Controlling data center cooling

• US 9,091,496 B2
• Filed: 02/27/2013
• Issued: 07/28/2015
• Est. Priority Date: 03/08/2012
• Status: Active Grant

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: Google Inc. (Alphabet Inc.)
• Inventors: Imwalle, Gregory P., Kowalski, Thomas R., Carlson, Andrew B.
• Primary Examiner(s): FORD, JOHN K
• Application Number:
  US13/779,159
• Publication Number:
  US 20130233532A1
• Time in Patent Office: 881 Days
• Field of Search: 165287-294, 165/299, 165/300, 622/592, 621/50, 621/85, 622/01
• US Class Current: 1/1
• CPC Class Codes: F28F 27/02 for controlling the distribution of heat-exchange media between different channels static flow control means in header boxes F28F9/026; arrangements of guide plates or guide vanes F28F9/22, F28F25/12
• CPC Class Codes: H05K 7/20745 within rooms for removing heat from cabinets, e.g. by air conditioning device
• CPC Class Codes: H05K 7/20836 Thermal management, e.g. server temperature control

Abstract

A data center cooling system includes a data center having electronic equipment that is supported in multiple racks; a cooling fluid source; multiple cooling units in the data center, where each cooling unit is configured to cool air warmed by a sub-set of the electronic equipment in the data center; multiple control valves, including a control valve associated with a particular cooling unit of the cooling units; and a controller arranged to modulate the control valve associated with a particular cooling unit, to open or close the control valve to substantially maintain an approach temperature set point of the particular cooling unit.

Claims

1. A data center cooling system, comprising:

a data center having electronic equipment that is supported in a plurality of racks;

a cooling fluid source;

a plurality of cooling units in the data center, each cooling unit configured to cool air warmed by a sub-set of the electronic equipment in the data center;

a plurality of control valves, including a particular control valve associated with a particular cooling unit of the plurality of cooling units; and

a controller arranged to modulate the particular control valve associated with a particular cooling unit, to open or close the control valve to substantially maintain an approach temperature set point of the particular cooling unit, wherein the approach temperature is defined by a difference between a temperature of an airflow circulated from the cooling unit and a temperature of the cooling fluid source circulated to the particular cooling unit, and wherein the controller is arranged to receive a signal adjusting the approach temperature set point, wherein the controller is one of a plurality of controllers, each of the plurality of controllers associated with one of the plurality of cooling units, where the controller is arranged to modulate the particular control valve based on receipt of a signal adjusting the approach temperature set point based, at least in part, on the particular control valve being at a percentage open position that varies from a threshold percentage open setpoint.

2. The data center cooling system of claim 1, wherein the controller is arranged to modulate the control valve to open the control valve based on the controller receiving the signal adjusting the approach temperature set point.

3. The data center cooling system of claim 1, wherein the controller is arranged to modulate the plurality of control valves to open the plurality of control valves until about 98% of the plurality of control valves are about 95% open.

4. The data center cooling system of claim 1, further comprising:

an airflow temperature sensor arranged to measure the temperature of the airflow as it leaves the particular cooling unit; and

a fluid temperature sensor arranged to measure a temperature of the cooling fluid source as it enters the particular cooling unit.

5. The data center cooling system of claim 1, wherein the particular cooling unit comprises one or more cooling coils that receive the circulating cooling fluid.

6. The data center cooling system of claim 5, wherein each cooling unit comprises one or more fans arranged to circulate air from an ambient workspace adjacent a row of racks, through front sides of the racks open to the workspace, through back sides of the racks opposite the front sides, and to the cooling unit.

7. The data center cooling system of claim 6, wherein the one or more fans are arranged to circulate the air through the racks to receive heat generated by the electronic equipment, and

wherein the one or more fans are arranged to circulate the heated air through the cooling coils to transfer the heat generated by the electronic equipment to the circulating cooling fluid and to expel the air to the ambient workspace.

8. The data center cooling system of claim 6, wherein the one or more fans of the particular cooling unit are arranged to circulate air from the ambient workspace through the front sides of at least two adjacent racks in the row of racks, through the back sides of the two racks opposite the front sides, and to the particular cooling unit.

9. The data center cooling system of claim 6, further comprising a fan controller arranged to vary a speed of the one or more fans in response to the signal adjusting the approach temperature set point.

10. The data center cooling system of claim 1, wherein the racks are in rows, and the cooling units are positioned on a support floor of the data center between pairs of adjacent rows.

11. The data center cooling system of claim 1, wherein the signal to adjust approach temperature is based on an amount of cooling fluid flow that is required to meet a cooling load in the data center.

12. The data center cooling system of claim 1, wherein the signal to adjust approach temperature is based on an aggregate amount of cooling fluid circulated to the plurality of cooling units.

