Display apparatus having sealing portion and fabrication method thereof
First Claim
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1. A method of fabricating a sealing portion of a display apparatus, the method comprising:
- irradiating a laser beam at a deposition target spaced apart from a deposition substrate to form a sputtered deposition material,forming the sealing portion by depositing the sputtered deposition material on the deposition substrate comprising one of a substrate and an encapsulation, the sealing portion formed at an edge at which the substrate and the encapsulation face each other, wherein a display unit is formed on the substrate, and the encapsulation is for sealing the substrate;
bonding the substrate and the encapsulation to each other;
hardening the sealing portion; and
monitoring the sealing portion, wherein the sealing portion is formed through a low temperature process of 40°
C. or less.
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Abstract
A display apparatus includes a sealing portion. A method for fabricating the sealing portion includes: irradiating a pulse laser beam onto a deposition target to form the sealing portion at an edge where a substrate and an encapsulation face each, wherein a display unit is formed on the substrate, and the encapsulation is configured to seal the substrate; bonding the substrate and the encapsulation to each other; hardening the sealing portion; and monitoring the sealing portion. Thus, structural strength of the sealing portion is improved.
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Citations
10 Claims
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1. A method of fabricating a sealing portion of a display apparatus, the method comprising:
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irradiating a laser beam at a deposition target spaced apart from a deposition substrate to form a sputtered deposition material, forming the sealing portion by depositing the sputtered deposition material on the deposition substrate comprising one of a substrate and an encapsulation, the sealing portion formed at an edge at which the substrate and the encapsulation face each other, wherein a display unit is formed on the substrate, and the encapsulation is for sealing the substrate; bonding the substrate and the encapsulation to each other; hardening the sealing portion; and monitoring the sealing portion, wherein the sealing portion is formed through a low temperature process of 40°
C. or less. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification