Airflow module and data storage device enclosure

• US 9,084,375 B2
• Filed: 11/19/2008
• Issued: 07/14/2015
• Est. Priority Date: 11/26/2007
• Status: Active Grant

• Current Assignee: Xyratex Technology Limited (Seagate Technology Holdings Plc)
• Original Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Inventors: Hughes, Robert W.
• Primary Examiner(s): Tompkins, Alissa
• Assistant Examiner(s): DECKER, PHILLIP
• Application Number:
  US12/274,041
• Publication Number:
  US 20090135558A1
• Time in Patent Office: 2,428 Days
• Field of Search: 454/184, 361/695
• US Class Current: 1/1
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source

Abstract

An airflow module for being received in a module bay of a data storage device enclosure is disclosed. The airflow module comprises a body having: a first face having a first opening therein; a second face having a second opening therein, the first face being adjacent to the second face; and, an airflow channel between the first opening and the second opening so as to allow the passage of air between the first opening and the second opening. The first and second openings are arranged to co-operate with airflow openings in modules positioned in adjacent bays of a said data storage device enclosure to direct a cooling stream of air between said modules in use. The airflow channel is free from components that generate substantial amounts of heat in their normal operation.

Claims

1. A device enclosure comprising:

an enclosure housing having a front end and a rear end;

a plurality of data devices arranged within the enclosure housing adjacent the front end thereof;

an electronics module disposed within the enclosure housing adjacent the rear end thereof comprising electronics for controlling the data devices, the electronics disposed within a rectilinear electronics module housing having opposing front and rear faces, opposing side faces and opposing top and bottom faces, the front face of the electronics module housing having an inlet opening in facing relation to the data devices, a selected one of the top or bottom faces of the electronics module housing having a first vent aperture extending therethrough, a selected one of the opposing side faces of the electronics module housing having a second vent aperture extending therethrough;

an airflow module disposed within the enclosure housing adjacent the rear end thereof comprising an empty rectilinear airflow module housing having opposing front and rear faces, opposing side faces and opposing top and bottom faces, the front face of the airflow module housing comprising a solid blocking surface in facing relation to the data devices, a selected one of the top or bottom faces of the airflow module housing having a third vent aperture extending therethrough, a selected one of the side faces of the airflow module housing having a fourth vent aperture extending therethrough, the airflow module housing in contacting engagement with the electronics module housing so that the first vent aperture is in facing relation and fluidic communication with the third vent aperture; and

a fan assembly disposed within the enclosure housing adjacent the electronics module and the airflow module, the fan assembly configured to draw cooling air from the front end of the enclosure housing to the rear end of the enclosure housing along a first path that passes from the inlet opening of the front face of the electronics module and out the second vent aperture and along a separate, second path that passes through the first vent aperture, the third vent aperture and the fourth vent aperture.

2. The enclosure of claim 1, wherein the top face of the electronics module housing contactingly engages the bottom face of the airflow module housing.

3. The enclosure of claim 1, wherein the top face of the airflow module housing contactingly engages the bottom face of the electronics module housing.

4. The enclosure of claim 1, wherein the second path of the cooling air passes through the first and third vent apertures to enter the airflow module housing and passes through the fourth vent aperture to exit the airflow module housing.

5. The enclosure of claim 1, further comprising a midplane to provide electrical interconnection paths between the data devices and the control electronics, wherein the cooling air sequentially passes adjacent the data devices, the midplane and into the inlet opening of the front face of the electronics module housing, and wherein the front face of the airflow module housing blocks said airflow from entering an interior of the airflow module housing.

6. The enclosure of claim 5, wherein the electronics module housing has a first overall length from the front face to the rear face thereof that nominally extends from the midplane to the rear end of the enclosure housing, the airflow module housing has a second overall length from the front face to the rear face thereof less than the first overall length, and the rear face of the electronics module housing is nominally aligned with the rear face of the airflow module housing at the rear end of the enclosure housing.

7. The enclosure of claim 1, further comprising a fifth vent aperture extending through the remaining one of the side faces of the electronics module housing and a sixth vent aperture extending through the remaining one of the side faces of the airflow module housing, the second and fourth vent apertures nominally aligned along a first plane and the fifth and sixth vent apertures nominally aligned along a second plane nominally parallel to the first plane.

8. The enclosure of claim 7, further comprising spaced apart first and second power supplies disposed within the enclosure housing adjacent the rear end thereof so that the electronics module and the airflow module are disposed therebetween, each of the first and second power supplies comprising a fan assembly that draws the cooling air through the enclosure housing, the first power supply comprising a housing having a first power supply vent aperture in fluidic communication with the second and fourth vent apertures, the second power supply comprising a housing having a second power supply vent aperture in fluidic communication with the fifth and sixth vent apertures.

9. The enclosure of claim 1, wherein the airflow module housing is characterized as an empty housing without an electronics module therein.

