High voltage low current surface emitting light emitting diode
First Claim
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1. A light emitting diode (LED) chip, comprising:
- a submount;
a reflective layer on the submount;
an insulating layer on the reflective layer opposite the submount;
a plurality of sub-LEDs on the insulating layer;
a first transparent contact between a first of the plurality of sub-LEDs and the insulating layer;
a second transparent contact between the second of the plurality of sub-LEDs and the insulating layer;
electrical interconnects between adjacent ones of the plurality of sub-LEDs;
a first side insulator on a first sidewall of the first of the plurality of sub-LEDs;
a second side insulator on a second sidewall of the first of the plurality of sub-LEDs that is opposite the first sidewall; and
a third side insulator on a first sidewall of a second of the plurality of sub-LEDs,wherein the first transparent contact extends laterally beyond both the first sidewall and the second sidewall of the first of the plurality of sub-LEDs to provide respective first and second shelves,wherein the second transparent contact extends laterally beyond both the first sidewall and a second sidewall of the second of the plurality of sub-LEDs to provide respective third and fourth shelves,wherein a first of the electrical interconnects contacts is coupled between the second transparent contact and a cathode contact of the first of the plurality of sub-LEDs so that the first of the electrical interconnects directly contacts a sidewall of the first side insulator and contacts an upper surface of the third shelf of the second transparent contact within an opening between the first and third side insulators, andwherein a lower surface of the first side insulator contacts an upper surface of the first transparent contact and a lower surface of the second side insulator contacts an upper surface of the first transparent contact.
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Abstract
A light emitting diode chip includes a submount, a reflective layer on the submount, an insulating layer on the reflective layer opposite the submount, and a plurality of sub-LEDs on the insulating layer. Each of the sub-LEDs includes a first face adjacent to the submount and a transparent contact on the first face between the sub-LED and the insulating layer and electrical interconnects between adjacent ones of the sub-LEDs.
82 Citations
20 Claims
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1. A light emitting diode (LED) chip, comprising:
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a submount; a reflective layer on the submount; an insulating layer on the reflective layer opposite the submount; a plurality of sub-LEDs on the insulating layer; a first transparent contact between a first of the plurality of sub-LEDs and the insulating layer; a second transparent contact between the second of the plurality of sub-LEDs and the insulating layer; electrical interconnects between adjacent ones of the plurality of sub-LEDs; a first side insulator on a first sidewall of the first of the plurality of sub-LEDs; a second side insulator on a second sidewall of the first of the plurality of sub-LEDs that is opposite the first sidewall; and a third side insulator on a first sidewall of a second of the plurality of sub-LEDs, wherein the first transparent contact extends laterally beyond both the first sidewall and the second sidewall of the first of the plurality of sub-LEDs to provide respective first and second shelves, wherein the second transparent contact extends laterally beyond both the first sidewall and a second sidewall of the second of the plurality of sub-LEDs to provide respective third and fourth shelves, wherein a first of the electrical interconnects contacts is coupled between the second transparent contact and a cathode contact of the first of the plurality of sub-LEDs so that the first of the electrical interconnects directly contacts a sidewall of the first side insulator and contacts an upper surface of the third shelf of the second transparent contact within an opening between the first and third side insulators, and wherein a lower surface of the first side insulator contacts an upper surface of the first transparent contact and a lower surface of the second side insulator contacts an upper surface of the first transparent contact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 16, 17, 18, 19, 20)
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10. A light emitting diode (LED) chip, comprising:
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a submount; a reflective layer on the submount; an electrically insulating layer on the reflective layer, opposite the submount; first and second sub-LEDs at spaced-apart locations on the electrically insulating layer; a first transparent contact between the first sub-LED and the electrically insulating layer; a second transparent contact between the second sub-LED and the electrically insulating layer; and a first side insulator on a first sidewall of the first sub-LED, the first side insulator contacting an upper surface of the first transparent contact and an upper surface of the first sub-LED; and a second side insulator on a second sidewall of the first sub-LED, the second side insulator contacting an upper surface of the first transparent contact and an upper surface of the first sub-LED; a third side insulator on a first sidewall of the second sub-LED that faces the first sidewall of the first sub-LED, the second side insulator contacting an upper surface of the second transparent contact; an electrical interconnect that electrically connects a cathode contact of the first sub-LED to an anode contact of the second sub-LED, wherein the electrical interconnect directly contacts both a sidewall of the first side insulator and a sidewall of the third side insulator, and wherein the electrically insulating layer is a continuous layer that extends, without interruption, underneath both the first transparent contact and the second transparent contact and underneath a gap between the first and second transparent contacts. - View Dependent Claims (11)
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12. A light emitting diode (LED) chip, comprising:
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a submount; a reflective layer on the submount; an electrically insulating layer on the reflective layer, opposite the submount; first and second sub-LEDs at spaced-apart locations on the electrically insulating layer; a first transparent contact between the first sub-LED and the electrically insulating layer; a second transparent contact between the second sub-LED and the electrically insulating layer, the second transparent contact separated from the first transparent contact by an insulating spacer; a first side insulator on a first sidewall of the first sub-LED, the first side insulator contacting an upper surface of the first transparent contact and an upper surface of the first sub-LED; a second side insulator on a second sidewall of the first sub-LED that is opposite the first sidewall, the second side insulator contacting the upper surface of the first transparent contact and the upper surface of the first sub-LED; a third side insulator on a sidewall of the second sub-LED that faces the first sidewall of the first sub-LED, the third side insulator contacting an upper surface of the second transparent contact and an upper surface of the second sub-LED, wherein the electrically insulating layer is a continuous layer that extends, without interruption, underneath the first and second sub-LEDs and underneath the insulating spacer. - View Dependent Claims (13, 14, 15)
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Specification