Trench shield connected JFET

• US 9,087,911 B2
• Filed: 06/06/2014
• Issued: 07/21/2015
• Est. Priority Date: 06/06/2013
• Status: Active Grant

• Current Assignee: United Silicon Carbide, Inc. (Qorvo, Inc.)
• Original Assignee: United Silicon Carbide, Inc. (Qorvo, Inc.)
• Inventors: Alexandrov, Peter, Bhalla, Anup
• Primary Examiner(s): Fulk, Steven J
• Assistant Examiner(s): WARD, ERIC A
• Application Number:
  US14/298,394
• Publication Number:
  US 20140361349A1
• Time in Patent Office: 410 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 29/0619 with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
• CPC Class Codes: H01L 29/1066 Gate region of field-effect devices with PN junction gate
• CPC Class Codes: H01L 29/66909 Vertical transistors, e.g. tecnetrons
• CPC Class Codes: H01L 29/8083 Vertical transistors SIT H01L29/7722
• CPC Class Codes: H01L 2924/13062 Junction field-effect transistor [JFET]

Abstract

A shielded junction field effect transistor (JFET) is described having gate trenches and shield trenches, the shield trenches being deeper and narrower than the gate trenches. The gate trenches may be fully aligned, partially aligned, or separated from the shield trenches.

Claims

1. A shielded junction field effect transistors (JFET), the shielded JFET comprising:

a source contact,

a channel area of a first conductivity type disposed below the source electrode along a first direction, the channel area comprising one or more planar layers of the first conductivity type, the channel area having an upper planar surface and a lower planar surface spaced apart along the first direction;

a first trench, the first trench having;

a first bottom surface located in between the upper planar surface and the lower planar surface along the first direction, the first bottom surface extending along the first direction,

a first depth that extends a first distance into the channel area from the upper planar surface of the channel layer towards the first bottom surface along the first direction,

a first center line,

a first pair of side walls spaced apart from one another along a second direction that is perpendicular to the first direction, the first pair of side walls extending from the first bottom surface of the first trench to the upper planar surface of the channel area;

a first implanted U-shaped conductivity region of the second conductivity type in the channel area comprising;

(1) a first portion extending along the bottom surface of the first trench; and

(2) a second portion extending from the first bottom surface of the first trench to the upper planar surface of the channel area along each of the pair of side walls; and

a gate contact disposed in the first trench and adjacent to the first bottom surface of the first trench; and

a second trench, the second trench having;

a second bottom surface located in between the upper planar surface and the lower planar surface along the first direction, the first bottom surface extending along the first direction,

a second depth that extends a second distance into the channel area from the upper planar surface of the channel layer towards the second bottom surface along the first direction, the second depth being greater than the first depth;

a second center line,

a second pair of side walls spaced apart from one another along the second direction, the second pair of side walls extending (1) from the second bottom surface of the first trench towards the upper planar surface of the channel area and (2) at least partially between the second bottom surface of the second trench and the upper planar surface of the channel area;

a second implanted U-shaped conductivity region of the second conductivity type in the channel area comprising;

(1) a first portion extending along the second bottom surface of the second U-shaped trench;

(2) a second portion extending at least partially between the second bottom surface of the second trench and the upper planar surface of the channel area along each of the second pair of side walls; and

a shield contact disposed adjacent to the second bottom surface of the second trench.

2. The shielded JFET of claim 1, wherein the shield contact is electrically connected to the source contact so as to hold the shield contact at source potential.

3. The shielded JFET of claim 1, wherein the shield contact is electrically connected to the gate contact so as to hold the shield contact at gate potential.

4. The shielded JFET of any of claims 1-3, further comprising:

a first unimplanted region extending along each of the pair of side walls of the second trench, the first unimplanted portion being disposed between the second bottom surface and the second portion of the second U-shaped conductivity regions of the second trench along the first direction.

5. The shielded JFET of claim 1, wherein the second portion of the second U-shaped conductivity region of the second trench extends from the second bottom surface of the second trench along the entire length of the second pair of side walls in the first direction.

6. The shielded JFET of claim 1, wherein the first centerline is fully aligned with the second centerline.

7. The shielded JFET of claim 1, wherein the second pair of side walls extend between the first bottom surface of the first trench and the second bottom surface of the second trench along the first direction.

