Circuit for applying heat and electrical stimulation
First Claim
1. A circuit for applying heat and electrical stimulation, the circuit comprising a substrate, the substrate comprising an electrode for applying electrical stimulation and a heating element, wherein at least one of the electrode and the heating element comprises an electrically conducting region patterned on a surface of the substrate wherein the substrate comprises a first surface and a second surface, the first surface being on a reverse side of the substrate with respect to the second surface, wherein the substrate is disposed between the electrode provided on the first surface and the heating element provided on the second surface.
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Accused Products
Abstract
A circuit (51) for applying heat and electrical stimulation comprises a substrate (500). The substrate (500) comprises an electrode (514) for applying electrical stimulation and a heating element (502). At least one of the electrode (514) and the heating element (502) comprises an electrically conducting region patterned on a surface of the substrate (500). The substrate (500) can be flexible.
143 Citations
23 Claims
- 1. A circuit for applying heat and electrical stimulation, the circuit comprising a substrate, the substrate comprising an electrode for applying electrical stimulation and a heating element, wherein at least one of the electrode and the heating element comprises an electrically conducting region patterned on a surface of the substrate wherein the substrate comprises a first surface and a second surface, the first surface being on a reverse side of the substrate with respect to the second surface, wherein the substrate is disposed between the electrode provided on the first surface and the heating element provided on the second surface.
- 14. A circuit for applying heat and electrical stimulation, the circuit comprising an electrode for applying electrical stimulation and a heating element, wherein the circuit is formed on a flexible substrate, wherein the flexible substrate comprises a first surface and a second surface, the first surface being on a reverse side of the flexible substrate with respect to the second surface, wherein the flexible substrate is disposed between the electrode provided on the first surface and the heating element provided on the second surface.
Specification