Soft error and radiation hardened sequential logic cell

• US 9,081,926 B2
• Filed: 09/13/2013
• Issued: 07/14/2015
• Est. Priority Date: 01/17/2008
• Status: Active Grant

• Current Assignee: RCI Europe AB
• Original Assignee: Klas Olof Lilja
• Inventors: Lilja, Klas Olof
• Primary Examiner(s): Rossoshek, Helen
• Application Number:
  US14/026,648
• Publication Number:
  US 20140019921A1
• Time in Patent Office: 669 Days
• Field of Search: 716/55, 716/103, 716/106, 716/111, 716/119, 716/120, 716/132, 716/136, 716/139, 326/12, 326/14
• US Class Current: 1/1
• CPC Class Codes: G06F 2119/18 Manufacturability analysis or optimisation for manufacturability
• CPC Class Codes: G06F 30/33 Design verification, e.g. functional simulation or model checking
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347
• CPC Class Codes: G06F 30/392 Floor-planning or layout, e.g. partitioning or placement
• CPC Class Codes: H03K 19/0033 Radiation hardening
• CPC Class Codes: H03K 19/00338 In field effect transistor circuits
• CPC Class Codes: H03K 19/20 characterised by logic function, e.g. AND, OR, NOR, NOT circuits H03K19/003 - H03K19/01 take precedence
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

This invention comprises a layout method to effectively protect logic circuits against soft errors (non-destructive errors) and circuit cells, with layout, which are protected against soft errors. In particular, the method protects against cases where multiple nodes in circuit are affected by a single event. These events lead to multiple errors in the circuit, and while several methods exist to deal with single node errors, multiple node errors are very hard to deal with using any currently existing protection methods. The method is particularly useful for CMOS based logic circuits in modem technologies (.ltoreq.90 nm), where the occurrence of multiple node pulses becomes high (due to the high integration level). It uses a unique layout configuration, which makes the circuits protected against single event generated soft-errors.

Claims

1. A sequential logic cell comprising:

four inverter circuits, each of the four inverter circuits comprising one p-type MOSFET having a gate, one n-type MOSFET having a gate, and one output, wherein the four inverter circuits are connected as a Dual Interlocked Cell (DICE), wherein for each inverter circuit, the gate of the p-type MOSFET is coupled to the output of a first of three remaining inverter circuits and the gate of the n-type MOSFET is coupled to the output of a second of the three remaining inverter circuits, wherein the first and second inverter circuits are different;

wherein the DICE comprises four nets, wherein each of the inverter outputs is coupled to one of the four nets, wherein a first net and a second net comprise a voltage state, and wherein a third net and a fourth net comprise an inverse voltage state, and wherein each net comprises a p-type drain contact area and an n-type drain contact area;

wherein each of the p-type contact areas and the n-type contact areas are placed along a line, wherein the line comprises a plurality of adjacent contact areas comprising a first contact area and a second contact area;

wherein for each pair of adjacent contact areas, if a first adjacent contact area and a second adjacent contact area both comprise p-type drain contact areas or both comprise n-type drain contact areas, the first adjacent contact area and the second adjacent contact area are coupled to nets comprising opposite voltage states; and

wherein for each pair of adjacent contact areas, if the first adjacent contact area and the second adjacent contact area comprise one p-type drain contact area and one n-type drain contact area, the first adjacent contact area and the second adjacent contact area are coupled to nets comprising similar voltage states.

2. The sequential logical cell of claim 1, comprising:

one or more protective MOSFET devices coupled between each of the four nets of the DICE, wherein the one or more protective MOSFET devices comprise;

a first p-type MOSFET device comprising a gate, a first contact, and a second contact, wherein the gate is coupled to a high voltage level, wherein the first contact is coupled to the p-type drain contact area of the first net;

a second p-type MOSFET device comprising a gate, a first contact, and a second contact, wherein the second contact of the first p-type MOSFET is coupled to the first contact of the second p-type MOSFET, and wherein the second contact of the second p-type MOSFET is coupled to one of the p-type drain contact area of the third net or a contact area adjacent to the p-type drain contact area of the third net;

a first n-type MOSFET device comprising a gate, a first contact, and a second contact, wherein the gate is coupled to a low voltage level, and wherein the first contact is coupled to the n-type contact area of the first net; and

a second n-type MOSFET device comprising a gate, a first contact, and a second contact, wherein the first contact of the second n-type MOSFET is coupled to the second contact of the first n-type MOSFET, and wherein the second contact of the second n-type MOSFET is coupled to one of the n-type drain contact area of the third net or a contact area adjacent to the n-type drain contact area of the third net;

wherein the contacts of the additional MOSFET devices are placed along the first line.

3. The sequential logic circuit of claim 2, wherein the first contact of each of the first p-type MOSFET, the second p-type MOSFET, the first n-type MOSFET, and the second n-type MOSFET each comprise a drain, and wherein the second contact of each of the first p-type MOSFET, the second p-type MOSFET, the first n-type MOSFET, and the second n-type MOSFET each comprise a source.

4. The sequential logic circuit of claim 2, wherein the first contact of each of the first p-type MOSFET, the second p-type MOSFET, the first n-type MOSFET, and the second n-type MOSFET each comprise a source, and wherein the second contact of each of the first p-type MOSFET, the second p-type MOSFET, the first n-type MOSFET, and the second n-type MOSFET each comprise a drain.