Systems and methods for making and using electrical stimulation systems with improved RF compatibility
First Claim
1. A method of forming a control module for an electrical stimulation system, the control module comprising an electronic subassembly disposed in an inner space of a casing and a feedthrough housing disposed along a portion of the casing, the method comprising:
- forming, an RF-diverting assembly, the RF-diverting assembly comprising a plurality of capacitive elements electrically coupled to a feedthrough ground;
electrically coupling the plurality of capacitive elements to a plurality of conductive pathways extending along a first major surface of a non-conductive substrate, wherein the plurality of capacitive elements are disposed on the first major surface of the non-conductive substrate;
electrically coupling the plurality of conductive pathways to a plurality of feedthrough pins extending through the feedthrough housing from a location external to the casing to a location within the inner space of the casing;
electrically coupling the plurality of conductive pathways to the electronic subassembly such that the plurality of conductive pathways electrically couple the plurality of feedthrough pins to the electronic subassembly;
electrically coupling the feedthrough ground to at least one electrically-conductive portion of the feedthrough housing wherein the feedthrough ground is disposed on a second major surface, opposite the first major surface, of the non-conductive substrate; and
electrically coupling the at least one electrically-conductive portion of the feedthrough housing to at least one electrically-conductive portion of an outer surface of the casing.
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Abstract
A method of forming a control module for an electrical stimulation system, the control module including an electronic subassembly disposed in an inner space of a casing and a feedthrough housing disposed along a portion of the casing, includes: forming an RF-diverting assembly having capacitive elements electrically-coupled to a feedthrough ground; electrically-coupling the capacitive elements to conductive pathways extending along a non-conductive substrate; electrically-coupling the conductive pathways to feedthrough pins extending through the feedthrough housing from a location external to the casing to a location within the inner space of the casing; electrically-coupling the conductive pathways to the electronic subassembly such that the conductive pathways electrically-couple the feedthrough pins to the electronic subassembly; electrically-coupling the feedthrough ground to an electrically-conductive portion of the feedthrough housing; and electrically-coupling the electrically-conductive portion of the feedthrough housing to an electrically-conductive portion of an outer surface of the casing.
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Citations
19 Claims
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1. A method of forming a control module for an electrical stimulation system, the control module comprising an electronic subassembly disposed in an inner space of a casing and a feedthrough housing disposed along a portion of the casing, the method comprising:
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forming, an RF-diverting assembly, the RF-diverting assembly comprising a plurality of capacitive elements electrically coupled to a feedthrough ground; electrically coupling the plurality of capacitive elements to a plurality of conductive pathways extending along a first major surface of a non-conductive substrate, wherein the plurality of capacitive elements are disposed on the first major surface of the non-conductive substrate; electrically coupling the plurality of conductive pathways to a plurality of feedthrough pins extending through the feedthrough housing from a location external to the casing to a location within the inner space of the casing; electrically coupling the plurality of conductive pathways to the electronic subassembly such that the plurality of conductive pathways electrically couple the plurality of feedthrough pins to the electronic subassembly; electrically coupling the feedthrough ground to at least one electrically-conductive portion of the feedthrough housing wherein the feedthrough ground is disposed on a second major surface, opposite the first major surface, of the non-conductive substrate; and electrically coupling the at least one electrically-conductive portion of the feedthrough housing to at least one electrically-conductive portion of an outer surface of the casing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification