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Screening process for manufacturing a Z-directed component for a printed circuit board

  • US 9,078,374 B2
  • Filed: 08/31/2011
  • Issued: 07/07/2015
  • Est. Priority Date: 08/31/2011
  • Status: Active Grant
First Claim
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1. A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board, comprising:

  • adding a substrate material to a mold defining the shape of a layer of the z-directed component;

    leveling a top surface of the substrate material in the mold;

    treating the substrate material in the mold and forming the layer of the z-directed component;

    applying a conductive material to at least one surface of the formed layer; and

    forming the z-directed component, the z-directed component including a stack of component layers that includes the formed layer,wherein applying the conductive material to the at least one surface of the formed layer includes;

    positioning the formed layer in a constraining plate having a side wall surface that is spaced from a side wall channel in the formed layer forming a gap therebetween; and

    applying conductive material in the gap formed between the side wall surface of the constraining plate and the side wall channel in the formed layer to plate the side wall channel in the formed layer with the conductive material.

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