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Heat emission device for junction box printed circuit board

  • US 9,078,378 B2
  • Filed: 11/08/2012
  • Issued: 07/07/2015
  • Est. Priority Date: 07/04/2012
  • Status: Expired due to Fees
First Claim
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1. A heat emission device for a junction box printed circuit board (PCB), comprising:

  • a metallic case;

    a lower PCB that is mounted on the metallic case;

    a metallic board that is mounted on the lower PCB and transfers heat; and

    an upper PCB that is mounted on the metallic board and conducts electricity with the lower PCB,wherein the metallic board comprises a bottom plate with a plurality of slots formed thereon, wherein each slot accepts one or more heat transfer bosses, which contact the lower PCB so as to transfer heat,wherein the one or more heat transfer bosses slides along the respective slots.

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