly of claim 2, the one or more LED chips comprising a plurality of LED chips, wherein at least two bond wires connect ones of the plurality of LED chips directly to the conductors, and at least one bond wire connects ones of the plurality of LED chips to one another.

4. The lighting assembly of claim 1, the PCB forming an edge that abuts the extruded ridge of the heat sink.

5. A light emitting diode (LED)-based lighting assembly, comprising:

a heat sink having at least one pedestal integrally formed therewith, the pedestal including an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink;

a dielectric layer forming an aperture therein corresponding to the pedestal, the dielectric layer being attached to the lower planar surface such that the upper planar surface extends into the aperture;

at least one electrical conductor formed on an upper surface of the dielectric layer; and

one or more LED chips attached directly to the upper planar surface and connected to the electrical conductor such that light from the one or more LED chips emits upwardly from the upper planar surface;

wherein a combined thickness of the pedestal and the one or more LED chips substantially matches a thickness of the dielectric layer.

6. The lighting assembly of claim 5, the dielectric layer comprising one or more of epoxy, fiberglass and a polymer.

7. The lighting assembly of claim 5, the dielectric layer having a thickness of 0.1 mm to 3 mm.