Light emitting device

• US 9,093,357 B2
• Filed: 03/18/2014
• Issued: 07/28/2015
• Est. Priority Date: 01/22/2010
• Status: Expired due to Fees

• Current Assignee: Heavy Duty Lighting LLC (Ni, Wang & Massand, PLLC)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Ishizaki, Shinya, Agatani, Makoto, Nada, Tomokazu, Hata, Toshio
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US14/217,701
• Publication Number:
  US 20140197433A1
• Time in Patent Office: 497 Days
• Field of Search: 257/88, 257/89, 257/98, 257/99, 257/E33.061, 257/E33.057
• US Class Current: 1/1
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 5/048 the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses
• CPC Class Codes: F21V 5/10 comprising photoluminescent material
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.

Claims

1. A light emitting device comprising:

a substrate;

a plurality of LED chips positioned around a center of a primary surface of the substrate;

a resin frame made of resin that has light reflectivity, formed on the primary surface of said substrate and provided annularly so as to surround a mounting area in which said plurality of LED chips are provided;

an anode-side electrode land and a cathode-side electrode land which are electrodes to be connected to an external voltage supply of said light emitting device, the anode-side electrode land and the cathode-side electrode land being provided outside said resin frame and near peripheral end of the primary surface of the substrate;

an electrode wiring pattern formed on the primary surface of said substrate including (i) an anode pattern extending from said anode-side electrode land to a portion under said resin frame and (ii) a cathode pattern extending from said cathode-side electrode land to the other portion under said resin frame, so as to electrically connect the plurality of LED chips to the anode-side electrode land and the cathode-side electrode land; and

a plurality of first wires for connecting the LED chips among said plurality of LED chips to the electrode wiring pattern, a portion of each of the plurality of first wires that is contacted with the electrode wiring pattern being covered by said resin frame.

2. The light emitting device of claim 1, wherein said substrate has a rectangular outer shape in a top view.

3. The light emitting device as set forth in claim 2, wherein the cathode-side electrode land is provided near a corner of the primary surface of the substrate, and the corner is diagonally opposite a corner where the anode-side electrode land is provided.

4. The light emitting device as set forth in claim 2, wherein the anode-side electrode land and the cathode-side electrode land are disposed diagonally on the primary surface of the substrate.

5. The light emitting device as set forth in claim 1, further comprising:

a plurality of second wires for electrically connecting the plurality of LED chips with each other, and

a fluorescent-material-containing resin layer provided attaching to an inner side of the resin frame and covering the plurality of LED chips and the second wires.

6. The light emitting device as set forth in claim 5, wherein the fluorescent-material-containing resin layer is provided along a shape of the resin frame so as to have a circular shape in the top view.

7. The light emitting device of claim 1, wherein each of said anode-side electrode land and said cathode-side electrode land has a width larger than that of said electrode wiring pattern.

8. The light emitting device of claim 1, wherein said substrate comprises ceramic, and said plurality of LED chips are attached to the primary surface of said substrate via a resin adhesive agent comprising silicone.

9. The light emitting device of claim 1, further comprising protection films provided on the anode and cathode patterns.

10. The light emitting device of claim 1, wherein said anode pattern further extends to the mounting area.

11. The light emitting device of claim 1, wherein said cathode pattern further extends to the mounting area.

12. A light emitting device comprising:

a substrate;

a plurality of LED chips positioned around a center of a primary surface of the substrate;

a resin frame made of resin that has light reflectivity, formed on the primary surface of said substrate and provided annularly so as to surround a mounting area in which said plurality of LED chips are provided;

an anode-side electrode land and a cathode-side electrode land which are electrodes to be connected to an external voltage supply of said light emitting device, the anode-side electrode land and the cathode-side electrode land being provided outside said resin frame and near peripheral end of the primary surface of the substrate;

an electrode wiring pattern formed on the primary surface of said substrate including (i) a first anode pattern provided on a portion under said resin frame and (ii) a first cathode pattern provided on the other portion under said resin frame, the first anode pattern and the first cathode pattern electrically connecting the plurality of LED chips to the anode-side electrode land and the cathode-side electrode land;

a plurality of first wires for connecting first chips among the plurality of LED chips to the first anode pattern, a portion of each of the plurality of first wires that is contacted with the first anode pattern being covered by the resin frame; and

a plurality of second wires for connecting second chips among the plurality of LED chips to the first cathode pattern, a portion of each of the plurality of second wires that is contacted with the first cathode pattern being covered by the resin frame.

13. The light emitting device as set forth in claim 12, wherein said substrate has a rectangular outer shape in a top view.

14. The light emitting device as set forth in claim 13, wherein the cathode-side electrode land is provided near a corner of the primary surface of the substrate, and the corner is diagonally opposite a corner where the anode-side electrode land is provided.

15. The light emitting device as set forth in claim 13, wherein the anode-side electrode land and the cathode-side electrode land are disposed diagonally on the primary surface of the substrate.

16. The light emitting device as set forth in claim 12, further comprising:

a plurality of third wires for electrically connecting the plurality of LED chips with each other, and

a fluorescent-material-containing resin layer provided attaching to an inner side of the resin frame and covering the plurality of LED chips and the third wires.

17. The light emitting device as set forth in claim 16, wherein the fluorescent-material-containing resin layer is provided along a shape of the resin frame so as to have a circular shape in the top view.

18. The light emitting device of claim 12, wherein said anode-side electrode land has a width larger than that of the first anode pattern, and said cathode-side electrode land has a width larger than that of the first cathode pattern.

19. The light emitting device of claim 12, wherein said substrate comprises ceramic, and said plurality of LED chips are attached to the primary surface of said substrate via a resin adhesive agent comprising silicone.

20. The light emitting device of claim 12, wherein the electrode wiring pattern further includes (iii) a second anode pattern connected between said anode-side electrode land and the first anode pattern and (iv) a second cathode pattern connected between said cathode-side electrode land and the first cathode pattern.

21. The light emitting device of claim 20, further comprising protection films provided on the second anode and cathode patterns.