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MEMS device with stress isolation and method of fabrication

  • US 9,079,763 B2
  • Filed: 04/22/2013
  • Issued: 07/14/2015
  • Est. Priority Date: 04/22/2013
  • Status: Active Grant
First Claim
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1. A microelectromechanical systems (MEMS) device comprising:

  • a substrate;

    a device structure suspended over a surface of said substrate, said device structure including a proof mass structure, a first beam, and a second beam, said first and second beams being oriented such that lengthwise edges of said first and second beams are beside one another; and

    at least one isolation segment suspended over said surface and interposed between said first and second beams, wherein a middle portion of each of said first and second beams is laterally anchored to said at least one isolation segment, and said at least one isolation segment provides electrical isolation between said first and second beams.

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