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Electronic component for high temperatures

  • US 9,080,967 B2
  • Filed: 02/01/2011
  • Issued: 07/14/2015
  • Est. Priority Date: 02/04/2010
  • Status: Expired due to Fees
First Claim
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1. An electronic component, comprising:

  • a substrate;

    a conductor track structure situated on the substrate; and

    a functional layer which is contacted via the conductor track structure;

    wherein the conductor track structure is made of a metal mixture including platinum cores and at least one metal selected from the group made up of rhodium, iridium, ruthenium, palladium, osmium, gold, scandium, yttrium, lanthanum, the lanthanides, titanium, zirconium, hafnium, niobium, tantalum, chromium, tungsten, rhenium, iron, cobalt, nickel, copper, boron, aluminum, gallium, indium, silicon, and germanium; and

    wherein;

    each platinum core is contacted by another metal that forms the at least one metal;

    the platinum cores are particles; and

    at least some of the particles include multiple platinum atoms.

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