10. An enclosure, comprising:

an enclosure housing having a length from a first end to a second end;

a fan assembly disposed within the enclosure housing adjacent the second end to establish a cooling airflow that passes from the first end to the second end of the enclosure housing;

a plurality of data devices arranged within the first end of the enclosure housing;

an electronics module arranged within the second end of the enclosure housing comprising control electronics associated with the data devices within an electronics module housing comprising an inlet opening, a first vent aperture extending out a side surface parallel to the length of the enclosure housing and a second vent aperture extending out a top surface orthogonal to the side surface;

a midplane arranged within a medial portion of the enclosure housing to provide electrical interconnection between the data devices and the electronics module; and

an airflow module adjacent the electronics module having a closed blocked surface in facing relation to the midplane, a third vent aperture in contacting engagement and fluidic alignment with the second vent aperture and a fourth vent aperture extending out a side surface aligned with the side surface of the electronics module housing.

11. The enclosure of claim 10, wherein the fan assembly draws cooling air through the inlet opening of the electronics module housing, the cooling air dividing into a first portion that passes out of the electronics module housing through the second vent aperture to the fan assembly, and into a second portion that passes through the first and third vent apertures into the airflow module housing and out of the airflow module housing through the fourth vent aperture to the fan assembly.

12. The enclosure of claim 10, wherein the electronics module housing has a first overall length from a first face to a second face thereof that nominally extends from the midplane to the second end of the enclosure housing, the airflow module housing has a second overall length from a first face to a second face thereof less than the first overall length, and the second face of the electronics module housing is nominally aligned with the second face of the airflow module housing at the second end of the enclosure housing.

13. The enclosure of claim 10, further comprising a fifth vent aperture extending through the remaining one of the side faces of the electronics module housing and a sixth vent aperture extending through the remaining one of the side faces of the airflow module housing, the second and fourth vent apertures nominally aligned along a first plane and the fifth and sixth vent apertures nominally aligned along a second plane nominally parallel to the first plane.

14. The enclosure of claim 13, further comprising spaced apart first and second power supplies disposed within the enclosure housing adjacent the second end thereof so that the electronics module and the airflow module are disposed therebetween, each of the first and second power supplies comprising a fan assembly that draws the cooling air through the enclosure housing, the first power supply comprising a housing having a first power supply vent aperture in fluidic communication with the second and fourth vent apertures, the second power supply comprising a housing having a second power supply vent aperture in fluidic communication with the fifth and sixth vent apertures.

15. The enclosure of claim 10, wherein the airflow module housing is characterized as an empty housing without an electronics module therein, and wherein the airflow module housing is in a stacked arrangement with the electronics module and has a closed blocked surface in facing relation to the midplane.

16. The enclosure of claim 10, wherein the fan assembly draws a flow of cooling air through the fourth vent aperture into the airflow module housing and through the third and first vent apertures into the electronics module housing.

17. The enclosure of claim 10, wherein the data devices comprise at least a selected one of hard disc drives (HDDs) and solid state drives (SSDs).

18. The enclosure of claim 10, wherein the electronics module housing has overall dimensions of nominally about 205.5 millimeters, mm in a first direction by about 34.5 mm in a second direction, and by about 75 to about 300 mm in a third direction.

19. A system comprising:

an enclosure housing having a front end and a rear end;

a plurality of data devices arranged within the enclosure housing adjacent the front end thereof;

a fan assembly arranged within the enclosure housing adjacent the rear end thereof;

an electronics module disposed within the enclosure housing adjacent the fan assembly comprising control electronics for controlling the data devices, the electronics disposed within a rectilinear electronics module housing having opposing front and rear faces, opposing side faces and opposing top and bottom faces, the front face of the electronics module housing having an inlet opening in facing relation to the data devices, a selected one of the top or bottom faces of the electronics module housing having a first vent aperture extending therethrough, a selected one of the opposing side faces of the electronics module housing having a second vent aperture extending therethrough;

an airflow module disposed within the enclosure housing adjacent the rear end thereof and in contacting alignment with the electronics module, the airflow module comprising an empty rectilinear airflow module housing having opposing front and rear faces, opposing side faces and opposing top and bottom faces, the front face of the airflow module housing comprising a solid blocking surface in facing relation to the data devices, a selected one of the top or bottom faces of the airflow module housing having a third vent aperture extending therethrough, a selected one of the side faces of the airflow module housing having a fourth vent aperture extending therethrough, the first vent aperture in facing relation and fluidic communication with the third vent aperture, the fan assembly drawing cooling air from the front end of the enclosure housing to the rear end of the cooling housing along a first path that passes through the inlet opening of the front face of the electronics module and out the second aperture and along a separate, second path that passes through the first and third vent apertures and the fourth vent aperture.

20. The system of claim 19, further comprising a midplane to provide electrical interconnection paths between the data devices and the control electronics, wherein the cooling air sequentially passes adjacent the data devices, the midplane and into the inlet opening of the front face of the electronics module housing, and wherein the front face of the airflow module housing blocks said airflow from entering an interior of the airflow module housing.