8. The shielded JFET of claim 1, wherein the first centerline is spaced a third distance from the second centerline along the second direction.

9. The shielded JFET of claim 1, wherein the first centerline is spaced a fourth distance from the second centerline along the second direction such that the first trench is separate from the second trench.

10. A method of creating a shielded JFET, the method comprising:

forming a channel area of a first conductivity type disposed below the source electrode along a first direction, the channel area comprising one or more planar layers of the first conductivity type, the channel area having an upper planar surface and a lower planar surface spaced apart along the first direction;

forming a source contact above the channel area along a first direction,

forming a first trench, the first trench having;

a first bottom surface located in between the upper planar surface and the lower planar surface along the first direction, the first bottom surface extending along the first direction,

a first depth that extends a first distance into the channel area from the upper planar surface of the channel layer towards the first bottom surface along the first direction,

a first center line,

a first pair of side walls spaced apart from one another along a second direction that is perpendicular to the first direction, the first pair of side walls extending from the first bottom surface of the first trench to the upper planar surface of the channel area;

forming a first implanted U-shaped conductivity region of the second conductivity type in the channel area comprising;

(1) a first portion extending along the bottom surface of the first trench; and

(2) a second portion extending from the first bottom surface of the first trench to the upper planar surface of the channel area along each of the pair of side walls; and

forming a gate contact disposed in the first trench and adjacent to the first bottom surface of the first trench; and

forming a second trench, the second trench having;

a second bottom surface located in between the upper planar surface and the lower planar surface along the first direction, the first bottom surface extending along the first direction,

a second depth that extends a second distance into the channel area from the upper planar surface of the channel layer towards the second bottom surface along the first direction, the second depth being greater than the first depth;

a second center line,

a second pair of side walls spaced apart from one another along the second direction, the second pair of side walls extending (1) from the second bottom surface of the first trench towards the upper planar surface of the channel area and (2) at least partially between the second bottom surface of the second trench and the upper planar surface of the channel area;

forming a second implanted U-shaped conductivity region of the second conductivity type in the channel area comprising;

(1) a first portion extending along the second bottom surface of the second U-shaped trench;

(2) a second portion extending at least partially between the second bottom surface of the second trench and the upper planar surface of the channel area along each of the second pair of side walls; and

forming a shield contact disposed adjacent to the second bottom surface of the second trench.

11. The method of claim 10, wherein the shield contact is electrically connected to the source contact so as to hold the shield contact at source potential.

12. The method of claim 10, wherein the shield contact is electrically connected to the gate contact so as to hold the shield contact at gate potential.

13. The method of claim 10, wherein the second portion of the second U-shaped conductivity region of the second trench extends from the second bottom surface of the second trench along the entire length of the second pair of side walls in the first direction.

14. The method of claim 10, wherein the first centerline is fully aligned with the second centerline.

15. The method of claim 10, wherein the second pair of side walls extend between the first bottom surface of the first trench and the second bottom surface of the second trench along the first direction.

16. The method of claim 10, wherein the first centerline is spaced a third distance from the second centerline along the second direction.

17. The method of claim 10, wherein the first centerline is spaced a fourth distance from the second centerline along the second direction such that the first trench is separate from the second trench.

18. The method of claim 10, further comprising:

preventing ion implantation in a first unimplanted region extending along each of the second pair of side walls of the second trench, the first unimplanted portion being disposed between the second bottom surface and the second portion of the second U-shaped conductivity regions of the second trench along the first direction.

19. The method of claim 18, wherein the step of preventing further includes depositing a dielectric on each of the second pair of side walls adjacent to the first unimplanted region.

20. The method of claim 18, wherein the step of preventing further includes performing thermo oxidation.

21. The method of claim 14, further comprising:

preventing ion implantation in a first unimplanted region extending along each of the second pair of side walls of the second trench, the first unimplanted portion being disposed between the second bottom surface and the second portion of the second U-shaped conductivity regions of the second trench along the first direction.

22. The method of claim 21, wherein the step of preventing further includes depositing a dielectric on each of the second pair of side walls adjacent to the first unimplanted region.

23. The method of claim 21, wherein the step of preventing further includes performing thermo oxidation.