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Solid state nanopore devices for nanopore applications to improve the nanopore sensitivity and methods of manufacture

  • US 9,085,120 B2
  • Filed: 08/26/2013
  • Issued: 07/21/2015
  • Est. Priority Date: 08/26/2013
  • Status: Expired due to Fees
First Claim
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1. A method, comprising:

  • forming a membrane layer on an underlying semiconductor substrate;

    forming a hole in the membrane layer;

    plugging the hole with a sacrificial material;

    forming a membrane over a top surface of the sacrificial material;

    forming an optional sacrificial material over the sacrificial material and under the membrane;

    removing the sacrificial material within the hole and portions of the underlying semiconductor substrate; and

    drilling an opening in the membrane, aligned with the hole, after the sacrificial material has been removed,wherein the membrane remains directly over remaining portions of the optional sacrificial material during the removing step.

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