13. The data center cooling system of claim 12, wherein the controller is configured to decrease the approach temperature set point based on the aggregate amount of cooling fluid below a threshold amount, and increase the approach temperature set point based on the aggregate amount above a threshold amount.

14. The data center cooling system of claim 1, wherein each control valve associated with a cooling unit of the plurality of cooling units is modulated to maintain a unique approach temperature set point associated with the cooling unit.

15. The data center cooling system of claim 1, wherein each cooling unit comprises a liquid-to-liquid heat exchanger comprising a working fluid in heat transfer communication with the cooling fluid source, the working fluid operable to cool air warmed by the sub-set of the electronic equipment in the data center.

16. The data center cooling system of claim 1, wherein the particular valve is selected from the plurality of control valves based on a flow rate of the cooling fluid source.

17. A method for cooling a data center, the method comprising:

circulating a cooling fluid, through a plurality of control valves, to a plurality of cooling units in a data center that contains electronic equipment that is supported in a plurality of racks;

circulating air from an ambient workspace that is adjacent the plurality of racks, across a sub-set of the electronic equipment that is supported in the plurality of racks, through a particular cooling unit of the plurality of cooling units, and from the particular cooling unit to the ambient workspace;

determining a temperature of the air leaving the particular cooling unit;

determining a temperature of the cooling fluid circulated to the particular cooling unit;

modulating a flow rate of the cooling fluid circulated through a particular control valve to the particular cooling unit to maintain an approach temperature set point of the particular cooling unit, wherein the approach temperature is defined using a difference between the temperature of the air leaving the particular cooling unit and the temperature of the cooling fluid circulated to the particular cooling unit;

modulating the flow rate of the cooling fluid circulated to the particular cooling unit based on a change in the approach temperature set point that is received from a control system;

varying a rate of the air circulated from the particular cooling unit to the ambient workspace in response to the change in the approach temperature set point; and

modulating the particular control valve based on receipt of a signal adjusting the approach temperature set point based, at least in part, on the particular control valve being at a percentage open position that varies from a threshold percentage open setpoint.

18. The method of claim 17, wherein modulating the flow rate of the cooling fluid circulated to the particular cooling unit comprises modulating a control valve associated with the particular cooling unit to open or close the control valve with a controller.

19. The method of claim 17, further comprising receiving a signal at the controller that represents the change in the approach temperature set point.

20. The method of claim 17, further comprising modulating a plurality of control valves associated with the plurality of cooling units to open the plurality of control valves until about 98% of the plurality of control valves are about 95% open.

21. The method of claim 17, further comprising:

circulating air warmed by the sub-set of electronic equipment through one or more cooling coils of the particular cooling unit; and

circulating cool air from the one or more cooling coils to the ambient workspace.

22. The method of claim 17, further comprising:

determining a cooling load of the data center; and

adjusting the approach temperature set point to meet the cooling load in the data center.

23. The method of claim 17, wherein the signal to adjust approach temperature is based on an aggregate amount of cooling fluid circulated to the plurality of cooling units.

24. The method of claim 23, wherein the controller is configured to decrease the approach temperature set point based on the aggregate amount below a threshold amount, and increase the approach temperature set point based on the aggregate amount above a threshold amount.

25. The method of claim 17, wherein each control valve associated with a cooling unit of the plurality of cooling units is modulated to maintain a unique approach temperature set point associated with the cooling unit.

26. The method of claim 17, wherein the particular valve is selected from the plurality of control valves based on a flow rate of the cooling fluid source.

27. A data center cooling system, comprising:

a computer rack that supports a plurality of heat-generating devices;

a fan coil unit arranged adjacent to the computer rack and comprising;

at least one fan arranged to circulate air from an open front side of the computer rack adjacent a human-occupiable workspace through the rack and to an open back side of the computer rack adjacent the fan coil unit; and

at least one cooling coil adjacent the open back side of the computer rack and arranged to receive heated air circulated from the computer rack and cool the heated air;

a control valve configured to control a volumetric flow of cooling fluid circulated to the cooling coil;

a unit controller communicably coupled to the control valve and configured to modulate the valve to meet an approach temperature set point of the fan coil unit, wherein an approach temperature is a difference between a leaving air temperature of the fan coil unit and an entering cooling fluid temperature of the fan coil unit, wherein the approach temperature set point is varied based on an open percentage of the modulating valve; and

a main controller communicably coupled to the unit controller, and the main controller is operable to receive a signal representative of the open percentage of the control valve, and in response to the signal, transmit a command to the unit controller to vary the approach temperature set point, where the unit controller is operable to receive a signal from the main controller adjusting the approach temperature set point based, at least in part, on the control valve being at a percentage open position that varies from a threshold percentage open setpoint.

28. The data center cooling system of claim 27, wherein the main controller is operable to determine an available amount of the cooling fluid from a central cooling plant, and based on the determined available amount and the signal representative of the open percentage of the control valve, transmit a second command to the unit controller to vary the approach temperature set point.

