Integrated microphone package
First Claim
Patent Images
1. An apparatus comprising:
- a packaged microphone having a base and a lid that at least in part form an interior chamber containing a microphone die, the base having a bottom surface and a base aperture extending through the bottom surface;
a device housing having an internal surface;
a filter between the internal surface of the device housing and the bottom surface of the base; and
a substrate having a substrate opening, the filter extending through the substrate opening to contact both the internal surface of the device housing and the bottom surface of the base wherein the substrate comprises a flexible substrate, the filter at least in part structurally supporting the flexible substrate through the contact with the bottom surface of the base.
2 Assignments
0 Petitions
Accused Products
Abstract
An apparatus has a packaged microphone with a base and a lid that at least in part form an interior chamber containing a microphone die. The base has a bottom surface with an electrical interface and a base aperture. The apparatus also has a device housing having an internal surface, and a filter extending between the internal surface of the device housing, through an underlying substrate, and the bottom surface of the base.
-
Citations
18 Claims
-
1. An apparatus comprising:
a packaged microphone having a base and a lid that at least in part form an interior chamber containing a microphone die, the base having a bottom surface and a base aperture extending through the bottom surface;
a device housing having an internal surface;
a filter between the internal surface of the device housing and the bottom surface of the base; and
a substrate having a substrate opening, the filter extending through the substrate opening to contact both the internal surface of the device housing and the bottom surface of the base wherein the substrate comprises a flexible substrate, the filter at least in part structurally supporting the flexible substrate through the contact with the bottom surface of the base.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
10. An apparatus comprising:
-
a packaged microphone having a package with an interior chamber containing a MEMS microphone die, the package having a bottom surface and a package aperture extending through the bottom surface;
a device housing having an internal surface and a housing aperture; and
a substrate coupled with the packaged microphone,the internal surface of the device housing contacting the bottom surface of the package wherein the filter is in a state of compression between the device housing and the package and a substrate having electrical interconnects, the substrate having a substrate opening exposing at least a portion of the bottom surface of the package, the filter extending through the substrate opening to secure with both the internal surface of the device housing and the bottom surface of the package wherein the substrate comprises a flexible substrate, the filter at least in part structurally supporting the flexible substrate through the contact with the bottom surface of the base. - View Dependent Claims (11, 12, 13, 14)
-
-
15. A method of assembling a device, the method comprising:
- providing a packaged microphone having a package with an interior chamber containing a microphone die, the package having a bottom surface and a package aperture extending through the bottom surface, the bottom surface having an electrical interface;
electrically connecting the electrical interface of the package with a substrate having a plurality of interconnects; and mounting the substrate and packaged microphone relative to a device housing having an interior housing surface and a housing aperture, mounting comprising positioning a filter between the interior housing surface and the bottom surface of the package, the filter forming an acoustic channel between the package aperture and the housing aperture wherein the substrate comprises a flexible substrate, the filter at least in part structurally supporting the flexible substrate through the contact with the bottom surface of the base. - View Dependent Claims (16, 17, 18)
- providing a packaged microphone having a package with an interior chamber containing a microphone die, the package having a bottom surface and a package aperture extending through the bottom surface, the bottom surface having an electrical interface;
Specification