Illumination apparatus

• US 9,080,752 B2
• Filed: 10/20/2011
• Issued: 07/14/2015
• Est. Priority Date: 10/21/2010
• Status: Active Grant

• Current Assignee: Optovate Ltd. (Reald Spark, LLC)
• Original Assignee: Optovate Ltd. (Reald Spark, LLC)
• Inventors: Woodgate, Graham John, Harrold, Jonathan
• Primary Examiner(s): Garber, Charles
• Assistant Examiner(s): Seven, Evren
• Application Number:
  US13/880,508
• Publication Number:
  US 20140016314A1
• Time in Patent Office: 1,363 Days
• Field of Search: 438/22, 438 24- 25, 438/27, 438/34, 257/13
• US Class Current: 1/1
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: G02B 6/003 Lens or lenticular sheet or layer
• CPC Class Codes: G02B 6/0068 Arrangements of plural sources, e.g. multi-colour light sources
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/0083 Details of electrical connections of light sources to drivers, circuit boards, or the like
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133608 including particular frames or supporting means
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

A light emitting element array for an illumination apparatus, an illumination apparatus and method of manufacture of the same in which an array of light-emitting elements and an array of light directing optics are provided between first and second attached mothersheet substrates wherein the thermal resistance of at least one of the mothersheet substrates is reduced by means of thickness reduction so as to provide reduced LED junction temperature.

Claims

1. A method of manufacturing an illumination apparatus whose primary purpose is illumination as opposed to display the method comprising:

(i) providing a light emitting element array, the light emitting element array comprising a plurality of light emitting elements arrayed on a first side of a first substrate, and the step of providing the light emitting element array comprising forming the plurality of light emitting elements and thereafter positioning them in an array on the first side of the first substrate;

providing an optical array comprising a plurality of directional optical elements arrayed on a first side of a second substrate;

(ii) reducing the thickness of the light emitting element array by reducing the thickness of the first substrate by removing material from the direction of the second side of the first substrate; and

before step (ii) is performed, forming a structure comprising the light emitting element array and the optical array, with the first side of the first substrate facing the first side of the second substrate, and with respective light emitting elements aligned with respective optical elements.

2. The method according to claim 1, further comprising, prior to step (i), providing a plurality of heat spreading elements wherein in step (i) respective heat spreading elements are positioned between the first substrate and respective light emitting elements.

3. The method according to claim 1, wherein the thickness of the structure is further reduced by reducing the thickness of the second substrate by removing material from the direction of the second side of the second substrate.

4. The method according to claim 1, further comprising, after step (ii), performing the following step:

(iii) increasing the thickness of the light emitting element array by providing one or more heatsink structures at the second side of the first substrate.

5. The method according to claim 4, wherein the thickness added to the light emitting element array by step (iii) is greater than the thickness by which the thickness of the light emitting element was reduced by step (ii).

6. The method according to claim 4, wherein the weight added to the light emitting element array structure by step (iii) is greater than the weight by which the weight of the light emitting element structure was reduced by step (ii).

7. The method according to claim 1, further comprising, prior to providing the light emitting element array, providing a plurality of heat spreading elements wherein, in the step of providing the light emitting element array, respective heat spreading elements are positioned between the first substrate and respective light emitting elements.

8. The method according to claim 1 wherein the plurality of light emitting elements are selectively removed from a monolithic wafer in a manner that preserves the relative spatial position of the selectively removed light-emitting elements.

9. The method according to claim 1 wherein the material of at least the first substrate comprises a ceramic material.

10. The method according to claim 1 wherein the material of at least the first substrate comprises a glass material.

11. The method according to claim 2 wherein the heat spreading elements comprise a metallic film formed on the first substrate.

12. The method according to claim 1 wherein the thickness of the first substrate after step (ii) is between about 0.01 mm and about 1.1 mm thick.

13. The method according to claim 1 wherein the first substrate after step (ii) is between about 0.05 mm and about 0.2 mm thick.

14. The method of manufacturing an illumination apparatus according to claim 1;

the method further comprising;

forming at least one seal between the first and second substrates.

15. An illumination apparatus whose primary purpose is illumination as opposed to display, the illumination apparatus comprising:

a light emitting element array;

a structure comprising the light emitting element array and an optical array, the optical array comprising a plurality of directional optical elements arrayed on a first side of a second substrate;

the light emitting element array comprising a plurality of light emitting elements arrayed on a first substrate, the light emitting elements having been arrayed on the first substrate after the light emitting elements were formed; and

the first side of the first substrate facing the first side of the second substrate, and respective light emitting elements aligned with respective optical elements,

wherein a thickness of the first substrate is reduced after the structure is formed.

16. The illumination apparatus according to claim 15, further comprising a plurality of heat spreading elements, respective heat spreading elements being positioned between the first substrate and respective light emitting elements.

17. An illumination apparatus according to claim 15, wherein the light emitting element array further comprises one or more heatsink structures at the second side of the first substrate.