29. The data center cooling system of claim 27, wherein the main controller is operable to compare the signal representative of the open percentage of the control valve to a predetermined percentage, and based on a variance in the signal and the predetermined percentage, transmit a second command to the unit controller to vary the approach temperature set point.

30. The data center cooling system of claim 27, wherein the main controller is operable to compare a plurality of signals representative of open percentages of a plurality of control valves to a predetermined percentage, and based on a variance between an aggregation of the plurality of signals and the predetermined percentage, transmit a second command to the unit controller to vary the approach temperature set point.

31. A data center cooling system, comprising:

a data center having electronic equipment that is supported in a plurality of racks;

a cooling fluid source;

a plurality of cooling units in the data center, each cooling unit configured to cool air warmed by a sub-set of the electronic equipment in the data center;

a plurality of control valves, including a particular control valve associated with a particular cooling unit of the plurality of cooling units; and

a controller arranged to modulate the particular control valve associated with a particular cooling unit, to open or close the control valve to substantially maintain an approach temperature set point of the particular cooling unit, wherein the approach temperature is defined by a difference between a temperature of an airflow circulated from the cooling unit and a temperature of the cooling fluid source circulated to the particular cooling unit, and wherein the controller is arranged to receive a signal adjusting the approach temperature set point, wherein the controller is one of a plurality of controllers, each of the plurality of controllers associated with one of the plurality of cooling units, wherein the controller is arranged to modulate the plurality of control valves to open the plurality of control valves until about 98% of the plurality of control valves are about 95% open.

32. A data center cooling system, comprising:

a data center having electronic equipment that is supported in a plurality of racks;

a cooling fluid source;

a plurality of cooling units in the data center, each cooling unit configured to cool air warmed by a sub-set of the electronic equipment in the data center;

a plurality of control valves, including a particular control valve associated with a particular cooling unit of the plurality of cooling units; and

a controller arranged to modulate the particular control valve associated with a particular cooling unit, to open or close the control valve to substantially maintain an approach temperature set point of the particular cooling unit, wherein the approach temperature is defined by a difference between a temperature of an airflow circulated from the cooling unit and a temperature of the cooling fluid source circulated to the particular cooling unit, and wherein the controller is arranged to receive a signal adjusting the approach temperature set point, wherein the controller is one of a plurality of controllers, wherein the particular valve is selected from the plurality of control valves based on a flow rate of the cooling fluid source.

33. A method for cooling a data center, the method comprising:

circulating a cooling fluid, through a plurality of control valves, to a plurality of cooling units in a data center that contains electronic equipment that is supported in a plurality of racks;

circulating air from an ambient workspace that is adjacent the plurality of racks, across a sub-set of the electronic equipment that is supported in the plurality of racks, through a particular cooling unit of the plurality of cooling units, and from the particular cooling unit to the ambient workspace;

determining a temperature of the air leaving the particular cooling unit;

determining a temperature of the cooling fluid circulated to the particular cooling unit;

modulating a flow rate of the cooling fluid circulated through a particular control valve to the particular cooling unit to maintain an approach temperature set point of the particular cooling unit, wherein the approach temperature is defined using a difference between the temperature of the air leaving the particular cooling unit and the temperature of the cooling fluid circulated to the particular cooling unit;

modulating the flow rate of the cooling fluid circulated to the particular cooling unit based on a change in the approach temperature set point that is received from a control system;

varying a rate of the air circulated from the particular cooling unit to the ambient workspace in response to the change in the approach temperature set point; and

modulating a plurality of control valves associated with the plurality of cooling units to open the plurality of control valves until about 98% of the plurality of control valves are about 95% open.

34. A method for cooling a data center, the method comprising:

circulating a cooling fluid, through a plurality of control valves, to a plurality of cooling units in a data center that contains electronic equipment that is supported in a plurality of racks;

circulating air from an ambient workspace that is adjacent the plurality of racks, across a sub-set of the electronic equipment that is supported in the plurality of racks, through a particular cooling unit of the plurality of cooling units, and from the particular cooling unit to the ambient workspace;

determining a temperature of the air leaving the particular cooling unit;

determining a temperature of the cooling fluid circulated to the particular cooling unit;

modulating a flow rate of the cooling fluid circulated through a particular control valve to the particular cooling unit to maintain an approach temperature set point of the particular cooling unit, wherein the approach temperature is defined using a difference between the temperature of the air leaving the particular cooling unit and the temperature of the cooling fluid circulated to the particular cooling unit, and the particular valve is selected from the plurality of control valves based on a flow rate of the cooling fluid source;

modulating the flow rate of the cooling fluid circulated to the particular cooling unit based on a change in the approach temperature set point that is received from a control system; and

varying a rate of the air circulated from the particular cooling unit to the ambient workspace in response to the change in the approach temperature set point.