Arrangements for an integrated sensor
First Claim
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1. An integrated circuit, comprising:
- a lead frame;
a base substrate having first and second opposing surfaces, wherein the base substrate is coupled to the lead frame such that the second surface of the base substrate is above the lead frame and the first surface of the base substrate is above the second surface of the base substrate;
a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the base substrate such that the first surface of the first substrate is above the first surface of the base substrate and the second surface of the first substrate is above the first surface of the first substrate;
a second substrate having first and second opposing surfaces, wherein the second substrate is coupled to the base substrate such that the first surface of the second substrate is above the first surface of the base substrate and the second surface of the second substrate is above the first surface of the second substrate;
an electronic component disposed on the first surface of the first substrate; and
a first magnetic field sensing element disposed on the first surface of the second substrate.
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Abstract
An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.
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Citations
38 Claims
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1. An integrated circuit, comprising:
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a lead frame; a base substrate having first and second opposing surfaces, wherein the base substrate is coupled to the lead frame such that the second surface of the base substrate is above the lead frame and the first surface of the base substrate is above the second surface of the base substrate; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the base substrate such that the first surface of the first substrate is above the first surface of the base substrate and the second surface of the first substrate is above the first surface of the first substrate; a second substrate having first and second opposing surfaces, wherein the second substrate is coupled to the base substrate such that the first surface of the second substrate is above the first surface of the base substrate and the second surface of the second substrate is above the first surface of the second substrate; an electronic component disposed on the first surface of the first substrate; and a first magnetic field sensing element disposed on the first surface of the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. An integrated circuit, comprising:
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a lead frame; a base substrate having first and second opposing surfaces, wherein the base substrate is coupled to the lead frame such that the second surface of the base substrate is above the lead frame and the first surface of the base substrate is above the second surface of the base substrate; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the base substrate such that the second surface of the first substrate is above the first surface of the base substrate and the first surface of the first substrate is above the second surface of the first substrate; a second substrate having first and second opposing surfaces, wherein the second substrate is coupled to the base substrate such that the second surface of the second substrate is above the first surface of the base substrate and the first surface of the second substrate is above the second surface of the second substrate; an electronic component disposed on the first surface of the first substrate; and a first magnetic field sensing element disposed on the first surface of the second substrate. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. An integrated circuit, comprising:
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a substrate; a first magnetic field sensing element disposed on a surface of the substrate; and a second magnetic field sensing element disposed on a surface of the substrate, wherein the second magnetic field sensing element has a different structure than the first magnetic field sensing element, wherein the first magnetic field sensing element provides a first sensitivity to a magnetic field, wherein the second magnetic field sensing element provides a second different sensitivity to the magnetic field, and wherein the integrated circuit is configured to provide a first operating range responsive to the first magnetic field sensing element and a second different operating range responsive to the second magnetic field sensing element. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38)
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Specification